Claims
- 1. A device, comprising:
a circuit; a lead having a first end connected to said circuit and having a second end; a deformable structure connected to said second end of said lead.
- 2. The device of claim 1, wherein said circuit is an integrated circuit.
- 3. The device of claim 2, wherein said circuit is a memory device.
- 4. The device of claim 2, wherein said circuit is selected from a group comprising a dynamic memory device and a static memory device.
- 5. The device of claim 1, wherein said device includes a plurality of leads.
- 6. The device of claim 5, wherein the device includes a plurality of deformable structures, and each of said plurality of deformable structures is connected to one of said plurality of leads.
- 7. The device of claim 5, wherein said deformable structure is connected to said plurality of leads.
- 8. The device of claim 1, wherein said deformable structure is formed from a material selected from a group comprising polymers and elastomers.
- 9. The device of claim 1, wherein said deformable structure is resilient.
- 10. The device of claim 1, wherein said deformable structure is connected to a plurality of leads.
- 11. The device of claim 1, wherein said deformable structure is a conductor.
- 12. The device of claim 1, wherein said deformable structure is a dielectric.
- 13. The device of claim 1, wherein said deformable structure is an adhesive.
- 14. The device of claim 1, further comprising an adhesive between said lead and said deformable structure.
- 15. The device of claim 1, further comprising a conductor connected to both said lead and said deformable structure.
- 16. The device of claim 15, wherein said conductor is in a form of tape and includes an adhesive.
- 17. A circuit board, comprising;
a substrate; and a deformable structure connected to said substrate.
- 18. The circuit of claim 17, further comprising a device including a circuit and a lead, said lead having a first end connected to said circuit and having a second end connected to said deformable structure.
- 19. The circuit board of claim 18, wherein said circuit board includes a plurality of devices.
- 20. The circuit board of claim 19, wherein said deformable structure is connected to said plurality of devices.
- 21. The circuit board of claim 17, wherein said circuit board includes a plurality of deformable structures.
- 22. The circuit board of claim 17, further comprising an adhesive between said lead and said deformable structure.
- 23. The circuit board of claim 17, further comprising a conductor connected to said deformable structure.
- 24. A device, comprising:
a circuit having an active side and a non-active side; a package enclosing the active side of said circuit and not enclosing a portion of the non-active side of said circuit; a lead having a first end connected to the active side of said circuit via a lead-over-chip connection, and having a second end extending from said package.
- 25. The device of claim 24, wherein said circuit has an edge and said package is connected to the edge of said circuit.
- 26. The device of claim 24, wherein said circuit has a plurality of edges and said package is connected to at least one of the edges of said circuit.
- 27. The device of claim 24, wherein said second end of said lead is L-shaped.
- 28. A device, comprising:
a circuit; a lead formed from a flexible conductor, said lead having a first end connected to said circuit.
- 29. A device, comprising:
a circuit; a package enclosing said circuit; a lead formed from a flexible conductor and an adhesive, said lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of co-pending U.S. patent application Ser. No. 09/205,796, filed Dec. 4, 1998.
Continuations (1)
|
Number |
Date |
Country |
Parent |
09205796 |
Dec 1998 |
US |
Child |
10301990 |
Nov 2002 |
US |