Jackson Chung Peng KONG

Person

Tanjung Tokong, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer structures and methods for 2.5D and 3D packaging
- Patent number 11,955,431
- Issue date Apr 9, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with flexible portion
- Patent number 11,942,412
- Issue date Mar 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated vertical interconnects for high-speed applications and...
- Patent number 11,887,917
- Issue date Jan 30, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with conductive element having cavities...
- Patent number 11,887,940
- Issue date Jan 30, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional foldable substrate with vertical side interface
- Patent number 11,758,662
- Issue date Sep 12, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded reference layers for semiconductor package substrates
- Patent number 11,676,910
- Issue date Jun 13, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 11,652,026
- Issue date May 16, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 11,639,623
- Issue date May 2, 2023
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Semiconductor miniaturization through component placement on steppe...
- Patent number 11,574,877
- Issue date Feb 7, 2023
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame-array interconnects for integrated-circuit packages
- Patent number 11,562,954
- Issue date Jan 24, 2023
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method of forming the same
- Patent number 11,562,963
- Issue date Jan 24, 2023
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench reference planes for integrated-circuit die packages
- Patent number 11,557,552
- Issue date Jan 17, 2023
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-component placement in multiple-damascene printed wiring bo...
- Patent number 11,540,395
- Issue date Dec 27, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped interposer for stacked chip package
- Patent number 11,527,479
- Issue date Dec 13, 2022
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with extended frame
- Patent number 11,527,467
- Issue date Dec 13, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with flyover bridge
- Patent number 11,527,481
- Issue date Dec 13, 2022
- Intel Corporation
- Choong Kooi Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical shield for stacked heterogeneous device integration
- Patent number 11,527,485
- Issue date Dec 13, 2022
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid ball grid array package for high speed interconnects
- Patent number 11,527,463
- Issue date Dec 13, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bridge die-to-die interconnects for integrated-circuit pa...
- Patent number 11,521,932
- Issue date Dec 6, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded power delivery interconnect module for improved Imax and pow...
- Patent number 11,508,660
- Issue date Nov 22, 2022
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for hybrid interconnect geometry
- Patent number 11,508,650
- Issue date Nov 22, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and system
- Patent number 11,482,481
- Issue date Oct 25, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level components for integrated-circuit packages
- Patent number 11,476,198
- Issue date Oct 18, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor system, and method of forming...
- Patent number 11,462,468
- Issue date Oct 4, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cores for warpage control
- Patent number 11,462,488
- Issue date Oct 4, 2022
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overhang bridge interconnect
- Patent number 11,430,764
- Issue date Aug 30, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked through-silicon vias for multi-device packages
- Patent number 11,398,415
- Issue date Jul 26, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 11,393,741
- Issue date Jul 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
- Publication number 20240145365
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
- Publication number 20240145368
- Publication date May 2, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY
- Publication number 20240145450
- Publication date May 2, 2024
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240136269
- Publication date Apr 25, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING UNIVERSAL CORE MOTHERBOARD WITH FLEXIBLE INPUT-OUTPUT PORTS
- Publication number 20240104043
- Publication date Mar 28, 2024
- Intel Corporation
- Shailendra Singh Chauhan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20240071934
- Publication date Feb 29, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING...
- Publication number 20240071856
- Publication date Feb 29, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER
- Publication number 20240006341
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20240008177
- Publication date Jan 4, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
- Publication number 20240006786
- Publication date Jan 4, 2024
- Intel Corporation
- Howe Yin LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...
- Publication number 20240006324
- Publication date Jan 4, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...
- Publication number 20240006376
- Publication date Jan 4, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ORIENTATION DISPLAY DEVICE
- Publication number 20230409084
- Publication date Dec 21, 2023
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20230361003
- Publication date Nov 9, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20230253295
- Publication date Aug 10, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY
- Publication number 20230187368
- Publication date Jun 15, 2023
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES
- Publication number 20230163101
- Publication date May 25, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL
- Publication number 20230124098
- Publication date Apr 20, 2023
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)
- Publication number 20230120513
- Publication date Apr 20, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
- Publication number 20230113084
- Publication date Apr 13, 2023
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION
- Publication number 20230112520
- Publication date Apr 13, 2023
- Intel Corporation
- Yee Lun ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS BRIDGES FOR MULTI-CHIP PACKAGES
- Publication number 20230065380
- Publication date Mar 2, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PA...
- Publication number 20230048835
- Publication date Feb 16, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH RECESSED MEMORY
- Publication number 20220406753
- Publication date Dec 22, 2022
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
- Publication number 20220392835
- Publication date Dec 8, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE
- Publication number 20220369460
- Publication date Nov 17, 2022
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACK...
- Publication number 20220302033
- Publication date Sep 22, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES
- Publication number 20220278084
- Publication date Sep 1, 2022
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20220157694
- Publication date May 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Jackson Chung Peng KONG

Person

Patents Grantslast 30 patents

Interposer structures and methods for 2.5D and 3D packaging

Interposer with flexible portion

Encapsulated vertical interconnects for high-speed applications and...

Integrated circuit packages with conductive element having cavities...

Substrate with gradiated dielectric for reducing impedance mismatch

Devices and methods for signal integrity protection technique

Three dimensional foldable substrate with vertical side interface

Embedded reference layers for semiconductor package substrates

Micro through-silicon via for transistor density scaling

Micro-hinge for an electronic device

Semiconductor miniaturization through component placement on steppe...

Frame-array interconnects for integrated-circuit packages

Stacked semiconductor package and method of forming the same

3D trench reference planes for integrated-circuit die packages

Stacked-component placement in multiple-damascene printed wiring bo...

Stepped interposer for stacked chip package

Multi-chip package with extended frame

Stacked semiconductor package with flyover bridge

Electrical shield for stacked heterogeneous device integration

Hybrid ball grid array package for high speed interconnects

Composite bridge die-to-die interconnects for integrated-circuit pa...

Molded power delivery interconnect module for improved Imax and pow...

Interposer for hybrid interconnect geometry

Semiconductor device and system

Multi-level components for integrated-circuit packages

Semiconductor package, semiconductor system, and method of forming...

Substrate cores for warpage control

Overhang bridge interconnect

Stacked through-silicon vias for multi-device packages

Micro through-silicon via for transistor density scaling

Patents Applicationslast 30 patents

ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME

ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...

PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

ENABLING UNIVERSAL CORE MOTHERBOARD WITH FLEXIBLE INPUT-OUTPUT PORTS

COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY

ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING...

SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES

SEMICONDUCTOR PACKAGES FOR STACKED MEMORY-ON-PACKAGE (SMOP) AND MET...

SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...

MULTI-ORIENTATION DISPLAY DEVICE

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY

SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES

SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL

FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)

VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE

RECESSED VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION

INTERCONNECTS BRIDGES FOR MULTI-CHIP PACKAGES

COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PA...

MULTI-CHIP PACKAGE WITH RECESSED MEMORY

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE

MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACK...

MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING