Jackson Hsieh

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an image sensor
- Patent number 7,250,324
- Issue date Jul 31, 2007
- Kingpak Technology Inc.
- Jackson Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Small memory card
- Patent number 7,126,219
- Issue date Oct 24, 2006
- Kingpak Technology Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked small memory card
- Patent number 6,910,637
- Issue date Jun 28, 2005
- Kingpak Technologies Inc.
- Jackson Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor having an improved transparent layer
- Patent number 6,906,397
- Issue date Jun 14, 2005
- Kingpak Technology Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded image sensor and a method for manufacturing the same
- Patent number 6,878,917
- Issue date Apr 12, 2005
- Kingpak Technology, Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having shortened wires
- Patent number 6,747,261
- Issue date Jun 8, 2004
- Kingpak Technology Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of an image sensor
- Patent number 6,680,525
- Issue date Jan 20, 2004
- Kingpak Technology Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded image sensor and a method for manufacturing the same
- Patent number 6,649,834
- Issue date Nov 18, 2003
- Kingpak Technology Inc.
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor package
- Publication number 20050098865
- Publication date May 12, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20050098709
- Publication date May 12, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20050098710
- Publication date May 12, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SMALL MEMORY CARD
- Publication number 20050077362
- Publication date Apr 14, 2005
- Jackson Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Small memory card
- Publication number 20050078457
- Publication date Apr 14, 2005
- Jackson Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Small memory card
- Publication number 20050077607
- Publication date Apr 14, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor having an improved transparent layer
- Publication number 20050012170
- Publication date Jan 20, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate structure for an integrated circuit package and method fo...
- Publication number 20050012207
- Publication date Jan 20, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module and method for manufacturing the same
- Publication number 20050012024
- Publication date Jan 20, 2005
- Jackson Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor and method for packaging the same
- Publication number 20050012027
- Publication date Jan 20, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor and method for packaging the same
- Publication number 20050012025
- Publication date Jan 20, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor and method for packaging the same
- Publication number 20050012026
- Publication date Jan 20, 2005
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate structure for a photosensitive chip package
- Publication number 20040245589
- Publication date Dec 9, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20040245590
- Publication date Dec 9, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory card capable of indicating an inserting direction
- Publication number 20040245620
- Publication date Dec 9, 2004
- Jackson Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding capillary for an image sensor
- Publication number 20040211814
- Publication date Oct 28, 2004
- Jackson Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image sensor having a rough contact surface
- Publication number 20040211882
- Publication date Oct 28, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for removing an image sensor from a printed circuit board
- Publication number 20040211815
- Publication date Oct 28, 2004
- Jackson Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing an image sensor
- Publication number 20040179126
- Publication date Sep 16, 2004
- Jackson Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Simplified image sensor module
- Publication number 20040179243
- Publication date Sep 16, 2004
- Jackson Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor having improved functions
- Publication number 20040178335
- Publication date Sep 16, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simplified image sensor module
- Publication number 20040179249
- Publication date Sep 16, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simplified image sensor module
- Publication number 20040150062
- Publication date Aug 5, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor having a frame layer formed with a venthole
- Publication number 20040150975
- Publication date Aug 5, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Injection-molded structure of an image sensor and method for manufa...
- Publication number 20040149898
- Publication date Aug 5, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging an injection-molded image sensor
- Publication number 20040148772
- Publication date Aug 5, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor with improved sensor effects
- Publication number 20040140419
- Publication date Jul 22, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor capable of radiating heat rapidly
- Publication number 20040119862
- Publication date Jun 24, 2004
- Jackson Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor package without a frame layer
- Publication number 20040113286
- Publication date Jun 17, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Injection molded image sensor and a method for manufacturing the same
- Publication number 20040113049
- Publication date Jun 17, 2004
- Jackson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Jackson Hsieh

Person

Patents Grantslast 30 patents

Method for manufacturing an image sensor

Small memory card

Stacked small memory card

Image sensor having an improved transparent layer

Injection molded image sensor and a method for manufacturing the same

Image sensor having shortened wires

Stacked structure of an image sensor

Injection molded image sensor and a method for manufacturing the same

Patents Applicationslast 30 patents

Image sensor package

Image sensor package

Image sensor package

STACKED SMALL MEMORY CARD

Small memory card

Small memory card

Image sensor having an improved transparent layer

Substrate structure for an integrated circuit package and method fo...

Image sensor module and method for manufacturing the same

Image sensor and method for packaging the same

Image sensor and method for packaging the same

Image sensor and method for packaging the same

Substrate structure for a photosensitive chip package

Image sensor package

Memory card capable of indicating an inserting direction

Wire bonding capillary for an image sensor

Image sensor having a rough contact surface

Apparatus for removing an image sensor from a printed circuit board

Method for manufacturing an image sensor

Simplified image sensor module

Image sensor having improved functions

Simplified image sensor module

Simplified image sensor module

Image sensor having a frame layer formed with a venthole

Injection-molded structure of an image sensor and method for manufa...

Method for packaging an injection-molded image sensor

Image sensor with improved sensor effects

Image sensor capable of radiating heat rapidly

Image sensor package without a frame layer

Injection molded image sensor and a method for manufacturing the same