Patent Application
20050012027
1. Field of the Invention
The invention relates to an image sensor and a method for packaging the same, and more particularly to an image sensor and a method for packaging the same with increased product reliability and facilitated packaging processes.
2. Description of the Related Art
Referring to
However, the above-mentioned structure has the following drawbacks.
1. Since the metal sheets 12 are bent to form the first boards 14 and second boards 16 at different levels, the formed first boards 14 may be uneven. Therefore, the wires 24 cannot be conveniently bonded to the metal sheets 12, and the yield may be influenced.
2. Since the thickness of each of the second boards 16 of the metal sheets 12 is thinner (because each metal sheet 12 with greater thickness cannot be pressed during the manufacturing processes), the solder tin cannot climb to the lateral side of each metal sheet 12 during the SMT process. Therefore, the package body cannot be mounted to the printed circuit board with great stability.
An object of the invention is to provide an image sensor with increased thickness of the combined metal sheets, and a method for packaging the same with improved package reliability.
Another object of the invention is to provide an image sensor and a method for packaging the same, wherein the solder tin may climb higher during the SMT process and the image sensor may be mounted to the printed circuit board with great stability.
Still another object of the invention is to provide an image sensor and a method for packaging the same, wherein the wire bonding process may be easily performed and the product yield may be increased.
To achieve the above-mentioned objects, the invention provides an image sensor to be electrically connected to a printed circuit board. The image sensor includes a plurality of lower metal sheets arranged in an array, a plurality of upper metal sheets arranged in an array, an encapsulant for encapsulating the lower metal sheets and the upper metal sheets, a photosensitive chip, a plurality of wires, and a transparent layer. Each of the lower metal sheets has an upper surface and a lower surface. Each of the upper metal sheets has an upper surface and a lower surface. The lower surfaces of the upper metal sheets are stacked on the upper surfaces of the lower metal sheets. The upper surfaces of the upper metal sheets are exposed from the encapsulant, and the lower surfaces of the lower metal sheets are exposed from the encapsulant and electrically connected to the printed circuit board. The encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The photosensitive chip is arranged within the chamber. The wires electrically connect the photosensitive chip to the upper surfaces of the upper metal sheets. The transparent layer is arranged on the frame layer of the encapsulant to cover the photosensitive chip.
Referring to
Each lower metal sheet 30 has an upper surface 42 and a lower surface 44 mounted to a printed circuit board 58 via solder tin 60 in the SMT process.
Each upper metal sheet 32 has an upper surface 46 and a lower surface 48. A middle board 50 flush with the upper metal sheets 32 is arranged among the upper metal sheets 32. The lower surfaces 48 are stacked on the corresponding upper surfaces 42 of the lower metal sheets 30.
The encapsulant 34 encapsulates the lower metal sheets 30, the upper metal sheets 32 and the middle board 50 with the upper surfaces 46 of the upper metal sheets 32 and an upper surface of the middle board 50 exposed from the encapsulant 34 and with the lower surfaces 44 of the lower metal sheets 30 exposed from the encapsulant 34. A frame layer 54 is formed around the upper surfaces 46 of the upper metal sheets 32 to define a chamber 56 together with the upper metal sheets 32.
The photosensitive chip 36 is arranged on the middle board 50 and located within the chamber 56.
The plurality of wires 38 electrically connect the photosensitive chip 36 to the upper surfaces 46 of the upper metal sheets 32 so as to transfer signals from the photosensitive chip 36 to the upper metal sheets 32.
The transparent layer 40 is a piece of transparent glass arranged on the frame layer 54 of the encapsulant 34 to cover the photosensitive chip 36. Thus, the photosensitive chip 36 may receive optical signals passing through the transparent layer 40.
Referring to
Referring to
The invention has the following advantages.
1. Since the upper and lower metal sheets 32 and 30 are formed from two flat boards, better smoothness may be obtained. Consequently, the wire bonding process may be easily performed, and the package yield of the product may be improved.
2. Since the combination of the upper and lower metal sheets 32 and 30 is thicker, the solder tin 60 may climb to the upper metal sheets 32 from the lower metal sheets 30 during the SMT process for mounting the image sensor to the printed circuit board 58. Therefore, the package body can be mounted to the printed circuit board 58 with great stability.
While the invention has been described by way of examples and in terms of preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
