Jae Hak Yee

Person

Mansion, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable multi-chip package system
- Patent number 9,202,776
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with molded strip protrusion
- Patent number 8,937,372
- Issue date Jan 20, 2015
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with L-shaped leadfingers
- Patent number 8,471,374
- Issue date Jun 25, 2013
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system
- Patent number 8,432,026
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system with support structure
- Patent number 7,645,638
- Issue date Jan 12, 2010
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for package stacking and manufact...
- Patent number 7,622,333
- Issue date Nov 24, 2009
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,953,988
- Issue date Oct 11, 2005
- Amkor Technology, Inc.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane for exposed package
- Patent number 6,876,069
- Issue date Apr 5, 2005
- ST Assembly Test Services PTE LTD
- Jefferey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked chips with aligned input/ou...
- Patent number 6,759,737
- Issue date Jul 6, 2004
- Amkor Technology, Inc.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of trimming and singulating leaded semiconductor packages
- Patent number 6,686,258
- Issue date Feb 3, 2004
- ST Assembly Test Services Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End grid array semiconductor package
- Patent number 6,677,663
- Issue date Jan 13, 2004
- Amkor Technology, Inc.
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin and heat radiant semiconductor package and method for manufact...
- Patent number 6,646,339
- Issue date Nov 11, 2003
- Amkor Technology, Inc.
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane for exposed package
- Patent number 6,630,373
- Issue date Oct 7, 2003
- ST Assembly Test Service Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor package and mold for molding the same
- Patent number 6,627,976
- Issue date Sep 30, 2003
- Amkor Technology, Inc.
- Young Suk Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package leadframe assembly and method of manufacture
- Patent number 6,555,899
- Issue date Apr 29, 2003
- Amkor Technology, Inc.
- Young Suk Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having increased moisture path and increased s...
- Patent number 6,525,406
- Issue date Feb 25, 2003
- Amkor Technology, Inc.
- Young Suk Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded semiconductor packages and method of trimming and singulatin...
- Patent number 6,483,177
- Issue date Nov 19, 2002
- ST Assembly Test Services Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION
- Publication number 20080230883
- Publication date Sep 25, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM
- Publication number 20080029867
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM
- Publication number 20080029868
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Koo Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
- Publication number 20080029866
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM
- Publication number 20070278643
- Publication date Dec 6, 2007
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS
- Publication number 20070194463
- Publication date Aug 23, 2007
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20050062148
- Publication date Mar 24, 2005
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground plane for exposed package
- Publication number 20040070055
- Publication date Apr 15, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin and heat radiant semiconductor package and method for manufact...
- Publication number 20040061217
- Publication date Apr 1, 2004
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND PLANE FOR EXPOSED PACKAGE
- Publication number 20030160309
- Publication date Aug 28, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leaded semiconductor packages and method of trimming such packages
- Publication number 20030011006
- Publication date Jan 16, 2003
- ST Assembly Test Services Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20020020907
- Publication date Feb 21, 2002
- Amkor Technology, Inc.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS

Jae Hak Yee

Person

Patents Grantslast 30 patents

Stackable multi-chip package system

Integrated circuit package system with molded strip protrusion

Integrated circuit package system with L-shaped leadfingers

Stackable multi-chip package system

Stackable multi-chip package system with support structure

Integrated circuit package system for package stacking and manufact...

Semiconductor package

Ground plane for exposed package

Semiconductor package including stacked chips with aligned input/ou...

Method of trimming and singulating leaded semiconductor packages

End grid array semiconductor package

Thin and heat radiant semiconductor package and method for manufact...

Ground plane for exposed package

Leadframe for semiconductor package and mold for molding the same

Semiconductor package leadframe assembly and method of manufacture

Semiconductor device having increased moisture path and increased s...

Leaded semiconductor packages and method of trimming and singulatin...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION

STACKABLE MULTI-CHIP PACKAGE SYSTEM

STACKABLE MULTI-CHIP PACKAGE SYSTEM

STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE

STACKABLE MULTI-CHIP PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS

Semiconductor package

Ground plane for exposed package

Thin and heat radiant semiconductor package and method for manufact...

GROUND PLANE FOR EXPOSED PACKAGE

Leaded semiconductor packages and method of trimming such packages

Semiconductor package