James E. KOHL

Person

Reading, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a circuit structure
- Patent number 8,590,145
- Issue date Nov 26, 2013
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated thermal structures and fabrication methods thereof facil...
- Patent number 8,564,119
- Issue date Oct 22, 2013
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding two structures together with an adhesive line of...
- Patent number 8,533,941
- Issue date Sep 17, 2013
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a base layer circuit structure
- Patent number 8,474,133
- Issue date Jul 2, 2013
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated conductive structures and fabrication methods thereof fa...
- Patent number 8,384,199
- Issue date Feb 26, 2013
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated conductive structures and fabrication methods thereof fa...
- Patent number 8,324,020
- Issue date Dec 4, 2012
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable circuit structures and methods of fabrication thereof
- Patent number 8,169,065
- Issue date May 1, 2012
- EPIC Technologies, Inc.
- James E. Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of fabrication thereof with fan-o...
- Patent number 7,868,445
- Issue date Jan 11, 2011
- EPIC Technologies, Inc.
- James E. Kohl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged electronic modules and fabrication methods thereof impleme...
- Patent number 7,863,090
- Issue date Jan 4, 2011
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated thermal structures and fabrication methods thereof facil...
- Patent number 7,830,000
- Issue date Nov 9, 2010
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated structures and fabrication methods thereof implementing...
- Patent number 7,619,901
- Issue date Nov 17, 2009
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant, solderable input/output bump structures
- Patent number 6,818,544
- Issue date Nov 16, 2004
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant, solderable input/output bump structures
- Patent number 6,555,908
- Issue date Apr 29, 2003
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structures and methods employing a low modulus h...
- Patent number 6,426,545
- Issue date Jul 30, 2002
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal connection structures and methods
- Patent number 6,396,148
- Issue date May 28, 2002
- EPIC Technologies, Inc.
- Charles W. Eichelberger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE
- Publication number 20130185935
- Publication date Jul 25, 2013
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBEGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE CIRCUIT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20110147911
- Publication date Jun 23, 2011
- EPIC TECHNOLOGIES, INC.
- James E. Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONDUCTIVE STRUCTURES AND FABRICATION METHODS THEREOF FA...
- Publication number 20100047970
- Publication date Feb 25, 2010
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED THERMAL STRUCTURES AND FABRICATION METHODS THEREOF FACIL...
- Publication number 20100044855
- Publication date Feb 25, 2010
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING A CIRCUIT STRUCTURE WITH A STRENGTHENING STR...
- Publication number 20100035384
- Publication date Feb 11, 2010
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE
- Publication number 20100031500
- Publication date Feb 11, 2010
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING TWO STRUCTURES TOGETHER WITH AN ADHESIVE LINE OF...
- Publication number 20100032091
- Publication date Feb 11, 2010
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CONDUCTIVE STRUCTURES AND FABRICATION METHODS THEREOF FA...
- Publication number 20080315375
- Publication date Dec 25, 2008
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED THERMAL STRUCTURES AND FABRICATION METHODS THEREOF FACIL...
- Publication number 20080315404
- Publication date Dec 25, 2008
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED STRUCTURES AND FABRICATION METHODS THEREOF IMPLEMENTING...
- Publication number 20080316714
- Publication date Dec 25, 2008
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED ELECTRONIC MODULES AND FABRICATION METHODS THEREOF IMPLEME...
- Publication number 20080315377
- Publication date Dec 25, 2008
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBERGER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED STRUCTURES AND METHODS OF FABRICATION THEREOF WITH FAN-O...
- Publication number 20080315391
- Publication date Dec 25, 2008
- EPIC TECHNOLOGIES, INC.
- James E. KOHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant, solderable input/output bump structures
- Publication number 20030201534
- Publication date Oct 30, 2003
- EPIC TECHNOLOGIES, INC.
- Charles W. Eichelberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James E. KOHL

Person

Patents Grantslast 30 patents

Method of fabricating a circuit structure

Integrated thermal structures and fabrication methods thereof facil...

Method of bonding two structures together with an adhesive line of...

Method of fabricating a base layer circuit structure

Integrated conductive structures and fabrication methods thereof fa...

Integrated conductive structures and fabrication methods thereof fa...

Stackable circuit structures and methods of fabrication thereof

Integrated structures and methods of fabrication thereof with fan-o...

Packaged electronic modules and fabrication methods thereof impleme...

Integrated thermal structures and fabrication methods thereof facil...

Integrated structures and fabrication methods thereof implementing...

Compliant, solderable input/output bump structures

Compliant, solderable input/output bump structures

Integrated circuit structures and methods employing a low modulus h...

Electroless metal connection structures and methods

Patents Applicationslast 30 patents

METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE

STACKABLE CIRCUIT STRUCTURES AND METHODS OF FABRICATION THEREOF

INTEGRATED CONDUCTIVE STRUCTURES AND FABRICATION METHODS THEREOF FA...

INTEGRATED THERMAL STRUCTURES AND FABRICATION METHODS THEREOF FACIL...

METHODS OF FABRICATING A CIRCUIT STRUCTURE WITH A STRENGTHENING STR...

METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE

METHOD OF BONDING TWO STRUCTURES TOGETHER WITH AN ADHESIVE LINE OF...

INTEGRATED CONDUCTIVE STRUCTURES AND FABRICATION METHODS THEREOF FA...

INTEGRATED THERMAL STRUCTURES AND FABRICATION METHODS THEREOF FACIL...

INTEGRATED STRUCTURES AND FABRICATION METHODS THEREOF IMPLEMENTING...

PACKAGED ELECTRONIC MODULES AND FABRICATION METHODS THEREOF IMPLEME...

INTEGRATED STRUCTURES AND METHODS OF FABRICATION THEREOF WITH FAN-O...

Compliant, solderable input/output bump structures