James J. Murphy

Person

People

Patents Grantslast 30 patents

Information Patent Grant
Methods related to power semiconductor devices with thick bottom ox...
- Patent number 8,936,985
- Issue date Jan 20, 2015
- Fairchild Semiconductor Corporation
- Ashok Challa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,624,393
- Issue date Jan 7, 2014
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 8,598,035
- Issue date Dec 3, 2013
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 8,343,852
- Issue date Jan 1, 2013
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 8,329,508
- Issue date Dec 11, 2012
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded gate trench FET with an inter-electrode dielectric having...
- Patent number 8,329,538
- Issue date Dec 11, 2012
- Fairchild Semiconductor Corporation
- James Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio trench structures with void-free fill material
- Patent number 8,198,196
- Issue date Jun 12, 2012
- Fairchild Semiconductor Corporation
- James J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,158,506
- Issue date Apr 17, 2012
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming a salicide on the gate electrode o...
- Patent number 8,143,125
- Issue date Mar 27, 2012
- Fairchild Semiconductor Corporation
- Robert J. Purtell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making power semiconductor devices with thick bottom oxi...
- Patent number 8,143,124
- Issue date Mar 27, 2012
- Fairchild Semiconductor Corporation
- Ashok Challa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor devices and methods for making the same
- Patent number 8,129,778
- Issue date Mar 6, 2012
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die structures for wafer-level chipscale packaging of...
- Patent number 8,058,732
- Issue date Nov 15, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 7,960,800
- Issue date Jun 14, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio trench structures with void-free fill material
- Patent number 7,956,411
- Issue date Jun 7, 2011
- Fairchild Semiconductor Corporation
- James J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 7,951,688
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded gate trench FET with an inter-electrode dielectric having...
- Patent number 7,936,009
- Issue date May 3, 2011
- Fairchild Semiconductor Corporation
- James Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 7,768,075
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dice by grind for back surface metallized dies
- Patent number 7,655,539
- Issue date Feb 2, 2010
- Fairchild Semiconductor Corporation
- Craig Hendricks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned trench MOSFETs and methods for making the same
- Patent number 7,078,296
- Issue date Jul 18, 2006
- Fairchild Semiconductor Corporation
- Duc Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating thick oxide on the bottom surface of a trench s...
- Patent number 6,861,296
- Issue date Mar 1, 2005
- Fairchild Semiconductor Corporation
- Henry W. Hurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective oxide deposition in the bottom of a trench
- Patent number 6,444,528
- Issue date Sep 3, 2002
- Fairchild Semiconductor Corporation
- James J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating thick oxide on the bottom surface of a trench s...
- Patent number 6,437,386
- Issue date Aug 20, 2002
- Fairchild Semiconductor Corporation
- Henry W. Hurst
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MAKING POWER SEMICONDUCTOR DEVICES WITH THICK BOTTOM OXI...
- Publication number 20120220091
- Publication date Aug 30, 2012
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods and Designs for Localized Wafer Thinning
- Publication number 20120168947
- Publication date Jul 5, 2012
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL
- Publication number 20120142155
- Publication date Jun 7, 2012
- JAMES J. MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Gate Trench FET with an Inter-electrode Dielectric Having...
- Publication number 20110244641
- Publication date Oct 6, 2011
- James Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...
- Publication number 20110230046
- Publication date Sep 22, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES
- Publication number 20110201179
- Publication date Aug 18, 2011
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Making the Same
- Publication number 20110127601
- Publication date Jun 2, 2011
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
- Publication number 20110031596
- Publication date Feb 10, 2011
- Mike D. Gruenhagen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
- Publication number 20110006409
- Publication date Jan 13, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
- Publication number 20100267200
- Publication date Oct 21, 2010
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Forming a Salicide on the Gate Electrode o...
- Publication number 20100244126
- Publication date Sep 30, 2010
- Robert J. Purtell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dice with Backside Trenches Filled With Elastic Mater...
- Publication number 20100148325
- Publication date Jun 17, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...
- Publication number 20100123225
- Publication date May 20, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE BY GRIND FOR BACK SURFACE METALLIZED DIES
- Publication number 20100081257
- Publication date Apr 1, 2010
- Craig W. Hendricks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL
- Publication number 20100044785
- Publication date Feb 25, 2010
- JAMES J. MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Forming a Shielded Gate Trench FET with an...
- Publication number 20100006928
- Publication date Jan 14, 2010
- James Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING
- Publication number 20090273082
- Publication date Nov 5, 2009
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE BY GRIND FOR BACK SURFACE METALLIZED DIES
- Publication number 20090261388
- Publication date Oct 22, 2009
- Craig Hendricks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Dividing a Substrate into Individual Devices
- Publication number 20090181520
- Publication date Jul 16, 2009
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trenched Shield Gate Power Semiconductor Devices and Methods of Man...
- Publication number 20080150020
- Publication date Jun 26, 2008
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods of Making Power Semiconductor Devices with Thick Bottom Oxi...
- Publication number 20080138953
- Publication date Jun 12, 2008
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power Semiconductor Devices Having Termination Structures and Metho...
- Publication number 20080135931
- Publication date Jun 12, 2008
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor die packages using thin dies and metal substrates
- Publication number 20070235886
- Publication date Oct 11, 2007
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor devices and methods of manufacture
- Publication number 20060214221
- Publication date Sep 28, 2006
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power semiconductor devices and methods of manufacture
- Publication number 20060214222
- Publication date Sep 28, 2006
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power semiconductor devices and methods of manufacture
- Publication number 20050167742
- Publication date Aug 4, 2005
- Fairchild Semiconductor Corp.
- Ashok Challa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Self-aligned trench mosfets and methods for making the same
- Publication number 20030132480
- Publication date Jul 17, 2003
- Duc Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating thick oxide on the bottom surface of a trench s...
- Publication number 20020153557
- Publication date Oct 24, 2002
- Fairchild Semiconductor Corporation
- Henry W. Hurst
- H01 - BASIC ELECTRIC ELEMENTS

James J. Murphy

Person

Patents Grantslast 30 patents

Methods related to power semiconductor devices with thick bottom ox...

Methods and designs for localized wafer thinning

Semiconductor dice with backside trenches filled with elastic mater...

Method and structure for dividing a substrate into individual devices

Semiconductor die packages using thin dies and metal substrates

Shielded gate trench FET with an inter-electrode dielectric having...

High aspect ratio trench structures with void-free fill material

Methods and designs for localized wafer thinning

Structure and method for forming a salicide on the gate electrode o...

Methods of making power semiconductor devices with thick bottom oxi...

Semiconductor devices and methods for making the same

Semiconductor die structures for wafer-level chipscale packaging of...

Semiconductor dice with backside trenches filled with elastic mater...

High aspect ratio trench structures with void-free fill material

Method and structure for dividing a substrate into individual devices

Shielded gate trench FET with an inter-electrode dielectric having...

Semiconductor die packages using thin dies and metal substrates

Dice by grind for back surface metallized dies

Self-aligned trench MOSFETs and methods for making the same

Method for creating thick oxide on the bottom surface of a trench s...

Selective oxide deposition in the bottom of a trench

Method for creating thick oxide on the bottom surface of a trench s...

Patents Applicationslast 30 patents

METHODS OF MAKING POWER SEMICONDUCTOR DEVICES WITH THICK BOTTOM OXI...

Methods and Designs for Localized Wafer Thinning

HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL

Shielded Gate Trench FET with an Inter-electrode Dielectric Having...

SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...

METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES

Semiconductor Devices and Methods for Making the Same

NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES

Structure and Method for Forming a Salicide on the Gate Electrode o...

Semiconductor Dice with Backside Trenches Filled With Elastic Mater...

Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...

DICE BY GRIND FOR BACK SURFACE METALLIZED DIES

HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL

Structure and Method for Forming a Shielded Gate Trench FET with an...

METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING

DICE BY GRIND FOR BACK SURFACE METALLIZED DIES

Method and Structure for Dividing a Substrate into Individual Devices

Trenched Shield Gate Power Semiconductor Devices and Methods of Man...

Methods of Making Power Semiconductor Devices with Thick Bottom Oxi...

Power Semiconductor Devices Having Termination Structures and Metho...

Semiconductor die packages using thin dies and metal substrates

Power semiconductor devices and methods of manufacture

Power semiconductor devices and methods of manufacture

Power semiconductor devices and methods of manufacture

Self-aligned trench mosfets and methods for making the same

Method for creating thick oxide on the bottom surface of a trench s...