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Jeng-Da Wu

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip package structure
    • Patent number 8,154,125
    • Issue date Apr 10, 2012
    • Advanced Semiconductor Engineering, Inc.
    • Jeng Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure
    • Patent number 7,633,169
    • Issue date Dec 15, 2009
    • Advanced Semiconductor Engineering Inc.
    • Jeng-Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip packaging process
    • Patent number 7,482,204
    • Issue date Jan 27, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Chin-Li Kao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Process for fabricating chip package structure
    • Patent number 7,407,833
    • Issue date Aug 5, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Jeng Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure and chip packaging process
    • Patent number 7,335,982
    • Issue date Feb 26, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Chin-Li Kao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure and process for fabricating the same
    • Patent number 7,199,479
    • Issue date Apr 3, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Jeng Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 7,042,078
    • Issue date May 9, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Jeng Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip package with thermometer
    • Patent number 6,972,489
    • Issue date Dec 6, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Jeng Da Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Under-bump-metallurgy layer for improving adhesion
    • Patent number 6,891,274
    • Issue date May 10, 2005
    • Advanced Semiconductor Engineering, Inc.
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump and fabricating process thereof
    • Patent number 6,864,168
    • Issue date Mar 8, 2005
    • Advanced Semiconductor Engineering, Inc.
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Under-ball-metallurgy layer
    • Patent number 6,819,002
    • Issue date Nov 16, 2004
    • Advanced Semiconductor Engineering, Inc.
    • William Tze-You Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents