Jeremy D. Ecton

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass interposer optical switching device and method
- Patent number 12,353,070
- Issue date Jul 8, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Glass interposer optical resonator device and method
- Patent number 12,306,480
- Issue date May 20, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled inductor with small form factor
- Patent number 12,224,103
- Issue date Feb 11, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step isotropic etch patterning of thick copper layers for for...
- Patent number 12,191,161
- Issue date Jan 7, 2025
- Intel Corporation
- Oladeji Fadayomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with nanoislands on conductive plates
- Patent number 11,855,125
- Issue date Dec 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures having tapered profiles for embedded interconnect br...
- Patent number 11,721,631
- Issue date Aug 8, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
- Patent number 11,721,650
- Issue date Aug 8, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
- Patent number 11,694,898
- Issue date Jul 4, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-trace structures
- Patent number 11,652,036
- Issue date May 16, 2023
- Santa Clara
- Jeremy Ecton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Sandwich-molded cores for high-inductance architectures
- Patent number 11,622,448
- Issue date Apr 4, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of dual metallization layers
- Patent number 11,569,160
- Issue date Jan 31, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system for providing etched metallization struct...
- Patent number 11,528,811
- Issue date Dec 13, 2022
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ component fabrication of a highly efficient, high inductanc...
- Patent number 11,404,389
- Issue date Aug 2, 2022
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures having tapered profiles for embedded interconnect br...
- Patent number 11,373,951
- Issue date Jun 28, 2022
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system for providing etched metallization struct...
- Patent number 11,116,084
- Issue date Sep 7, 2021
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,081,768
- Issue date Aug 3, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 10,923,443
- Issue date Feb 16, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
- Publication number 20250218905
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
- Publication number 20250218915
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
- Publication number 20250218961
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES
- Publication number 20250218898
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES
- Publication number 20250218965
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...
- Publication number 20250201787
- Publication date Jun 19, 2025
- Intel Corporation
- Marcel M. Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...
- Publication number 20250201732
- Publication date Jun 19, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149421
- Publication date May 8, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149455
- Publication date May 8, 2025
- Intel Corporation
- Nicholas Haehn
- H01 - BASIC ELECTRIC ELEMENTS

Jeremy D. Ecton

Person

Patents Grantslast 30 patents

Omni directional interconnect with magnetic fillers in mold matrix

Glass interposer optical switching device and method

Glass interposer optical resonator device and method

Airgap structures for high speed signal integrity

Electronic substrate having an embedded etch stop to control cavity...

Angled inductor with small form factor

Multi-step isotropic etch patterning of thick copper layers for for...

Structural elements for application specific electronic device pack...

Selectively roughened copper architectures for low insertion loss c...

Conductive route patterning for electronic substrates

Subtractive etch resolution implementing a functional thin metal re...

Microelectronic assemblies having conductive structures with differ...

Capacitors with nanoislands on conductive plates

Conductive route patterning for electronic substrates

Method for forming embedded grounding planes on interconnect layers

Via structures having tapered profiles for embedded interconnect br...

Method for fabricating multiplexed hollow waveguides of variable ty...

Hybrid fine line spacing architecture for bump pitch scaling

Ultra-thin dielectric films using photo up-conversion for applicati...

Electronic device package including a capacitor

Via-trace structures

Sandwich-molded cores for high-inductance architectures

Fabricating an RF filter on a semiconductor package using selective...

Patterning of dual metallization layers

Method, device and system for providing etched metallization struct...

In-situ component fabrication of a highly efficient, high inductanc...

Via structures having tapered profiles for embedded interconnect br...

Method, device and system for providing etched metallization struct...

Fabricating an RF filter on a semiconductor package using selective...

Electronic device package including a capacitor

Patents Applicationslast 30 patents

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

Technologies for Components Embedded in a Substrate Core

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...

RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

SPACER FOR EMBEDDED COMPONENT IN CORE

SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...

MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...