Jian Wen Lo

Person

Banciao City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,552,553
- Issue date Oct 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip having a metal pillar structure
- Patent number 8,334,594
- Issue date Dec 18, 2012
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 8,288,853
- Issue date Oct 16, 2012
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,741,152
- Issue date Jun 22, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,642,132
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,528,053
- Issue date May 5, 2009
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,446,404
- Issue date Nov 4, 2008
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure
- Patent number 7,151,317
- Issue date Dec 19, 2006
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device
- Publication number 20110084389
- Publication date Apr 14, 2011
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Having A Metal Pillar Structure
- Publication number 20110084381
- Publication date Apr 14, 2011
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Package and Method of Making the Same
- Publication number 20100052136
- Publication date Mar 4, 2010
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172986
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172983
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172982
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172984
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172985
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer redistribution structure with metallic pillar and method for...
- Publication number 20070111499
- Publication date May 17, 2007
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME
- Publication number 20070102829
- Publication date May 10, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Jian-Wen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
- Publication number 20060199306
- Publication date Sep 7, 2006
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND WAFER STRUCTURE
- Publication number 20060197191
- Publication date Sep 7, 2006
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer structure, chip structure, and fabricating process thereof
- Publication number 20060134884
- Publication date Jun 22, 2006
- Advanced Semiconductor Engineering, Inc.
- Jian Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE
- Publication number 20050199991
- Publication date Sep 15, 2005
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level transparent packaging
- Publication number 20050095750
- Publication date May 5, 2005
- Advanced Semiconductor Engineering, Inc.
- Jian-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS

Jian Wen Lo

Person

Patents Grantslast 30 patents

Semiconductor device

Chip having a metal pillar structure

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Multi-chip package structure

Patents Applicationslast 30 patents

Semiconductor Device

Chip Having A Metal Pillar Structure

Three-Dimensional Package and Method of Making the Same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Wafer redistribution structure with metallic pillar and method for...

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

CHIP STRUCTURE AND WAFER STRUCTURE

Wafer structure, chip structure, and fabricating process thereof

MULTI-CHIP PACKAGE STRUCTURE

Wafer level transparent packaging