Three-dimensional package and method of making the same

Abstract

The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package structure comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first metal, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, a second metal and a second space. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole. The lower end of the second conductive layer extends below the surface of the second wafer and contacts the upper end of the first solder. The second metal is disposed in the second hole and is electrically connected to the second pad via the second conductive layer. The second space is disposed on the second metal in the second hole.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic view of the three-dimensional package before reflow disclosed in U.S. Pat. No. 4,499,655;

FIG. 2 shows a schematic view of the three-dimensional package after reflow disclosed in U.S. Pat. No. 4,499,655;

FIG. 3 shows a schematic flow chart of the method for making a three-dimensional package according to the first embodiment of the present invention;

FIGS. 4 to 17 show the schematic views of each step of the method for making a three-dimensional package according to the first embodiment of the present invention;

FIG. 18 shows a schematic flow chart of the method for making a three-dimensional package according to the second embodiment of the present invention;

FIGS. 19 to 20 show the schematic views of a part of the steps of the method for making a three-dimensional package according to the second embodiment of the present invention; and

FIG. 21 shows a cross-sectional view of the three-dimensional package according to the present invention.

Claims

1. A three-dimensional package, comprising: a first unit, comprising: a first wafer, having a first surface and a second surface, wherein the first surface has at least one first pad and a first protection layer exposing the first pad;at least one first hole, penetrating the first wafer;a first isolation layer, disposed on the side wall of the first hole;a first conductive layer, covering the first pad, a part of the first protection layer, and the first isolation layer, wherein the lower end of the first conductive layer extends below the second surface of the first wafer;a first metal, disposed in the first hole and electrically connected to the first pad via the first conductive layer; anda first solder, disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal; anda second unit stacked on the first unit, comprising: a second wafer, having a first surface and a second surface, wherein the first surface has at least one second pad and a second protection layer exposing the second pad;at least one second hole, penetrating the second wafer;a second isolation layer, disposed on the side wall of the second hole;a second conductive layer, covering the second pad, a part of the second protection layer, and the second isolation layer, wherein the lower end of the second conductive layer extends below the second surface of the second wafer and contacts the upper end of the first solder;a second metal, disposed in the second hole and electrically connected to the second pad via the second conductive layer; anda second space, disposed on the second metal in the second hole.

2. The three-dimensional package according to claim 1, wherein the wafer is a wafer.

3. The three-dimensional package according to claim 1, wherein the wafer is a chip.

4. The three-dimensional package according to claim 1, wherein the first hole penetrates the first pad.

5. The three-dimensional package according to claim 1, wherein the second hole penetrates the second pad.

6. The three-dimensional package according to claim 1, wherein the first unit further comprises a first barrier layer covering the lower end of the first conductive layer.

7. The three-dimensional package according to claim 1, wherein the second unit further comprises a second barrier layer covering the lower end of the second conductive layer.

8. The three-dimensional package according to claim 1, further comprising at least one solder ball disposed at the lower end of the first conductive layer.