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Jichen Wu
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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Multiple chips image sensor package
Patent number
7,345,360
Issue date
Mar 18, 2008
Kingpak Technology Inc.
Jichen Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method for manufacturing an image sensor
Patent number
7,250,324
Issue date
Jul 31, 2007
Kingpak Technology Inc.
Jackson Hsieh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Small memory card
Patent number
7,126,219
Issue date
Oct 24, 2006
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked small memory card
Patent number
6,910,637
Issue date
Jun 28, 2005
Kingpak Technologies Inc.
Jackson Hsieh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Image sensor having an improved transparent layer
Patent number
6,906,397
Issue date
Jun 14, 2005
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Injection molded image sensor and a method for manufacturing the same
Patent number
6,878,917
Issue date
Apr 12, 2005
Kingpak Technology, Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor module
Patent number
6,870,208
Issue date
Mar 22, 2005
Kingpak Technology Inc.
Irving You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor having shortened wires
Patent number
6,747,261
Issue date
Jun 8, 2004
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging structure of image sensor and method for packaging the same
Patent number
6,737,720
Issue date
May 18, 2004
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked structure of an image sensor
Patent number
6,680,525
Issue date
Jan 20, 2004
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Injection molded image sensor and a method for manufacturing the same
Patent number
6,649,834
Issue date
Nov 18, 2003
Kingpak Technology Inc.
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure of an image sensor and packaging
Patent number
6,646,316
Issue date
Nov 11, 2003
Kingpak Technology, Inc.
Jichen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a package structure of integrated circuits
Patent number
6,642,137
Issue date
Nov 4, 2003
Kingpak Technology Inc.
Nai Hua Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package structure of image sensor
Patent number
6,627,983
Issue date
Sep 30, 2003
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for a photosensitive chip
Patent number
6,590,269
Issue date
Jul 8, 2003
Kingpak Technology Inc.
Jason Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package structure of image sensor
Patent number
6,559,539
Issue date
May 6, 2003
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked structure of an image sensor and method for manufacturing t...
Patent number
6,521,881
Issue date
Feb 18, 2003
Kingpak Technology Inc.
Hsiu Wen Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure for an integrated circuit package and method fo...
Patent number
6,489,572
Issue date
Dec 3, 2002
Kingpak Technology Inc.
Mon Nan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of stacked integrated circuits
Patent number
6,441,496
Issue date
Aug 27, 2002
Wen Chuan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked structure of semiconductor means and method for manufacturi...
Patent number
6,400,007
Issue date
Jun 4, 2002
Kingpak Technology Inc.
Jichen Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Image sensor module and method for manufacturing the same
Publication number
20050117046
Publication date
Jun 2, 2005
Jichen Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Image sensor package
Publication number
20050098865
Publication date
May 12, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor module
Publication number
20050099659
Publication date
May 12, 2005
Jichen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor package
Publication number
20050098709
Publication date
May 12, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor package
Publication number
20050098710
Publication date
May 12, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple chips image sensor package
Publication number
20050099531
Publication date
May 12, 2005
Jichen Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
STACKED SMALL MEMORY CARD
Publication number
20050077362
Publication date
Apr 14, 2005
Jackson Hsieh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Small memory card
Publication number
20050078457
Publication date
Apr 14, 2005
Jackson Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Small memory card
Publication number
20050077607
Publication date
Apr 14, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR MODULE
Publication number
20050062083
Publication date
Mar 24, 2005
Irving You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor having an improved transparent layer
Publication number
20050012170
Publication date
Jan 20, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate structure for an integrated circuit package and method fo...
Publication number
20050012207
Publication date
Jan 20, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor module and method for manufacturing the same
Publication number
20050012024
Publication date
Jan 20, 2005
Jackson Hsieh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Image sensor and method for packaging the same
Publication number
20050012027
Publication date
Jan 20, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor and method for packaging the same
Publication number
20050012025
Publication date
Jan 20, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor and method for packaging the same
Publication number
20050012026
Publication date
Jan 20, 2005
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package structure of an image sensor module
Publication number
20040251510
Publication date
Dec 16, 2004
Irving You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate structure for a photosensitive chip package
Publication number
20040245589
Publication date
Dec 9, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor package
Publication number
20040245590
Publication date
Dec 9, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Memory card capable of indicating an inserting direction
Publication number
20040245620
Publication date
Dec 9, 2004
Jackson Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire bonding capillary for an image sensor
Publication number
20040211814
Publication date
Oct 28, 2004
Jackson Hsieh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Image sensor having a rough contact surface
Publication number
20040211882
Publication date
Oct 28, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing an image sensor
Publication number
20040179126
Publication date
Sep 16, 2004
Jackson Hsieh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Simplified image sensor module
Publication number
20040179243
Publication date
Sep 16, 2004
Jackson Hsieh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Image sensor having improved functions
Publication number
20040178335
Publication date
Sep 16, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Simplified image sensor module
Publication number
20040179249
Publication date
Sep 16, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Simplified image sensor module
Publication number
20040150062
Publication date
Aug 5, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Image sensor having a frame layer formed with a venthole
Publication number
20040150975
Publication date
Aug 5, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Injection-molded structure of an image sensor and method for manufa...
Publication number
20040149898
Publication date
Aug 5, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for packaging an injection-molded image sensor
Publication number
20040148772
Publication date
Aug 5, 2004
Jackson Hsieh
H01 - BASIC ELECTRIC ELEMENTS