Jick Yu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for depositing a layer on a substrate using surface energy...
- Patent number 9,217,197
- Issue date Dec 22, 2015
- Applied Materials, Inc.
- Jick M. Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming layers on a substrate
- Patent number 8,993,434
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Jick M. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for segregating the alloying elements and reducing the resid...
- Patent number 8,852,674
- Issue date Oct 7, 2014
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu surface plasma treatment to improve gapfill window
- Patent number 8,764,961
- Issue date Jul 1, 2014
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma treatment of substrates prior to deposition
- Patent number 8,580,354
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering chamber having auxiliary backside magnet to improve etch...
- Patent number 8,557,094
- Issue date Oct 15, 2013
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving electromigration lifetime of copper interconne...
- Patent number 8,349,724
- Issue date Jan 8, 2013
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD tantalum nitride for copper metallization
- Patent number 8,324,095
- Issue date Dec 4, 2012
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for selective growth of films during ECP plating
- Patent number 8,119,525
- Issue date Feb 21, 2012
- Applied Materials, Inc.
- Jick M. Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Remote plasma source for pre-treatment of substrates prior to depos...
- Patent number 8,021,514
- Issue date Sep 20, 2011
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective ruthenium deposition on copper materials
- Patent number 7,737,028
- Issue date Jun 15, 2010
- Applied Materials, Inc.
- Rongjun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Remote plasma pre-clean with low hydrogen pressure
- Patent number 7,704,887
- Issue date Apr 27, 2010
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidized barrier layer
- Patent number 7,659,204
- Issue date Feb 9, 2010
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for integration of barrier layer and seed layer
- Patent number 7,494,908
- Issue date Feb 24, 2009
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of barrier layer and seed layer
- Patent number 7,352,048
- Issue date Apr 1, 2008
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter deposition and etching of metallization seed layer for over...
- Patent number 7,294,574
- Issue date Nov 13, 2007
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of copper dewetting by transition metal deposition
- Patent number 7,265,048
- Issue date Sep 4, 2007
- Applied Materials, Inc.
- Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of ALD tantalum nitride for copper metallization
- Patent number 7,049,226
- Issue date May 23, 2006
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of barrier layer and seed layer
- Patent number 6,936,906
- Issue date Aug 30, 2005
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Partially filling copper seed layer
- Patent number 6,899,796
- Issue date May 31, 2005
- Applied Materials, Inc.
- Wei D. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for forming a barrier layer on a substrate
- Patent number 6,887,786
- Issue date May 3, 2005
- Applied Materials, Inc.
- Hong Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion enhanced ion plating for copper fill
- Patent number 6,884,329
- Issue date Apr 26, 2005
- Applied Materials, Inc.
- Wei D. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
- Publication number 20140374907
- Publication date Dec 25, 2014
- Jick M. YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES
- Publication number 20130341794
- Publication date Dec 26, 2013
- Applied Materials, Inc.
- Jick M. YU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method For Segregating The Alloying Elements And Reducing The Resid...
- Publication number 20120121799
- Publication date May 17, 2012
- Applied Materials, Inc.
- XINYU FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LAYERS ON A SUBSTRATE
- Publication number 20120070982
- Publication date Mar 22, 2012
- Applied Materials, Inc.
- JICK M. YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment of substrates prior to deposition
- Publication number 20110300720
- Publication date Dec 8, 2011
- Applied Materials, Inc.
- Xinyu FU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING A LAYER ON A SUBSTRATE USING SURFACE ENERGY...
- Publication number 20110209982
- Publication date Sep 1, 2011
- Applied Materials, Inc.
- JICK M. YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR IMPROVING ELECTROMIGRATION LIFETIME OF COPPER INTERCONNE...
- Publication number 20100167526
- Publication date Jul 1, 2010
- Applied Materials, Inc.
- XINYU FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR NITRIDATION PRETREATMENT
- Publication number 20100099251
- Publication date Apr 22, 2010
- APPLIED MATERIALS, INC.
- XINYU FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW
- Publication number 20100096273
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION
- Publication number 20100075494
- Publication date Mar 25, 2010
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR SELECTIVE GROWTH OF FILMS DURING ECP PLATING
- Publication number 20090215264
- Publication date Aug 27, 2009
- Jick M. Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS
- Publication number 20090087982
- Publication date Apr 2, 2009
- APPLIED MATERIALS, INC.
- RONGJUN WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Remote Plasma Source for Pre-Treatment of Substrates Prior to Depos...
- Publication number 20090017227
- Publication date Jan 15, 2009
- Applied Materials, Inc.
- Xinyu FU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxidized Barrier Layer
- Publication number 20080237029
- Publication date Oct 2, 2008
- Applied Materials, Inc.
- Xianmin TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESPUTTERED COPPER SEED LAYER
- Publication number 20080190760
- Publication date Aug 14, 2008
- Applied Materials, Inc.
- XIANMIN TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch...
- Publication number 20080083610
- Publication date Apr 10, 2008
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR INTEGRATION OF BARRIER LAYER AND SEED LAYER
- Publication number 20070283886
- Publication date Dec 13, 2007
- HUA CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch and sidewall selectivity in plasma sputtering
- Publication number 20070209925
- Publication date Sep 13, 2007
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Remote plasma pre-clean with low hydrogen pressure
- Publication number 20070117397
- Publication date May 24, 2007
- Applied Materials, Inc.
- Xinyu Fu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Integrated process for sputter deposition of a conductive barrier l...
- Publication number 20070059502
- Publication date Mar 15, 2007
- Applied Materials, Inc.
- Rongjun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Simultaneous ion milling and sputter deposition
- Publication number 20070051622
- Publication date Mar 8, 2007
- APPLIED MATERIALS, INC.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conductive barrier layer, especially an alloy of ruthenium and tant...
- Publication number 20060251872
- Publication date Nov 9, 2006
- Jenn Yue Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduction of copper dewetting by transition metal deposition
- Publication number 20060199372
- Publication date Sep 7, 2006
- APPLIED MATERIALS, INC.
- Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of ALD tantalum nitride for copper metallization
- Publication number 20060148253
- Publication date Jul 6, 2006
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputter deposition and etching of metallization seed layer for over...
- Publication number 20060030151
- Publication date Feb 9, 2006
- APPLIED MATERIALS, INC.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for forming a barrier layer on a substrate
- Publication number 20050252765
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Hong Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming a barrier layer on a substrate
- Publication number 20050189217
- Publication date Sep 1, 2005
- APPLIED MATERIALS, INC.
- Hong Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration of barrier layer and seed layer
- Publication number 20050139948
- Publication date Jun 30, 2005
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration of ALD tantalum nitride for copper metallization
- Publication number 20050106865
- Publication date May 19, 2005
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oblique ion milling of via metallization
- Publication number 20040222082
- Publication date Nov 11, 2004
- APPLIED MATERIALS, INC.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Methods for depositing a layer on a substrate using surface energy...

Methods for forming layers on a substrate

Method for segregating the alloying elements and reducing the resid...

Cu surface plasma treatment to improve gapfill window

Plasma treatment of substrates prior to deposition

Sputtering chamber having auxiliary backside magnet to improve etch...

Method for improving electromigration lifetime of copper interconne...

Integration of ALD tantalum nitride for copper metallization

Process for selective growth of films during ECP plating

Remote plasma source for pre-treatment of substrates prior to depos...

Selective ruthenium deposition on copper materials

Remote plasma pre-clean with low hydrogen pressure

Oxidized barrier layer

Apparatus for integration of barrier layer and seed layer

Integration of barrier layer and seed layer

Sputter deposition and etching of metallization seed layer for over...

Reduction of copper dewetting by transition metal deposition

Integration of ALD tantalum nitride for copper metallization

Integration of barrier layer and seed layer

Partially filling copper seed layer

Method and apparatus for forming a barrier layer on a substrate

Diffusion enhanced ion plating for copper fill

Patents Applicationslast 30 patents

ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES

ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES

Method For Segregating The Alloying Elements And Reducing The Resid...

METHODS FOR FORMING LAYERS ON A SUBSTRATE

Plasma treatment of substrates prior to deposition

METHODS FOR DEPOSITING A LAYER ON A SUBSTRATE USING SURFACE ENERGY...

METHOD FOR IMPROVING ELECTROMIGRATION LIFETIME OF COPPER INTERCONNE...

METHOD FOR NITRIDATION PRETREATMENT

CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW

INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION

PROCESS FOR SELECTIVE GROWTH OF FILMS DURING ECP PLATING

SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS

Remote Plasma Source for Pre-Treatment of Substrates Prior to Depos...

Oxidized Barrier Layer

RESPUTTERED COPPER SEED LAYER

Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch...

APPARATUS FOR INTEGRATION OF BARRIER LAYER AND SEED LAYER

Etch and sidewall selectivity in plasma sputtering

Remote plasma pre-clean with low hydrogen pressure

Integrated process for sputter deposition of a conductive barrier l...

Simultaneous ion milling and sputter deposition

Conductive barrier layer, especially an alloy of ruthenium and tant...

Reduction of copper dewetting by transition metal deposition

Integration of ALD tantalum nitride for copper metallization

Sputter deposition and etching of metallization seed layer for over...

Method and apparatus for forming a barrier layer on a substrate

Method and apparatus for forming a barrier layer on a substrate

Integration of barrier layer and seed layer

Integration of ALD tantalum nitride for copper metallization

Oblique ion milling of via metallization