Jin YANG

Person

San Jose, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHODS FOR A MODULAR HYBRID BONDING PACKAGE ARCHITECTURE
- Publication number 20250201795
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE
- Publication number 20250201669
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...
- Publication number 20250192121
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jin SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC
- Publication number 20250125311
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE
- Publication number 20250118720
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A METAL INTERFACE ARCHITECTURE
- Publication number 20250112157
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...
- Publication number 20250015018
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...
- Publication number 20250014985
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

SYSTEM AND METHODS FOR A MODULAR HYBRID BONDING PACKAGE ARCHITECTURE

SYSTEM AND METHODS FOR A LIQUID COOLING PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

SEMICONDUCTOR PACKAGES WITH STACKED MEMORY AND LOGIC

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

SYSTEM AND METHODS FOR A METAL INTERFACE ARCHITECTURE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...