Jocel Gomez

Person

Lapu-Lapu City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip MLP with folded heat sink
- Patent number 8,119,457
- Issue date Feb 21, 2012
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self locking and aligning clip structure for semiconductor die package
- Patent number 8,067,273
- Issue date Nov 29, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self locking and aligning clip structure for semiconductor die package
- Patent number 7,902,657
- Issue date Mar 8, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flex chip connector for semiconductor device
- Patent number 7,824,966
- Issue date Nov 2, 2010
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including heat sinks
- Patent number 7,737,548
- Issue date Jun 15, 2010
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex clip connector for semiconductor device
- Patent number 7,626,249
- Issue date Dec 1, 2009
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR
- Publication number 20110095410
- Publication date Apr 28, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR DEVICE TERMINAL
- Publication number 20110095417
- Publication date Apr 28, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE
- Publication number 20110076807
- Publication date Mar 31, 2011
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MLP WITH FOLDED HEAT SINK
- Publication number 20110003432
- Publication date Jan 6, 2011
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS
- Publication number 20100267206
- Publication date Oct 21, 2010
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flex Chip Connector For Semiconductor Device
- Publication number 20090311832
- Publication date Dec 17, 2009
- Maria Clemens Y. Quiñones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20090294985
- Publication date Dec 3, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY
- Publication number 20090261462
- Publication date Oct 22, 2009
- Jocel Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE ASSEMBLY
- Publication number 20090194856
- Publication date Aug 6, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE
- Publication number 20090179313
- Publication date Jul 16, 2009
- Maria Clemens Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Terminal Package Assembly For Semiconductor Devices
- Publication number 20090127677
- Publication date May 21, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back to Back Die Assembly For Semiconductor Devices
- Publication number 20090127676
- Publication date May 21, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS
- Publication number 20090057878
- Publication date Mar 5, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE
- Publication number 20090057854
- Publication date Mar 5, 2009
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MLP WITH FOLDED HEAT SINK
- Publication number 20070267728
- Publication date Nov 22, 2007
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS

Jocel Gomez

Person

Patents Grantslast 30 patents

Flip chip MLP with folded heat sink

Self locking and aligning clip structure for semiconductor die package

Self locking and aligning clip structure for semiconductor die package

Flex chip connector for semiconductor device

Semiconductor die package including heat sinks

Flex clip connector for semiconductor device

Patents Applicationslast 30 patents

WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR

LEADLESS SEMICONDUCTOR DEVICE TERMINAL

SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE

FLIP CHIP MLP WITH FOLDED HEAT SINK

SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS

Flex Chip Connector For Semiconductor Device

THIN CHIP SCALE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY

MOLDED PACKAGE ASSEMBLY

FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE

Multi-Terminal Package Assembly For Semiconductor Devices

Back to Back Die Assembly For Semiconductor Devices

SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS

SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE

FLIP CHIP MLP WITH FOLDED HEAT SINK