Jochen Kuhmann

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Construction element having cover plates and tube segments made of...
- Patent number 11,707,908
- Issue date Jul 25, 2023
- Jochen Kuhmann
- B32 - LAYERED PRODUCTS
Information Patent Grant
Pallet comprising folded wooden composite
- Patent number 11,001,411
- Issue date May 11, 2021
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen Kuhmann
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Pallet having panels and tube segments
- Patent number 10,974,866
- Issue date Apr 13, 2021
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen Kuhmann
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Grant
Pallet having panels and tube segments
- Patent number 10,913,571
- Issue date Feb 9, 2021
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen Kuhmann
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Fabrication of compact opto-electronic component packages
- Patent number 8,852,969
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electronic device package with a semiconductor-based sub-mount...
- Patent number 8,729,591
- Issue date May 20, 2014
- TSMC Solid State Lighting Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based sub-mount for an opto-electronic device
- Patent number 8,309,973
- Issue date Nov 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of compact opto-electronic component packages
- Patent number 7,851,818
- Issue date Dec 14, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication for chip scale package for a micro component
- Patent number 7,419,853
- Issue date Sep 2, 2008
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly with self-alignment features to position a cover on a subs...
- Patent number 7,253,388
- Issue date Aug 7, 2007
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PALLET HAVING PANELS AND TUBE SEGMENTS
- Publication number 20190382159
- Publication date Dec 19, 2019
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen KUHMANN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PALLET COMPRISING FOLDED WOODEN COMPOSITE
- Publication number 20190375544
- Publication date Dec 12, 2019
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen KUHMANN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CONSTRUCTION ELEMENT HAVING COVER PLATES AND TUBE SEGMENTS MADE OF...
- Publication number 20190210316
- Publication date Jul 11, 2019
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen KUHMANN
- B32 - LAYERED PRODUCTS
Information Patent Application
PALLET HAVING PANELS AND TUBE SEGMENTS
- Publication number 20190177037
- Publication date Jun 13, 2019
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen KUHMANN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WEB, SANDWICH PLATE, SANDWICH BLOCK AND METHODS FOR PRODUCING SAME
- Publication number 20190001609
- Publication date Jan 3, 2019
- AIR BAMBOO INDUSTRIAL GMBH
- Jochen KUHMANN
- B32 - LAYERED PRODUCTS
Information Patent Application
FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
- Publication number 20110045618
- Publication date Feb 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...
- Publication number 20100210045
- Publication date Aug 19, 2010
- Hymite A/S
- Jochen F. Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Based Sub-Mount for an Opto-Electronic Device
- Publication number 20100200888
- Publication date Aug 12, 2010
- Hymite A/S
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
- Publication number 20090321760
- Publication date Dec 31, 2009
- Hymite A/S
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of Compact Semiconductor Packages
- Publication number 20090181500
- Publication date Jul 16, 2009
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip Scale Package For A Micro Component
- Publication number 20080315390
- Publication date Dec 25, 2008
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Small form factor camera module with lens barrel and image sensor
- Publication number 20070292127
- Publication date Dec 20, 2007
- Jochen Kuhmann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Sealed Package With Glass Window for Optoelectronic Components, and...
- Publication number 20070120041
- Publication date May 31, 2007
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package for a micro component
- Publication number 20070035001
- Publication date Feb 15, 2007
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Assembly with self-alignment features to position a cover on a subs...
- Publication number 20050236562
- Publication date Oct 27, 2005
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jochen Kuhmann

Person

Patents Grantslast 30 patents

Construction element having cover plates and tube segments made of...

Pallet comprising folded wooden composite

Pallet having panels and tube segments

Pallet having panels and tube segments

Fabrication of compact opto-electronic component packages

Opto-electronic device package with a semiconductor-based sub-mount...

Silicon-based sub-mount for an opto-electronic device

Fabrication of compact opto-electronic component packages

Method of fabrication for chip scale package for a micro component

Assembly with self-alignment features to position a cover on a subs...

Patents Applicationslast 30 patents

PALLET HAVING PANELS AND TUBE SEGMENTS

PALLET COMPRISING FOLDED WOODEN COMPOSITE

CONSTRUCTION ELEMENT HAVING COVER PLATES AND TUBE SEGMENTS MADE OF...

PALLET HAVING PANELS AND TUBE SEGMENTS

WEB, SANDWICH PLATE, SANDWICH BLOCK AND METHODS FOR PRODUCING SAME

FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES

OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...

Silicon-Based Sub-Mount for an Opto-Electronic Device

FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES

Fabrication of Compact Semiconductor Packages

Chip Scale Package For A Micro Component

Small form factor camera module with lens barrel and image sensor

Sealed Package With Glass Window for Optoelectronic Components, and...

Chip scale package for a micro component

Assembly with self-alignment features to position a cover on a subs...