Johanna Swan

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-filter die
- Patent number 12,155,372
- Issue date Nov 26, 2024
- Intel Corporation
- Georgios Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,119,291
- Issue date Oct 15, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 12,080,652
- Issue date Sep 3, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,057,402
- Issue date Aug 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radio frequency (RF) front-end module (FEM)
- Patent number 12,040,776
- Issue date Jul 16, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer structure and method of providing same
- Patent number 12,014,990
- Issue date Jun 18, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,984,439
- Issue date May 14, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,967,580
- Issue date Apr 23, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
- Patent number 11,933,555
- Issue date Mar 19, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,916,020
- Issue date Feb 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
- Patent number 11,916,006
- Issue date Feb 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,901,330
- Issue date Feb 13, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing for integrated circuit assembly connector su...
- Patent number 11,842,826
- Issue date Dec 12, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a modular side radiating waveguide...
- Patent number 11,830,831
- Issue date Nov 28, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
- Publication number 20240355750
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240339410
- Publication date Oct 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
- Publication number 20240274542
- Publication date Aug 15, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240274576
- Publication date Aug 15, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240258296
- Publication date Aug 1, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
- Publication number 20240213216
- Publication date Jun 27, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240136323
- Publication date Apr 25, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240128255
- Publication date Apr 18, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
- Publication number 20240063180
- Publication date Feb 22, 2024
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
- Publication number 20240063183
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
- Publication number 20240063072
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
- Publication number 20240063132
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063179
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240030150
- Publication date Jan 25, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240021534
- Publication date Jan 18, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230395518
- Publication date Dec 7, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230369236
- Publication date Nov 16, 2023
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
- Publication number 20230343716
- Publication date Oct 26, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
- Publication number 20230320021
- Publication date Oct 5, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
- Publication number 20230317549
- Publication date Oct 5, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS

Johanna Swan

Person

Patents Grantslast 30 patents

High-throughput additively manufactured power delivery vias and traces

Hermetic sealing structures in microelectronic assemblies having di...

Multi-filter die

Platforms including microelectronic packages therein coupled to a c...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Thermal management solutions for embedded integrated circuit devices

Carrier for microelectronic assemblies having direct bonding

Microelectronic assemblies

Hermetic sealing structures in microelectronic assemblies having di...

Multi-chip package and method of providing die-to-die interconnects...

Microelectronic assemblies

Power delivery structures

Microelectronic assemblies with communication networks

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Integrated radio frequency (RF) front-end module (FEM)

Composite interposer structure and method of providing same

Thermal management in integrated circuit packages

Direct bonding in microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies with communication networks

Heat dissipation device having anisotropic thermally conductive sec...

Microelectronic assemblies with communication networks

Microelectronic assemblies having an integrated voltage regulator c...

Microelectronic assemblies

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Semiconductor packaging with high density interconnects

Multi-chip package and method of providing die-to-die interconnects...

Additive manufacturing for integrated circuit assembly connector su...

Semiconductor package including a modular side radiating waveguide...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

QUASI-MONOLITHIC DIE ARCHITECTURES

MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...

LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS

QUASI-MONOLITHIC DIE ARCHITECTURES

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MICROELECTRONIC ASSEMBLIES

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS

PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...

POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...