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Johanna Swan
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Scottsdale, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,967,580
Issue date
Apr 23, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
Patent number
11,933,555
Issue date
Mar 19, 2024
Intel Corporation
Feras Eid
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,916,020
Issue date
Feb 27, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
Patent number
11,916,006
Issue date
Feb 27, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,901,330
Issue date
Feb 13, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
Patent number
11,894,324
Issue date
Feb 6, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging with high density interconnects
Patent number
11,881,457
Issue date
Jan 23, 2024
Tahoe Research, LTD.
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Additive manufacturing for integrated circuit assembly connector su...
Patent number
11,842,826
Issue date
Dec 12, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a modular side radiating waveguide...
Patent number
11,830,831
Issue date
Nov 28, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,830,787
Issue date
Nov 28, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions that reduce inductive coupling between...
Patent number
11,823,972
Issue date
Nov 21, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,791,277
Issue date
Oct 17, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,784,108
Issue date
Oct 10, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die backend diodes for electrostatic discharge (ESD) protection
Patent number
11,784,181
Issue date
Oct 10, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with a highly conductive layer deposited on die using throu...
Patent number
11,776,869
Issue date
Oct 3, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,769,751
Issue date
Sep 26, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,769,734
Issue date
Sep 26, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
Patent number
11,764,452
Issue date
Sep 19, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,756,943
Issue date
Sep 12, 2023
Intel Corporation
Shawna M. Liff
G02 - OPTICS
Information
Patent Grant
Microelectronic package electrostatic discharge (ESD) protection
Patent number
11,751,367
Issue date
Sep 5, 2023
Intel Corporation
Veronica Aleman Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
Patent number
11,749,628
Issue date
Sep 5, 2023
Intel Corporation
Adel A. Elsherbini
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Composite IC chips including a chiplet embedded within metallizatio...
Patent number
11,749,649
Issue date
Sep 5, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,749,642
Issue date
Sep 5, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide fan-out
Patent number
11,728,290
Issue date
Aug 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,721,649
Issue date
Aug 8, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
11,716,826
Issue date
Aug 1, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
Patent number
11,715,693
Issue date
Aug 1, 2023
Intel Corporation
Georgios Dogiamis
G02 - OPTICS
Information
Patent Grant
Microelectronic package with mold-integrated components
Patent number
11,694,962
Issue date
Jul 4, 2023
Intel Corporation
Georgios Dogiamis
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240136323
Publication date
Apr 25, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240128255
Publication date
Apr 18, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
Publication number
20240063147
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
Publication number
20240063180
Publication date
Feb 22, 2024
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240061194
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
G02 - OPTICS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063178
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
Publication number
20240063183
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
Publication number
20240063202
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
Publication number
20240063120
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
Publication number
20240063132
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
Publication number
20240063072
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240038671
Publication date
Feb 1, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240030150
Publication date
Jan 25, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240021534
Publication date
Jan 18, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20230395518
Publication date
Dec 7, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20230369236
Publication date
Nov 16, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Publication number
20230343716
Publication date
Oct 26, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
Publication number
20230320021
Publication date
Oct 5, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
Publication number
20230317660
Publication date
Oct 5, 2023
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
Publication number
20230317549
Publication date
Oct 5, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
Publication number
20230245972
Publication date
Aug 3, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SER...
Publication number
20230197676
Publication date
Jun 22, 2023
Intel Corporation
Gerald S. Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...
Publication number
20230187362
Publication date
Jun 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE
Publication number
20230187407
Publication date
Jun 15, 2023
Intel Corporation
Carleton L. Molnar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS
Publication number
20230178513
Publication date
Jun 8, 2023
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...
Publication number
20230170327
Publication date
Jun 1, 2023
Intel Corporation
Jin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20230133235
Publication date
May 4, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS