Johannes Groschopf

Person

Wainsdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming offset spacers for semiconductor device arrangem...
- Patent number 7,767,508
- Issue date Aug 3, 2010
- Advanced Micro Devices, Inc.
- Philip A. Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing polish-induced damage in a contact structure by...
- Patent number 7,528,059
- Issue date May 5, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using an aqueous solution and composition thereof
- Patent number 7,387,970
- Issue date Jun 17, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin E. Cooper
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a substrate contact in a field effect transistor...
- Patent number 6,720,242
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Gert Burbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of precipitation defects on copper interconnects during...
- Patent number 6,720,264
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Kashmir S. Sahota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming offset spacers for semiconductor device arrangem...
- Publication number 20080090368
- Publication date Apr 17, 2008
- Advanced Micro Devices, Inc.
- Philip A. Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench replacement gate process for transistors having elevated sou...
- Publication number 20080070356
- Publication date Mar 20, 2008
- Advanced Micro Devices, Inc.
- Laura A. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING POLISH-INDUCED DAMAGE IN A CONTACT STRUCTURE BY...
- Publication number 20070232063
- Publication date Oct 4, 2007
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING STRUCTURE FOR ENHANCED REMOVAL RATE DURING FIXED ABR...
- Publication number 20070049184
- Publication date Mar 1, 2007
- International Business Machines Corporation
- Rajasekhar Venigalla
- B24 - GRINDING POLISHING
Information Patent Application
Polishing technique to minimize abrasive removal of material and co...
- Publication number 20060223320
- Publication date Oct 5, 2006
- Kevin E. Cooper
- B24 - GRINDING POLISHING
Information Patent Application
Method of using an aqueous solution and composition thereof
- Publication number 20040224426
- Publication date Nov 11, 2004
- Kevin E. Cooper
- B24 - GRINDING POLISHING
Information Patent Application
PREVENTION OF PRECIPITATION DEFECTS ON COPPER INTERCONNECTS DURING...
- Publication number 20040014319
- Publication date Jan 22, 2004
- Kashmir S. Sahota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Apparatus and method for reducing oxidation of polished metal surfa...
- Publication number 20040009670
- Publication date Jan 15, 2004
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for reducing the chemical reactivity of water and...
- Publication number 20040000234
- Publication date Jan 1, 2004
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion barrier layer in semiconductor substrates to reduce coppe...
- Publication number 20030232466
- Publication date Dec 18, 2003
- Christian Zistl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a substrate contact in a field effect transistor...
- Publication number 20020055244
- Publication date May 9, 2002
- Gert Burbach
- H01 - BASIC ELECTRIC ELEMENTS

Johannes Groschopf

Person

Patents Grantslast 30 patents

Method for forming offset spacers for semiconductor device arrangem...

Method for reducing polish-induced damage in a contact structure by...

Method of using an aqueous solution and composition thereof

Method of forming a substrate contact in a field effect transistor...

Prevention of precipitation defects on copper interconnects during...

Patents Applicationslast 30 patents

Method for forming offset spacers for semiconductor device arrangem...

Trench replacement gate process for transistors having elevated sou...

METHOD FOR REDUCING POLISH-INDUCED DAMAGE IN A CONTACT STRUCTURE BY...

RETAINING RING STRUCTURE FOR ENHANCED REMOVAL RATE DURING FIXED ABR...

Polishing technique to minimize abrasive removal of material and co...

Method of using an aqueous solution and composition thereof

PREVENTION OF PRECIPITATION DEFECTS ON COPPER INTERCONNECTS DURING...

Apparatus and method for reducing oxidation of polished metal surfa...

System and method for reducing the chemical reactivity of water and...

Diffusion barrier layer in semiconductor substrates to reduce coppe...

Method of forming a substrate contact in a field effect transistor...