John Gardner Bloomsburgh

Person

Oakland, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sealed packaging for microelectromechanical systems
- Patent number 9,856,132
- Issue date Jan 2, 2018
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-die MEMS package
- Patent number 9,586,813
- Issue date Mar 7, 2017
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexure bearing to reduce quadrature for resonating micromachined d...
- Patent number 9,352,961
- Issue date May 31, 2016
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging to reduce stress on microelectromechanical systems
- Patent number 9,156,673
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-die MEMS package
- Patent number 9,095,072
- Issue date Jul 28, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS multi-axis accelerometer electrode structure
- Patent number 9,062,972
- Issue date Jun 23, 2015
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Through silicon via with reduced shunt capacitance
- Patent number 9,006,846
- Issue date Apr 14, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE MEMS PACKAGE
- Publication number 20150321904
- Publication date Nov 12, 2015
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS
- Publication number 20130341737
- Publication date Dec 26, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED D...
- Publication number 20130298671
- Publication date Nov 14, 2013
- Fairchild Semiconductor Corporation
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE
- Publication number 20130277773
- Publication date Oct 24, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS
- Publication number 20130270660
- Publication date Oct 17, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-DIE MEMS PACKAGE
- Publication number 20130250532
- Publication date Sep 26, 2013
- Fairchild Semiconductor Corporation
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MULTI-AXIS ACCELEROMETER ELECTRODE STRUCTURE
- Publication number 20130192369
- Publication date Aug 1, 2013
- Cenk Acar
- G01 - MEASURING TESTING

John Gardner Bloomsburgh

Person

Patents Grantslast 30 patents

Sealed packaging for microelectromechanical systems

Multi-die MEMS package

Flexure bearing to reduce quadrature for resonating micromachined d...

Packaging to reduce stress on microelectromechanical systems

Multi-die MEMS package

MEMS multi-axis accelerometer electrode structure

Through silicon via with reduced shunt capacitance

Patents Applicationslast 30 patents

MULTI-DIE MEMS PACKAGE

PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS

FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED D...

THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE

SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS

MULTI-DIE MEMS PACKAGE

MEMS MULTI-AXIS ACCELEROMETER ELECTRODE STRUCTURE