John L. Freeman Jr.

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 6,489,211
- Issue date Dec 3, 2002
- Motorola, Inc.
- John L. Freeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making
- Patent number 5,734,194
- Issue date Mar 31, 1998
- Motorola, Inc.
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for metallization of semiconductor devices
- Patent number 5,700,721
- Issue date Dec 23, 1997
- Motorola, Inc.
- Hank Hukyoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for metallization of semiconductor devices
- Patent number 5,554,889
- Issue date Sep 10, 1996
- Motorola, Inc.
- Hank H. Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar multi-layer metal bonding pad
- Patent number 5,287,002
- Issue date Feb 15, 1994
- Motorola, Inc.
- John L. Freeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a planar multi-layer metal bonding pad
- Patent number 5,149,674
- Issue date Sep 22, 1992
- Motorola, Inc.
- John L. Freeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple step metallization process
- Patent number 4,970,176
- Issue date Nov 13, 1990
- Motorola, Inc.
- Clarence J. Tracy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Residue-free plasma etch of high temperature AlCu
- Patent number 4,915,779
- Issue date Apr 10, 1990
- Motorola Inc.
- G. Scot Srodes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DAMAGE AVOIDANCE IN TRANSFERRING AN ULTRA-THIN LAYER OF...
- Publication number 20070141740
- Publication date Jun 21, 2007
- Nirmal David Theodore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacture
- Publication number 20020190351
- Publication date Dec 19, 2002
- John L. Freeman
- H01 - BASIC ELECTRIC ELEMENTS

John L. Freeman Jr.

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor component

Semiconductor device and method of making

Structure and method for metallization of semiconductor devices

Structure and method for metallization of semiconductor devices

Planar multi-layer metal bonding pad

Method for making a planar multi-layer metal bonding pad

Multiple step metallization process

Residue-free plasma etch of high temperature AlCu

Patents Applicationslast 30 patents

METHOD FOR DAMAGE AVOIDANCE IN TRANSFERRING AN ULTRA-THIN LAYER OF...

Semiconductor device and method of manufacture