Jui Hui HUNG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable genome sequencing and genotyping device and operating meth...
- Patent number 11,840,729
- Issue date Dec 12, 2023
- National Chiao Tung University
- Jui-Hung Hung
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Integrated passive device package and methods of forming same
- Patent number 11,742,220
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,557,546
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,532,569
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of image sensor
- Patent number 11,527,564
- Issue date Dec 13, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,362,046
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of formation
- Patent number 11,335,658
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method for chip package
- Patent number 11,329,031
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for DNA sequence alignment
- Patent number 11,302,419
- Issue date Apr 12, 2022
- National Chiao Tung University
- Jui-Hung Hung
Information Patent Grant
Integrated circuit structure
- Patent number 11,291,116
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device package and methods of forming same
- Patent number 11,251,054
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Privacy-kept text comparison method, system and computer program pr...
- Patent number 11,232,157
- Issue date Jan 25, 2022
- National Tsing Hua University
- Lee-Wei Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molding wafer chamber
- Patent number 11,205,579
- Issue date Dec 21, 2021
- Taiwan Seminconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Driving system and method of touch display panel
- Patent number 11,183,096
- Issue date Nov 23, 2021
- FOCALTECH SYSTEMS CO., LTD.
- Yi-Chiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,588
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,587
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,081,475
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-layer package-on-package structure and method forming same
- Patent number 11,069,656
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,063,023
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for package-on-package devices
- Patent number 11,037,861
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving system and method of touch display panel
- Patent number 11,023,071
- Issue date Jun 1, 2021
- FOCALTECH SYSTEMS CO., LTD.
- Yi-Chiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 11,018,095
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,971,483
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices including placing semico...
- Patent number 10,964,594
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method therefore
- Patent number 10,937,819
- Issue date Mar 2, 2021
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT METHOD, NON-TRANSITORY COMPUTER-READABLE MEDIUM, AND ASSOCIA...
- Publication number 20240296271
- Publication date Sep 5, 2024
- FARADAY TECHNOLOGY CORPORATION
- Chin-Cheng CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND DATA TRANSMISSION METHOD THEREOF
- Publication number 20240146458
- Publication date May 2, 2024
- JUI-HUI HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SWITCH TRANSISTOR PROTECTION DEVICE AND ELECTRIC CIRCUIT DEVICE USI...
- Publication number 20240063784
- Publication date Feb 22, 2024
- NUVOTON TECHNOLOGY CORPORATION
- Jui-Hsiao HUNG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER LIMITING CIRCUITS
- Publication number 20240039525
- Publication date Feb 1, 2024
- NUVOTON TECHNOLOGY CORPORATION
- Chun-Ku LIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR ESTABLISHING ROBUST PREDICTION MODEL, PREDICTION SYSTEM,...
- Publication number 20230377746
- Publication date Nov 23, 2023
- Kaohsiung Medical University
- Yuh-Jyh JONG
Information Patent Application
AUTOMATED PATHOGENIC MUTATION CLASSIFIER AND CLASSIFICATION METHOD...
- Publication number 20230207065
- Publication date Jun 29, 2023
- National Yang Ming Chiao Tung University
- Jui-Hung HUNG
Information Patent Application
DATA PROCESSING SYSTEM FOR PROCESSING GENE SEQUENCING DATA
- Publication number 20230154570
- Publication date May 18, 2023
- National Yang Ming Chiao Tung University
- Jui-Hung Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Structure
- Publication number 20220217847
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE PACKAGE AND METHODS OF FORMING SAME
- Publication number 20220165587
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PORTABLE GENOME SEQUENCING AND GENOTYPING DEVICE AND OPERATING METH...
- Publication number 20220017955
- Publication date Jan 20, 2022
- NATIONAL CHIAO-TUNG UNIVERSITY
- Jui-Hung HUNG
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210280528
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20210217726
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSOR
- Publication number 20210134864
- Publication date May 6, 2021
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRIVACY-KEPT TEXT COMPARISON METHOD, SYSTEM AND COMPUTER PROGRAM PR...
- Publication number 20210019352
- Publication date Jan 21, 2021
- National Tsing-Hua University
- Lee-Wei Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Structure and Formation Method for Chip Package
- Publication number 20200381407
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200373278
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHENG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
- Publication number 20200350279
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200312791
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200294936
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200258849
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-PIN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200243460
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200144202
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Layer Package-on-Package Structure and Method Forming Same
- Publication number 20200135694
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE PACKAGE AND METHODS OF FORMING SAME
- Publication number 20200090955
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Package-on-Package Devices
- Publication number 20200083145
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREFORE
- Publication number 20200075648
- Publication date Mar 5, 2020
- Powerchip Technology Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20200043900
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHENG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method of Forming
- Publication number 20190350082
- Publication date Nov 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Jui Hui HUNG

Person

Patents Grantslast 30 patents

Integrated circuit structure

Integrated fan-out package structures with recesses in molding comp...

Portable genome sequencing and genotyping device and operating meth...

Integrated passive device package and methods of forming same

Integrated circuit structure and method for reducing polymer layer...

Semiconductor structure

Method for manufacturing semiconductor package structure

Manufacturing method of image sensor

Semiconductor package

Multi-chip package and method of formation

Structure and formation method for chip package

Method and system for DNA sequence alignment

Integrated circuit structure

Integrated passive device package and methods of forming same

Privacy-kept text comparison method, system and computer program pr...

Molding wafer chamber

Driving system and method of touch display panel

Packaged semiconductor devices, methods of packaging semiconductor...

Packaged semiconductor devices, methods of packaging semiconductor...

Integrated circuit structure and method for reducing polymer layer...

Three-layer package-on-package structure and method forming same

Semiconductor package

Interconnect structure for package-on-package devices

Driving system and method of touch display panel

Semiconductor structure

Semiconductor structure and manufacturing method thereof

Chip on package structure and method

Methods of packaging semiconductor devices including placing semico...

Image sensor and manufacturing method therefore

Multi-chip fan out package and methods of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

LAYOUT METHOD, NON-TRANSITORY COMPUTER-READABLE MEDIUM, AND ASSOCIA...

ELECTRONIC DEVICE AND DATA TRANSMISSION METHOD THEREOF

SWITCH TRANSISTOR PROTECTION DEVICE AND ELECTRIC CIRCUIT DEVICE USI...

POWER LIMITING CIRCUITS

METHOD FOR ESTABLISHING ROBUST PREDICTION MODEL, PREDICTION SYSTEM,...

AUTOMATED PATHOGENIC MUTATION CLASSIFIER AND CLASSIFICATION METHOD...

DATA PROCESSING SYSTEM FOR PROCESSING GENE SEQUENCING DATA

Integrated Circuit Structure

INTEGRATED PASSIVE DEVICE PACKAGE AND METHODS OF FORMING SAME

PORTABLE GENOME SEQUENCING AND GENOTYPING DEVICE AND OPERATING METH...

Integrated Circuit Structure and Method for Reducing Polymer Layer...

SEMICONDUCTOR STRUCTURE

Chip on Package Structure and Method

MANUFACTURING METHOD OF IMAGE SENSOR

PRIVACY-KEPT TEXT COMPARISON METHOD, SYSTEM AND COMPUTER PROGRAM PR...

Structure and Formation Method for Chip Package

SEMICONDUCTOR PACKAGE

Integrated Fan-Out Package Structures with Recesses in Molding Comp...

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

Three-Layer Package-on-Package Structure and Method Forming Same

INTEGRATED PASSIVE DEVICE PACKAGE AND METHODS OF FORMING SAME

Interconnect Structure for Package-on-Package Devices

IMAGE SENSOR AND MANUFACTURING METHOD THEREFORE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Integrated Circuit Structure and Method of Forming