Jun Karasawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 11,410,914
- Issue date Aug 9, 2022
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,289,408
- Issue date Mar 29, 2022
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric device and thermoelectric module
- Patent number 8,895,833
- Issue date Nov 25, 2014
- Kabushiki Kaisha Toshiba
- Yasunari Ukita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric module and power generation apparatus
- Patent number 8,648,246
- Issue date Feb 11, 2014
- Kabushiki Kaisha Toshiba
- Mio Ohmura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-wiring board with built-in component, manufacturing method...
- Patent number 7,872,874
- Issue date Jan 18, 2011
- Kabushiki Kaisha Toshiba
- Jun Karasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus, method of making, and electric apparatus ha...
- Patent number 7,304,684
- Issue date Dec 4, 2007
- Kabushiki Kaisha Toshiba
- Masao Segawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20210090974
- Publication date Mar 25, 2021
- KABUSHIKI KAISHA TOSHIBA
- Keiichiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210090976
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC MODULE AND POWER GENERATION APPARATUS
- Publication number 20110247670
- Publication date Oct 13, 2011
- Mio OHMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE
- Publication number 20110139206
- Publication date Jun 16, 2011
- Yasunari UKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20080156521
- Publication date Jul 3, 2008
- Kabushiki Kaisha Toshiba
- Jun Karasawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF INSPECTING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20080149382
- Publication date Jun 26, 2008
- Kabushiki Kaisha Toshiba
- Jun Karasawa
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYERED PRINTED-WIRING BOARD AND INTER-LAYER CONNECTING METHOD...
- Publication number 20080121422
- Publication date May 29, 2008
- Kabushiki Kaisha Toshiba
- Jun Karasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board, its manufacturing method, and electronic equi...
- Publication number 20070277998
- Publication date Dec 6, 2007
- Kabushiki Kaisha Toshiba
- Daigo Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded printed wiring board, manufacturing method for c...
- Publication number 20070278000
- Publication date Dec 6, 2007
- Daigo Suzuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed wiring board, its bending method, and electronic apparatus
- Publication number 20070281499
- Publication date Dec 6, 2007
- Kiyomi Muro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed-wiring board with built-in component, manufacturing method...
- Publication number 20070230146
- Publication date Oct 4, 2007
- Daigo Suzuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed-wiring board with built-in component, manufacturing method...
- Publication number 20070221398
- Publication date Sep 27, 2007
- TOSHIBA AMERICA INFORMATION SYSTEMS, INC.
- Jun Karasawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed-wiring board with built-in component, manufacturing method...
- Publication number 20070200232
- Publication date Aug 30, 2007
- Daigo Suzuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Image pickup apparatus, method thereof, and electric apparatus
- Publication number 20020057468
- Publication date May 16, 2002
- Masao Segawa
- H01 - BASIC ELECTRIC ELEMENTS

Jun Karasawa

Person

Patents Grantslast 30 patents

Power module

Semiconductor device

Thermoelectric device and thermoelectric module

Thermoelectric module and power generation apparatus

Printed-wiring board with built-in component, manufacturing method...

Image pickup apparatus, method of making, and electric apparatus ha...

Patents Applicationslast 30 patents

POWER MODULE

SEMICONDUCTOR DEVICE

THERMOELECTRIC MODULE AND POWER GENERATION APPARATUS

THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

METHOD OF INSPECTING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

MULTILAYERED PRINTED-WIRING BOARD AND INTER-LAYER CONNECTING METHOD...

Printed wiring board, its manufacturing method, and electronic equi...

Component-embedded printed wiring board, manufacturing method for c...

Printed wiring board, its bending method, and electronic apparatus

Printed-wiring board with built-in component, manufacturing method...

Printed-wiring board with built-in component, manufacturing method...

Printed-wiring board with built-in component, manufacturing method...

Image pickup apparatus, method thereof, and electric apparatus