Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

Abstract

According to one embodiment, there is provided a printed-wiring board with a built-in component including a first base material including a pattern forming surface on which a plurality of conductive patterns are formed. A circuit component is mounted on the pattern forming surface of the first base material, and is connected to the conductive patterns of the first base material. A filling material is stacked on the pattern forming surface of the first base material, and fills in a gap between the circuit component and the pattern forming surface. A second base material is stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.

FIGS. 1A, 1B, 1C, 1D and 1E are exemplary cross-sectional views showing manufacturing processes and an exemplary structure of a printed-wiring board with a built-in component according to a first embodiment of the invention;

FIG. 2 is a plan view showing a manufacturing process of the printed-wiring board with the built-in component according to the first embodiment;

FIGS. 3A, 3B, 3C, 3D and 3E are exemplary cross-sectional views showing manufacturing processes and an exemplary structure of a printed-wiring board with a built-in component according to a second embodiment of the invention;

FIGS. 4A, 4B, 4C, 4D and 4E are exemplary cross-sectional views showing manufacturing processes and an exemplary structure of a printed-wiring board with a built-in component according to a third embodiment of the invention;

FIGS. 5A, 5B and 5C are cross-sectional views showing variations of a printed-wiring board with the built-in component obtained by stacking the printed-wiring boards according to the first through third embodiments of the invention;

FIG. 6 is a cross-sectional view showing an exemplary structure of a printed-wiring board with a built-in component according to a fourth embodiment of the invention;

FIGS. 7A, 7B, 7C, 7D and 7E are cross-sectional views showing more detailed manufacturing processes of the printed-wiring board with the built-in component according to the first embodiment;

FIGS. 7F, 7G, 7H and 7I are cross-sectional views showing more detailed manufacturing processes of the printed-wiring board with the built-in component according to the first embodiment;

FIGS. 7J, 7K and 7L are cross-sectional views showing more detailed manufacturing processes of the printed-wiring board with the built-in component according to the first embodiment; and

FIG. 8 is a perspective view of an outside structure of an electronic device according to an embodiment of the invention.

Claims

1. A printed-wiring board with a built-in component, comprising: a first base material including a pattern forming surface on which a plurality of conductive patterns are formed;a circuit component mounted on the pattern forming surface of the first base material and connected to the conductive patterns of the first base material;a filling material which is stacked on the pattern forming surface of the first base material, and fills in a gap between the circuit component and the pattern forming surface; anda second base material stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.

2. The printed-wiring board according to claim 1, wherein the filling material and the second base material form insulating layers.

3. The printed-wiring board according to claim 2, wherein the filling material forms one of the insulating layers having a thickness sufficient to cover the circuit component.

4. The printed-wiring board according to claim 2, wherein the filling material forms one of the insulating layers having a thickness sufficient to cover the circuit component except for a portion of the circuit component.

5. The printed-wiring board according to claim 1, wherein the second base material includes a reinforcing member for reinforcing rigidity of the first base material.

6. The printed-wiring board according to claim 1, wherein the circuit component includes a passive element connected to the conductive patterns.

7. A manufacturing method of a printed-wiring board with a built-in component in which a circuit component is provided between conductive patterns formed on a pattern forming surface of a first base material, the manufacturing method comprising: impregnating, with a filling material, a gap between the circuit component and the pattern forming surface of the first base material on which the circuit component is mounted;stacking the filling material on the pattern forming surface of the first base material; andstacking a second base material on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material, and thereafter heating and pressurizing the first base material, the filling material, and the second base material, thereby integrating the first base material, the filling material, and the second base material.

8. The manufacturing method according to claim 7, wherein the filling material and the second base material form insulating layers.

9. The manufacturing method according to claim 8, wherein the filling material forms one of the insulating layers having a thickness sufficient to cover the circuit component.

10. The manufacturing method according to claim 8, wherein the second base material is a part of a flexible substrate, and a part of one of the insulating layers of the flexible substrate is stacked on the filling material.

11. The manufacturing method according to claim 8, wherein the second base material is a part of a rigid substrate, and a part of one of the insulating layers of the rigid substrate is stacked on the filling material.

12. The manufacturing method according to claim 7, wherein the gap is impregnated with the filling material by a screen printing method.

13. The manufacturing method according to claim 7, wherein the gap is impregnated with the filling material by a curtain coating method.

14. The manufacturing method according to claim 7, wherein the gap is impregnated with the filling material by a roll coating method.

15. An electronic device, comprising: a display unit;an operation unit; anda circuit board incorporating therein a control circuit which controls an operation of one of the display unit and the operation unit,the circuit board including:a first base material including a pattern forming surface on which a plurality of conductive patterns are formed;a circuit component mounted on the pattern forming surface of the first base material and connected to the conductive patterns of the first base material;a filling material stacked on the pattern forming surface of the first base material and filling in a gap between the circuit component and the pattern forming surface on which the circuit component is mounted; anda second base material stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.