Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

Abstract

According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.

FIG. 1 is an exemplary sectional view showing the structure of a printed-wiring board with a built-in component according to a first embodiment of the invention which is under manufacturing;

FIG. 2 is an exemplary sectional view showing the structure of the printed-wiring board with a built-in component according to the first embodiment of which manufacture is completed;

FIG. 3 is an exemplary plan view showing the structure of the printed-wiring board with a built-in component according to the first embodiment;

FIG. 4 is an exemplary diagram showing the structure of an electronic device according to a second embodiment of the invention;

FIG. 5 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a third embodiment of the invention;

FIG. 6A is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a fourth embodiment of the invention;

FIG. 6B is an exemplary sectional view showing the electrode structure of the printed-wiring board with a built-in component according to the fourth embodiment of the invention;

FIG. 7 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a fifth embodiment of the invention;

FIG. 8 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a sixth embodiment of the invention;

FIG. 9 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a seventh embodiment of the invention;

FIG. 10 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to an eighth embodiment of the invention;

FIG. 11A is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a ninth embodiment of the invention;

FIG. 11B is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a tenth embodiment of the invention;

FIG. 12 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to an eleventh embodiment of the invention;

FIG. 13 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a twelfth embodiment of the invention;

FIG. 14 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a thirteenth embodiment of the invention;

FIG. 15 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a fourteenth embodiment of the invention; and

FIG. 16 is an exemplary plan view showing the electrode structure of a printed-wiring board with a built-in component according to a fifteenth embodiment of the invention.

Claims

1. A printed-wiring board comprising: a base material including a pattern-forming surface;an electronic component mounted on the pattern-forming surface; anda guiding path formed on or above the pattern-forming surface and below the mounted electronic component, the guiding path being used for removal of a void formed under the mounted electronic component.

2. The printed-wiring board according to claim 1, wherein the guiding path is formed between electrodes that are formed on the pattern-forming surface and are coupled to a pair of terminals of the electronic component.

3. The printed-wiring board according to claim 2, wherein the guiding path is a guiding groove formed in the electrodes.

4. The printed-wiring board according to claim 2, wherein the guiding path is a plurality of guiding grooves formed in the electrodes and arranged in parallel.

5. The printed-wiring board according to claim 2, wherein the electrodes are formed into shapes whose heights are gradually decreased toward a center of the pattern-forming surface.

6. The printed-wiring board according to claim 2, wherein the electrodes are formed into triangular shapes such that their apexes are pointed toward the center of the pattern-forming surface.

7. The printed-wiring board according to claim 2, wherein the electrodes are formed into arc shapes toward a center of the pattern-forming surface.

8. The printed-wiring board according to claim 2, wherein the electrodes are formed into semicircular shapes toward a center of the pattern-forming surface.

9. The printed-wiring board according to claim 2, wherein the electrodes are formed such that portions of the electrodes close to a center of the pattern-forming surface are formed into triangular shapes with their apexes rounded and pointed toward the center of the pattern-forming surface.

10. The printed-wiring board according to claim 2, wherein the electrodes are formed into shapes including portions of the electrodes pointed toward a center of the pattern-forming surface.

11. The printed-wiring board according to claim 2, wherein the electrodes are formed into convex arc shapes toward a center of the pattern-forming surface.

12. The printed-wiring board according to claim 2, wherein one of the electrodes is formed into a convex arc shape and the other one of the electrodes is formed into a concave arc shape toward a center of the pattern-forming surface.

13. A method for manufacturing a printed-wiring board, comprising: placing an electrode of a component on a pattern-forming surface of the printed-wiring board, the electrode being shaped to provide a guide path for removal of a void from under the component; andmounting the component on the pattern-forming surface of the printed-wiring board.

14. The method according to claim 13, wherein the placing of the electrode on the pattern-forming surface to provide the guide path includes forming a guiding groove in the electrode.

15. The method according to claim 13, wherein the placing of the electrode on the pattern-forming surface to provide the guide path includes forming a plurality of guiding grooves in the electrodes and arranging the electrodes in parallel.

16. The method according to claim 13, wherein the placing of the electrode on the pattern-forming surface to provide the guide path includes forming the electrode into a shape whose height is gradually decreased toward a center of the pattern-forming surface.

17. The method according to claim 13, wherein placing of the electrode is formed into triangular shapes such that their apexes are pointed toward a center of the pattern-forming surface.

18. An electronic device comprising: a body with a user input device;a printed-wiring board provided in the body, the printed-wiring board including a component mounted thereon; andan electrode formed on a pattern-forming surface of the printed-wiring board, the electrode being shaped to provide a guide path for removal of a void under the component.

19. The electronic device according to claim 18, wherein the guiding path is a guiding groove formed in the electrode.

20. The electronic device according to claim 18, wherein the guiding path is a plurality of guiding grooves formed in the electrodes and arranged in parallel.