Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

Abstract

According to one embodiment, a printed-wiring board with a built-in component includes a first base material including a component mounting surface. A circuit component is mounted on the component mounting surface of the first base material. A stress relaxation material covers the circuit component. A second base material is stacked on the first base material by interposing, between the first base material and the second base material, an insulating layer covering the stress relaxation material.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.

FIG. 1 is an exemplary cross-sectional view of a printed-wiring board with a built-in component according to a first embodiment of the invention;

FIG. 2 is an exemplary cross-sectional view showing a first process of a manufacturing process of the printed-wiring board according to the first embodiment;

FIG. 3 is an exemplary cross-sectional view showing a second process of the manufacturing process of the printed-wiring board according to the first embodiment;

FIG. 4 is an exemplary cross-sectional view showing a third process of the manufacturing process of the printed-wiring board according to the first embodiment;

FIG. 5 is an exemplary cross-sectional view showing a fourth process of the manufacturing process of the printed-wiring board according to the first embodiment;

FIG. 6 is an exemplary cross-sectional view showing a fifth process of the manufacturing process of the printed-wiring board according to the first embodiment;

FIG. 7 is an exemplary cross-sectional view showing a first process of a manufacturing process of a printed-wiring board with a built-in component according to a second embodiment of the invention;

FIG. 8 is an exemplary cross-sectional view showing a second process of the manufacturing process of the printed-wiring board according to the second embodiment;

FIG. 9 is an exemplary cross-sectional view showing a third process of the manufacturing process of the printed-wiring board according to the second embodiment;

FIG. 10 is an exemplary cross-sectional view showing a fourth process of the manufacturing process of the printed-wiring board according to the second embodiment;

FIG. 11 is an exemplary cross-sectional view showing a fifth process of the manufacturing process of the printed-wiring board according to the second embodiment;

FIG. 12 is an exemplary cross-sectional view showing a first process of a manufacturing process of a printed-wiring board with a built-in component according to a third embodiment of the invention;

FIG. 13 is an exemplary cross-sectional view showing a second process of the manufacturing process of the printed-wiring board according to the third embodiment;

FIG. 14 is an exemplary cross-sectional view showing a third process of the manufacturing process of the printed-wiring board according to the third embodiment;

FIG. 15 is an exemplary cross-sectional view showing a fourth process of the manufacturing process of the printed-wiring board according to the third embodiment;

FIG. 16 is an exemplary cross-sectional view showing a fifth process of the manufacturing process of the printed-wiring board according to the third embodiment; and

FIG. 17 is an exemplary perspective view showing a structure of an electronic device according to an embodiment of the invention.

Claims

1. A printed-wiring board with a built-in component, comprising: a first base material including a component mounting surface;a circuit component mounted on the component mounting surface of the first base material;a stress relaxation material covering the circuit component; anda second base material stacked on the first base material by interposing, between the first base material and the second base material, an insulating layer covering the stress relaxation material.

2. The printed-wiring board according to claim 1, wherein the stress relaxation material includes a thermo-setting resin material which relaxes a thermal stress between the insulating layer and the circuit component.

3. The printed-wiring board according to claim 2, wherein the first base material and the second base material form a multi-layer printed-wiring board, and each of the first base material and the second base material includes a wiring layer.

4. The printed-wiring board according to claim 3, wherein each of the first base material and the second base material is formed by using a sheet prepreg, and includes a wiring layer formed on an inner-layer side surface and an outer layer side surface thereof.

5. The printed-wiring board according to claim 2, wherein a space formed between the component mounting surface and a lower surface of the circuit component mounted on the component mounting surface is filled with the stress relaxation material.

6. The printed-wiring board according to claim 1, wherein the stress relaxation material includes a thermo-setting resin material which relaxes a bending stress between the insulating layer and the circuit component.

7. The printed-wiring board according to claim 6, wherein the first base material and the second base material form a multi-layer printed-wiring board, and each of the first base material and the second base material includes a wiring layer.

8. The printed-wiring board according to claim 7, wherein each of the first base material and the second base material is formed by using a sheet prepreg, and includes a wiring layer formed on an inner-layer side surface and an outer layer side surface thereof.

9. The printed-wiring board according to claim 6, wherein a space formed between the component mounting surface and a lower surface of the circuit component mounted on the component mounting surface is filled with the stress relaxation material.

10. The printed-wiring board according to claim 1, wherein a space formed between the component mounting surface and a lower surface of the circuit component mounted on the component mounting surface is filled with the stress relaxation material.

11. The printed-wiring board according to claim 1, wherein the circuit component includes a chip component including a pair of electrodes to be connected to a conductive pattern formed on the component mounting surface.

12. A manufacturing method of a printed-wiring board with a built-in component, comprising: mounting a circuit component on a component mounting surface of a first base material;covering the circuit component mounted on the component mounting surface of the first base material with a stress relaxation material;forming an insulating layer which covers the stress relaxation material on the first base material; andstacking, on the first base material, a second base material including a conductive pattern by interposing the insulating layer between the first base material and the second base material.

13. The manufacturing method according to claim 12, wherein covering the circuit component with the stress relaxation material includes: filling, with the stress relaxation material, a space formed between the component mounting surface and a lower surface of the circuit component mounted on the component mounting surface.

14. An electronic device, comprising: a main body; anda circuit board provided in the main body, wherein the circuit board includes:a first base material including a component mounting surface;a circuit component mounted on the component mounting surface of the first base material;a stress relaxation material covering the circuit component; anda second base material including a conductive pattern and stacked on the first base material by interposing, between the first base material and the second base material, an insulating layer which covers the stress relaxation material.