Junichi Saeki

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Support system, support method and support program of resin molded...
- Patent number 8,095,348
- Issue date Jan 10, 2012
- Hitachi, Ltd.
- Junichi Saeki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional foam analysis method, product design aiding metho...
- Patent number 7,277,771
- Issue date Oct 2, 2007
- Hitachi, Ltd.
- Tsutomu Kono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Design support apparatus and method for supporting design of resin...
- Patent number 7,096,083
- Issue date Aug 22, 2006
- Hitachi, Ltd.
- Osami Kaneto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Diode package having an anode and a cathode formed on one surface o...
- Patent number 7,023,027
- Issue date Apr 4, 2006
- Renesas Technology Corp.
- Toshiya Teramae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 6,844,219
- Issue date Jan 18, 2005
- Renesas Technology Corp.
- Makoto Kitano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 6,465,876
- Issue date Oct 15, 2002
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,326,681
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,303,982
- Issue date Oct 16, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an integrally molded lead frame
- Patent number 6,291,880
- Issue date Sep 18, 2001
- Hitachi, Ltd.
- Toshio Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,204,552
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,130,114
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a resin sealing member which exposes...
- Patent number 6,124,629
- Issue date Sep 26, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a ball grid a...
- Patent number 6,114,192
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,100,115
- Issue date Aug 8, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having all outer leads extending from one side...
- Patent number 6,100,580
- Issue date Aug 8, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,081,023
- Issue date Jun 27, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,072,231
- Issue date Jun 6, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device chip on lead and lead on chip manufacturing
- Patent number 6,069,029
- Issue date May 30, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,018,191
- Issue date Jan 25, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,981,315
- Issue date Nov 9, 1999
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,914,530
- Issue date Jun 22, 1999
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array package structure usi...
- Patent number 5,914,531
- Issue date Jun 22, 1999
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,863,817
- Issue date Jan 26, 1999
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,821,606
- Issue date Oct 13, 1998
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 5,811,877
- Issue date Sep 22, 1998
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DESIGN SUPPORT SYSTEM, SUPPORT METHOD AND SUPPORT PROGRAM OF RESIN...
- Publication number 20080234989
- Publication date Sep 25, 2008
- Junichi Saeki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-dimensional foam analysis method, product design aiding metho...
- Publication number 20060004481
- Publication date Jan 5, 2006
- Tsutomu Kono
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Design support apparatus and method for supporting design of resin...
- Publication number 20040093104
- Publication date May 13, 2004
- Osami Kaneto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package, manufacturing method of semiconductor package
- Publication number 20030094621
- Publication date May 22, 2003
- Toshiya Teramae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and lead frame therefor
- Publication number 20020135051
- Publication date Sep 26, 2002
- Asao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20010008302
- Publication date Jul 19, 2001
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Junichi Saeki

Person

Patents Grantslast 30 patents

Support system, support method and support program of resin molded...

Three-dimensional foam analysis method, product design aiding metho...

Design support apparatus and method for supporting design of resin...

Diode package having an anode and a cathode formed on one surface o...

Semiconductor device

Semiconductor devices and methods of making the devices

Semiconductor device and lead frame therefor

Semiconductor device

Method of manufacturing a semiconductor device a ball grid array pa...

Semiconductor device

Semiconductor device and lead frame therefor

Semiconductor device

Semiconductor device

Semiconductor device including an integrally molded lead frame

Semiconductor device

Semiconductor device

Semiconductor device including a resin sealing member which exposes...

Method of manufacturing a semiconductor device having a ball grid a...

Semiconductor device

Semiconductor device having all outer leads extending from one side...

Semiconductor device

Semiconductor device

Semiconductor device chip on lead and lead on chip manufacturing

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device having a ball grid array package structure usi...

Semiconductor device

Semiconductor device

Semiconductor device structure

Patents Applicationslast 30 patents

DESIGN SUPPORT SYSTEM, SUPPORT METHOD AND SUPPORT PROGRAM OF RESIN...

Three-dimensional foam analysis method, product design aiding metho...

Semiconductor device

Design support apparatus and method for supporting design of resin...

Semiconductor devices and methods of making the devices

Semiconductor device

Semiconductor package, manufacturing method of semiconductor package

Semiconductor device and lead frame therefor

Semiconductor device