Kai-Chih Wang

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image processing method for image capturing device
- Patent number 9,544,506
- Issue date Jan 10, 2017
- NOVATEK Microelectronics Corp.
- Kai-Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 8,361,898
- Issue date Jan 29, 2013
- Visera Technologies Company Limited
- Kai-Chih Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating isolation structures for CMOS image sensor ch...
- Patent number 7,833,810
- Issue date Nov 16, 2010
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structures for optoelectronic devices
- Patent number 7,824,964
- Issue date Nov 2, 2010
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 7,679,187
- Issue date Mar 16, 2010
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures for CMOS image sensor chip scale packages
- Patent number 7,569,409
- Issue date Aug 4, 2009
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for optoelectronic device and fabrication method...
- Patent number 7,566,944
- Issue date Jul 28, 2009
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having a locking member for mating with a mati...
- Patent number 7,387,526
- Issue date Jun 17, 2008
- P-Two Industries Inc.
- Shih-chieh Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...
- Publication number 20100127408
- Publication date May 27, 2010
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES
- Publication number 20090263927
- Publication date Oct 22, 2009
- VISERA TECHNOLOGIES COMPANY LIMITED
- Tzu-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURES FOR OPTOELECTRONIC DEVICES
- Publication number 20090186449
- Publication date Jul 23, 2009
- Kai-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure for optoelectronic device
- Publication number 20090026562
- Publication date Jan 29, 2009
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure for back illuminated optoelectronic device an...
- Publication number 20080169117
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure for optoelectronic device and fabrication method...
- Publication number 20080169477
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation structures for CMOS image sensor chip scale packages
- Publication number 20080164553
- Publication date Jul 10, 2008
- VisEra Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connector
- Publication number 20070218759
- Publication date Sep 20, 2007
- Shih-chieh Liang
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Chih Wang

Person

Patents Grantslast 30 patents

Image processing method for image capturing device

Bonding pad structure for back illuminated optoelectronic device an...

Method of fabricating isolation structures for CMOS image sensor ch...

Method for fabricating package structures for optoelectronic devices

Bonding pad structure for back illuminated optoelectronic device an...

Isolation structures for CMOS image sensor chip scale packages

Package structure for optoelectronic device and fabrication method...

Electrical connector having a locking member for mating with a mati...

Patents Applicationslast 30 patents

BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...

ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES

METHOD FOR FABRICATING PACKAGE STRUCTURES FOR OPTOELECTRONIC DEVICES

Package structure for optoelectronic device

Bonding pad structure for back illuminated optoelectronic device an...

Package structure for optoelectronic device and fabrication method...

Isolation structures for CMOS image sensor chip scale packages

Electrical connector