Katsuhide WATANABE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Eddy current sensor
- Patent number 12,076,834
- Issue date Sep 3, 2024
- Ebara Corporation
- Atsushi Abe
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing control system, substrate processing control m...
- Patent number 12,036,634
- Issue date Jul 16, 2024
- Ebara Corporation
- Koichi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head system and polishing apparatus
- Patent number 12,017,323
- Issue date Jun 25, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus, method of creating thickness map, an...
- Patent number 11,833,636
- Issue date Dec 5, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Magnetic element and eddy current sensor using the same
- Patent number 11,759,912
- Issue date Sep 19, 2023
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head system and polishing apparatus
- Patent number 11,673,222
- Issue date Jun 13, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing machine and a polishing method for a substrate
- Patent number 11,465,254
- Issue date Oct 11, 2022
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 11,450,544
- Issue date Sep 20, 2022
- Ebara Corporation
- Itsuki Kobata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 10,665,487
- Issue date May 26, 2020
- Ebara Corporation
- Itsuki Kobata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,500,691
- Issue date Dec 10, 2019
- Ebara Corporation
- Masayoshi Imai
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method
- Patent number 10,056,277
- Issue date Aug 21, 2018
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polished-state monitoring method
- Patent number 9,999,955
- Issue date Jun 19, 2018
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 9,687,955
- Issue date Jun 27, 2017
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Method of adjusting profile of a polishing member used in a polishi...
- Patent number 9,156,130
- Issue date Oct 13, 2015
- Ebara Corporation
- Takahiro Shimano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus having substrate holding apparatus
- Patent number 9,149,903
- Issue date Oct 6, 2015
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Method of obtaining a sliding distance distribution of a dresser on...
- Patent number 9,108,292
- Issue date Aug 18, 2015
- Ebara Corporation
- Takahiro Shimano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus having thermal energy measuring means
- Patent number 9,073,170
- Issue date Jul 7, 2015
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane for semiconductor wafer polishing
- Patent number D729753
- Issue date May 19, 2015
- Ebara Corporation
- Makoto Fukushima
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Method of polishing a substrate having a film on a surface of the s...
- Patent number 8,951,813
- Issue date Feb 10, 2015
- Ebara Corporation
- Takeshi Iizumi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus having thermal energy measuring means
- Patent number 8,932,106
- Issue date Jan 13, 2015
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane
- Patent number 8,859,070
- Issue date Oct 14, 2014
- Ebara Corporation
- Hozumi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane for semiconductor wafer polishing
- Patent number D711330
- Issue date Aug 19, 2014
- Ebara Corporation
- Makoto Fukushima
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Apparatus for dressing a polishing pad, chemical mechanical polishi...
- Patent number 8,382,558
- Issue date Feb 26, 2013
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane for semiconductor wafer polishing apparatus
- Patent number D633452
- Issue date Mar 1, 2011
- Ebara Corporation
- Keisuke Namiki
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electron beam apparatus and method for manufacturing semiconductor...
- Patent number 7,372,027
- Issue date May 13, 2008
- Tokyo Electron Limited
- Atsushi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration isolating apparatus for table for mounting device sensiti...
- Patent number 6,536,735
- Issue date Mar 25, 2003
- Ebara Corporation
- Takahide Haga
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Magnetic levitation control apparatus
- Patent number 6,515,388
- Issue date Feb 4, 2003
- Ebara Corporation
- Shinichi Moriyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stage positioning device
- Patent number 6,437,864
- Issue date Aug 20, 2002
- Ebara Corporation
- Katsuhide Watanabe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polishing apparatus
- Patent number 6,183,342
- Issue date Feb 6, 2001
- Ebara Corporation
- Katsuhide Watanabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...
- Publication number 20240316720
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Koichi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND INFORMATION PROCESSING SYSTEM
- Publication number 20240308018
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Yuta SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20220375775
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Itsuki KOBATA
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL METHOD FOR PROCESSING OF A SUBSTRATE
- Publication number 20220266414
- Publication date Aug 25, 2022
- KIOXIA Corporation
- Tsutomu MIKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20220266418
- Publication date Aug 25, 2022
- EBARA CORPORATION
- Yuta Suzuki
- B24 - GRINDING POLISHING
Information Patent Application
OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR
- Publication number 20220063056
- Publication date Mar 3, 2022
- EBARA CORPORATION
- Atsushi ABE
- G01 - MEASURING TESTING
Information Patent Application
POLISHING HEAD SYSTEM AND POLISHING APPARATUS
- Publication number 20210308823
- Publication date Oct 7, 2021
- EBARA CORPORATION
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD SYSTEM AND POLISHING APPARATUS
- Publication number 20210237224
- Publication date Aug 5, 2021
- EBARA CORPORATION
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20210166967
- Publication date Jun 3, 2021
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS, METHOD OF CREATING THICKNESS MAP, AN...
- Publication number 20210101250
- Publication date Apr 8, 2021
- EBARA CORPORATION
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
EDDY CURRENT SENSOR
- Publication number 20210001447
- Publication date Jan 7, 2021
- EBARA CORPORATION
- Atsushi Abe
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20200243364
- Publication date Jul 30, 2020
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SPECIFYING AREA TO B...
- Publication number 20200223027
- Publication date Jul 16, 2020
- EBARA CORPORATION
- Katsuhide WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE
- Publication number 20200171618
- Publication date Jun 4, 2020
- EBARA CORPORATION
- Itsuki KOBATA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...
- Publication number 20190240799
- Publication date Aug 8, 2019
- EBARA CORPORATION
- Koichi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ELEMENT AND EDDY CURRENT SENSOR USING THE SAME
- Publication number 20190193242
- Publication date Jun 27, 2019
- EBARA CORPORATION
- Taro TAKAHASHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCL...
- Publication number 20180286717
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Katsuhide WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20180056470
- Publication date Mar 1, 2018
- EBARA CORPORATION
- Masayoshi IMAI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE
- Publication number 20170259395
- Publication date Sep 14, 2017
- EBARA CORPORATION
- Itsuki KOBATA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20170252889
- Publication date Sep 7, 2017
- EBARA CORPORATION
- Katsuhide WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD
- Publication number 20170148655
- Publication date May 25, 2017
- EBARA CORPORATION
- Yoichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM. AND SU...
- Publication number 20170047237
- Publication date Feb 16, 2017
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF POLISHING A SUBSTRATE HAVING A FILM ON A SURFACE OF THE...
- Publication number 20150111314
- Publication date Apr 23, 2015
- EBARA CORPORATION
- Takeshi IIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND METHOD
- Publication number 20150093968
- Publication date Apr 2, 2015
- EBARA CORPORATION
- Makoto FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND METHOD
- Publication number 20150093971
- Publication date Apr 2, 2015
- EBARA CORPORATION
- Makoto FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHED-STATE MONITORING METHOD
- Publication number 20150017887
- Publication date Jan 15, 2015
- EBARA CORPORATION
- Yoichi KOBAYASHI
- G01 - MEASURING TESTING
Information Patent Application
FILM-THICKNESS MEASURING APPARATUS, FILM-THICKNESS MEASURING METHOD...
- Publication number 20150017880
- Publication date Jan 15, 2015
- EBARA CORPORATION
- Toshikazu NOMURA
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON...
- Publication number 20140342642
- Publication date Nov 20, 2014
- Takahiro SHIMANO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF ADJUSTING PROFILE OF A POLISHING MEMBER USED IN A POLISHI...
- Publication number 20140287653
- Publication date Sep 25, 2014
- Takahiro SHIMANO
- B24 - GRINDING POLISHING

Katsuhide WATANABE

Person

Patents Grantslast 30 patents

Eddy current sensor

Substrate processing apparatus, substrate processing system, and su...

Substrate processing control system, substrate processing control m...

Polishing head system and polishing apparatus

Substrate polishing apparatus, method of creating thickness map, an...

Magnetic element and eddy current sensor using the same

Polishing head system and polishing apparatus

Polishing machine and a polishing method for a substrate

Substrate processing apparatus, substrate processing system, and su...

Substrate processing apparatus, substrate processing system, and su...

Substrate processing apparatus and substrate processing method

Polishing method

Polishing apparatus and polished-state monitoring method

Polishing apparatus

Method of adjusting profile of a polishing member used in a polishi...

Polishing apparatus having substrate holding apparatus

Method of obtaining a sliding distance distribution of a dresser on...

Polishing apparatus having thermal energy measuring means

Elastic membrane for semiconductor wafer polishing

Method of polishing a substrate having a film on a surface of the s...

Polishing apparatus having thermal energy measuring means

Elastic membrane

Elastic membrane for semiconductor wafer polishing

Apparatus for dressing a polishing pad, chemical mechanical polishi...

Elastic membrane for semiconductor wafer polishing apparatus

Electron beam apparatus and method for manufacturing semiconductor...

Vibration isolating apparatus for table for mounting device sensiti...

Magnetic levitation control apparatus

Stage positioning device

Polishing apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...

SUBSTRATE PROCESSING APPARATUS AND INFORMATION PROCESSING SYSTEM

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

CONTROL METHOD FOR PROCESSING OF A SUBSTRATE

SUBSTRATE PROCESSING APPARATUS

OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR

POLISHING HEAD SYSTEM AND POLISHING APPARATUS

POLISHING HEAD SYSTEM AND POLISHING APPARATUS

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

SUBSTRATE POLISHING APPARATUS, METHOD OF CREATING THICKNESS MAP, AN...

EDDY CURRENT SENSOR

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SPECIFYING AREA TO B...

POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL M...

MAGNETIC ELEMENT AND EDDY CURRENT SENSOR USING THE SAME

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE

POLISHING APPARATUS

POLISHING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM. AND SU...

A METHOD OF POLISHING A SUBSTRATE HAVING A FILM ON A SURFACE OF THE...

POLISHING APPARATUS AND METHOD

POLISHING APPARATUS AND METHOD

POLISHING APPARATUS AND POLISHED-STATE MONITORING METHOD

FILM-THICKNESS MEASURING APPARATUS, FILM-THICKNESS MEASURING METHOD...

METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON...

METHOD OF ADJUSTING PROFILE OF A POLISHING MEMBER USED IN A POLISHI...