Kazumasa Tanida

Person

Oita-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,818,628
- Issue date Oct 27, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,522,494
- Issue date Dec 31, 2019
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gaps within the conductive parts
- Patent number 10,090,351
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,935,232
- Issue date Apr 3, 2018
- TOSHIBA MEMORY CORPORATION
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,831,204
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,761,463
- Issue date Sep 12, 2017
- TOSHIBA MEMORY CORPORATION
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,721,865
- Issue date Aug 1, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
- Patent number 9,679,867
- Issue date Jun 13, 2017
- Kabushiki Kaisha Toshiba
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device
- Patent number 9,165,962
- Issue date Oct 20, 2015
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,117,774
- Issue date Aug 25, 2015
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for manufacturing semiconductor device
- Patent number 9,004,337
- Issue date Apr 14, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Hongo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,980,671
- Issue date Mar 17, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 8,822,307
- Issue date Sep 2, 2014
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, semiconductor substra...
- Patent number 8,778,778
- Issue date Jul 15, 2014
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 8,754,535
- Issue date Jun 17, 2014
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 8,748,316
- Issue date Jun 10, 2014
- Kabushiki Kaisha Toshiba
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,704,337
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 8,609,511
- Issue date Dec 17, 2013
- Kabushiki Kaisha Toshiba
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device, semiconductor device...
- Patent number 8,552,545
- Issue date Oct 8, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, manufacturing method of semiconductor appa...
- Patent number 8,426,977
- Issue date Apr 23, 2013
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 8,404,586
- Issue date Mar 26, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 8,405,227
- Issue date Mar 26, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,338,904
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 8,309,430
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,269,315
- Issue date Sep 18, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, through hole having expansion portion and thi...
- Patent number 8,237,285
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and camera module
- Patent number 8,228,426
- Issue date Jul 24, 2012
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device production method and semiconductor device
- Patent number 8,089,163
- Issue date Jan 3, 2012
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20220285305
- Publication date Sep 8, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20210013168
- Publication date Jan 14, 2021
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20200105699
- Publication date Apr 2, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20180068970
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20170301640
- Publication date Oct 19, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170243910
- Publication date Aug 24, 2017
- KABUSHIKI KAISHA TOSHIBA
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268469
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160126136
- Publication date May 5, 2016
- KABUSHIKI KAISHA TOSHIBA
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160126087
- Publication date May 5, 2016
- KABUSHIKI KAISHA TOSHIBA
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160035766
- Publication date Feb 4, 2016
- Kabushiki Kaisha Toshiba
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20160013099
- Publication date Jan 14, 2016
- KABUSHIKI KAISHA TOSHIBA
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20150348862
- Publication date Dec 3, 2015
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SOLID STATE...
- Publication number 20150035100
- Publication date Feb 5, 2015
- KABUSHIKI KAISHA TOSHIBA
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20140246789
- Publication date Sep 4, 2014
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130183810
- Publication date Jul 18, 2013
- Kabushiki Kaisha Toshiba
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20130175708
- Publication date Jul 11, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20130062737
- Publication date Mar 14, 2013
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20120329241
- Publication date Dec 27, 2012
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120217600
- Publication date Aug 30, 2012
- Kabushiki Kaisha Toshiba
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE B...
- Publication number 20120190138
- Publication date Jul 26, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20120068290
- Publication date Mar 22, 2012
- Kabushiki Kaisha Toshiba
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRA...
- Publication number 20120049312
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20110317050
- Publication date Dec 29, 2011
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SE...
- Publication number 20110304003
- Publication date Dec 15, 2011
- Kazumasa Tanida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20110217795
- Publication date Sep 8, 2011
- Kazumasa TANIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073983
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073974
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE
- Publication number 20100252902
- Publication date Oct 7, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100213564
- Publication date Aug 26, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS

Kazumasa Tanida

Person

Patents Grantslast 30 patents

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device having gaps within the conductive parts

Method of manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and semiconductor device manufacturing method

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device having a low-adhesive bond substrate pair

Solid state imaging device

Semiconductor device with a semiconductor chip connected in a flip...

System and method for manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Manufacturing method of semiconductor device, semiconductor substra...

Semiconductor device with a semiconductor chip connected in a flip...

Method of manufacturing semiconductor device, semiconductor device,...

Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing method, semiconductor device, an...

Manufacturing method for semiconductor device, semiconductor device...

Semiconductor apparatus, manufacturing method of semiconductor appa...

Manufacturing method for semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and method for manufacturing the same

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, through hole having expansion portion and thi...

Semiconductor package and camera module

Semiconductor device production method and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SOLID STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SOLID STATE...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE B...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE

SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME