Ken Pham

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 11,430,719
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Manu A. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package
- Patent number 11,075,147
- Issue date Jul 27, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 10,607,927
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- Manu J. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor systems having dual leadframes
- Patent number 10,573,582
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor systems having premolded dual leadframes
- Patent number 10,312,184
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame interconnect scheme with high power density
- Patent number 8,283,760
- Issue date Oct 9, 2012
- National Semiconductor Corporation
- Ken Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus with a textured capillary surface enabling h...
- Patent number 8,267,303
- Issue date Sep 18, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding deflector for a wire bonder
- Patent number 7,918,378
- Issue date Apr 5, 2011
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe panel
- Patent number 7,714,418
- Issue date May 11, 2010
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic optical sub-assembly for optoelectronic modules
- Patent number 7,269,027
- Issue date Sep 11, 2007
- National Semiconductor Corporation
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 7,247,942
- Issue date Jul 24, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 7,199,440
- Issue date Apr 3, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for protecting photonic devices in optoelectronic package...
- Patent number 7,195,955
- Issue date Mar 27, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical sub-assembly for opto-electronic modules
- Patent number 7,086,788
- Issue date Aug 8, 2006
- National Semiconductor Corporation
- William Paul Mazotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post singulation die separation apparatus and method for bulk feedi...
- Patent number 7,045,035
- Issue date May 16, 2006
- National Semiconductor Corporation
- Nikhil Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic optical sub-assembly for optoelectronic modules
- Patent number 7,023,705
- Issue date Apr 4, 2006
- National Semiconductor Corporation
- Jia Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for protecting photonic devices in optoelectronic package...
- Patent number 7,001,083
- Issue date Feb 21, 2006
- National Semiconductor Corporation
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Techniques for manufacturing flash-free contacts on a semiconductor...
- Patent number 6,989,122
- Issue date Jan 24, 2006
- National Semiconductor Corporation
- Ken Pham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Techniques for attaching rotated photonic devices to an optical sub...
- Patent number 6,973,225
- Issue date Dec 6, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post singulation die separation apparatus and method for bulk feedi...
- Patent number 6,932,136
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Nikhil Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sub-assembly for optoelectronic modules
- Patent number 6,916,121
- Issue date Jul 12, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,858,468
- Issue date Feb 22, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,838,317
- Issue date Jan 4, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector for opto-electronic modules
- Patent number 6,802,654
- Issue date Oct 12, 2004
- National Semiconductor Corporation
- Bruce C. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for electro-optical packages that facilitate t...
- Patent number 6,749,345
- Issue date Jun 15, 2004
- National Semiconductor Corporation
- Stephen Andrew Gee
- G02 - OPTICS
Information Patent Grant
Encapsulant material applicator for semiconductor wafers and method...
- Patent number 6,730,170
- Issue date May 4, 2004
- National Semiconductor Corporation
- Ken Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package with dam structure to provide fiber standoff
- Patent number 6,655,854
- Issue date Dec 2, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,642,613
- Issue date Nov 4, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for maintaining parallelism between optical and chip sub...
- Patent number 6,628,000
- Issue date Sep 30, 2003
- National Semiconductor Corporation
- Ken Pham
- G02 - OPTICS
Information Patent Grant
Miniature semiconductor package for opto-electronic devices
- Patent number 6,624,507
- Issue date Sep 23, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
- Publication number 20230245942
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSES
- Publication number 20230047555
- Publication date Feb 16, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KEN PHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC CORE AND WINDING LAMINA
- Publication number 20220310302
- Publication date Sep 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20210013138
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION ON A SUBSTRATE
- Publication number 20200135632
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20190318983
- Publication date Oct 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Manu A. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
- Publication number 20190237395
- Publication date Aug 1, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20180076116
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Manu J. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
- Publication number 20170125324
- Publication date May 4, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...
- Publication number 20120031955
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...
- Publication number 20120032354
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS
- Publication number 20100084748
- Publication date Apr 8, 2010
- National Semiconductor Corporation
- Anindya PODDAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME PANEL
- Publication number 20090026590
- Publication date Jan 29, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic optical sub-assembly for optoelectronic modules
- Publication number 20060140534
- Publication date Jun 29, 2006
- National Semiconductor Corporation
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having flash-free contacts and techniques for...
- Publication number 20060055080
- Publication date Mar 16, 2006
- National Semiconductor Corporation
- Ken Pham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Technique for protecting photonic devices in optoelectronic package...
- Publication number 20060001183
- Publication date Jan 5, 2006
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Optical sub-assembly for opto-electronic modules
- Publication number 20050175297
- Publication date Aug 11, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20050117835
- Publication date Jun 2, 2005
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20050100294
- Publication date May 12, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20040048417
- Publication date Mar 11, 2004
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20030189214
- Publication date Oct 9, 2003
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for attaching rotated photonic devices to an optical sub...
- Publication number 20030057535
- Publication date Mar 27, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical sub-assembly for optoelectronic modules
- Publication number 20030026556
- Publication date Feb 6, 2003
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Ceramic optical sub-assembly for optoelectronic modules
- Publication number 20030026081
- Publication date Feb 6, 2003
- National Semiconductor Corporation
- Jia Liu
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Spot-solderable leads for semiconductor device packages

Stacked die semiconductor package

Spot-solderable leads for semiconductor device packages

Semiconductor systems having dual leadframes

Semiconductor systems having premolded dual leadframes

Lead frame interconnect scheme with high power density

Wire bonding apparatus with a textured capillary surface enabling h...

Wire bonding deflector for a wire bonder

Leadframe panel

Ceramic optical sub-assembly for optoelectronic modules

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Technique for protecting photonic devices in optoelectronic package...

Optical sub-assembly for opto-electronic modules

Post singulation die separation apparatus and method for bulk feedi...

Ceramic optical sub-assembly for optoelectronic modules

Technique for protecting photonic devices in optoelectronic package...

Techniques for manufacturing flash-free contacts on a semiconductor...

Techniques for attaching rotated photonic devices to an optical sub...

Post singulation die separation apparatus and method for bulk feedi...

Optical sub-assembly for optoelectronic modules

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Electrical connector for opto-electronic modules

Apparatus and method for electro-optical packages that facilitate t...

Encapsulant material applicator for semiconductor wafers and method...

Optoelectronic package with dam structure to provide fiber standoff

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for maintaining parallelism between optical and chip sub...

Miniature semiconductor package for opto-electronic devices

Patents Applicationslast 30 patents

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG

SEMICONDUCTOR DEVICES AND PROCESSES

INTEGRATED MAGNETIC CORE AND WINDING LAMINA

STACKED DIE SEMICONDUCTOR PACKAGE

DIE ISOLATION ON A SUBSTRATE

Spot-Solderable Leads for Semiconductor Device Packages

Semiconductor Systems Having Premolded Dual Leadframes

Spot-Solderable Leads for Semiconductor Device Packages

Semiconductor Systems Having Premolded Dual Leadframes

WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

LEADFRAME PANEL

Ceramic optical sub-assembly for optoelectronic modules

Semiconductor package having flash-free contacts and techniques for...

Technique for protecting photonic devices in optoelectronic package...

Optical sub-assembly for opto-electronic modules

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for attaching rotated photonic devices to an optical sub...

Optical sub-assembly for optoelectronic modules

Ceramic optical sub-assembly for optoelectronic modules