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Kenji Takenouchi

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER GRINDING METHOD
    • Publication number 20240335918
    • Publication date Oct 10, 2024
    • Disco Corporation
    • Kenji TAKENOUCHI
    • B24 - GRINDING POLISHING
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20240071784
    • Publication date Feb 29, 2024
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLEANING TOOL AND WORKPIECE PROCESSING METHOD
    • Publication number 20240009789
    • Publication date Jan 11, 2024
    • Disco Corporation
    • Kenji Takenouchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20230381906
    • Publication date Nov 30, 2023
    • Disco Corporation
    • Kenji Takenouchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE PROCESSING METHOD
    • Publication number 20220367272
    • Publication date Nov 17, 2022
    • Disco Corporation
    • Tomohiro KANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WASTE FLUID TREATMENT APPARATUS AND PROCESSING WATER REGENERATION S...
    • Publication number 20210188670
    • Publication date Jun 24, 2021
    • Disco Corporation
    • Kenji TAKENOUCHI
    • C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • Information Patent Application

    PACKAGE SUBSTRATE PROCESSING METHOD
    • Publication number 20200058525
    • Publication date Feb 20, 2020
    • Disco Corporation
    • Kenji TAKENOUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20190229018
    • Publication date Jul 25, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20190198332
    • Publication date Jun 27, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20190067018
    • Publication date Feb 28, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20190061109
    • Publication date Feb 28, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20180369990
    • Publication date Dec 27, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180330990
    • Publication date Nov 15, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286688
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286689
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATE-SHAPED WORKPIECE PROCESSING METHOD
    • Publication number 20180286709
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180286756
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286753
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286755
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286690
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATE-SHAPED WORKPIECE PROCESSING METHOD
    • Publication number 20180286708
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180286754
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286757
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286758
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CUTTING APPARATUS AND WAFER CUTTING METHOD
    • Publication number 20160260626
    • Publication date Sep 8, 2016
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    GRINDING WHEEL, GRINDING APPARATUS, AND METHOD OF GRINDING WAFER
    • Publication number 20160256981
    • Publication date Sep 8, 2016
    • Disco Corporation
    • Kenji Takenouchi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    CUTTING BLADE HAVING CUTTING EDGE CONTAINING PHOTOCATALYST PARTICLES
    • Publication number 20160218023
    • Publication date Jul 28, 2016
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING METHOD
    • Publication number 20150262881
    • Publication date Sep 17, 2015
    • Disco Corporation
    • Kenji Takenouchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Polishing composition and manufacturing and polishing methods
    • Publication number 20020028632
    • Publication date Mar 7, 2002
    • Hajime Shimamoto
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...