Kevin J. Fischer

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less electrostatic discharge (ESD) integrated circuit str...
- Patent number 12,166,031
- Issue date Dec 10, 2024
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,690,211
- Issue date Jun 27, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,239,238
- Issue date Feb 1, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
AVD hardmask for damascene patterning
- Patent number 10,593,626
- Issue date Mar 17, 2020
- Intel Corporation
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 10,229,879
- Issue date Mar 12, 2019
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 9,984,922
- Issue date May 29, 2018
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
AVD hardmask for damascene patterning
- Patent number 9,780,038
- Issue date Oct 3, 2017
- Intel Corporation
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip capacitors and methods of assembling same
- Patent number 9,627,312
- Issue date Apr 18, 2017
- Intel Corporation
- Michael A. Childs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
AVD hardmask for damascene patterning
- Patent number 9,502,281
- Issue date Nov 22, 2016
- Intel Corporation
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 9,496,173
- Issue date Nov 15, 2016
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 9,437,545
- Issue date Sep 6, 2016
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap interconnect with hood layer and method of forming
- Patent number 9,123,727
- Issue date Sep 1, 2015
- Intel Corporation
- Kevin Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for enhancing dielectric breakdown performance
- Patent number 8,987,859
- Issue date Mar 24, 2015
- Intel Corporation
- Pavel S. Plekhanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 8,928,125
- Issue date Jan 6, 2015
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal sensor using a vibrating MEMS resonator of a chip interconn...
- Patent number 8,827,550
- Issue date Sep 9, 2014
- Intel Corporation
- Mohamed A. Abdelmoneum
- G01 - MEASURING TESTING
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 8,278,718
- Issue date Oct 2, 2012
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 8,120,119
- Issue date Feb 21, 2012
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 8,058,710
- Issue date Nov 15, 2011
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 7,968,952
- Issue date Jun 28, 2011
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier formation and structure to use in semiconductor devices
- Patent number 7,768,126
- Issue date Aug 3, 2010
- Intel Corporation
- Kevin Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tuned tensile stress low resistivity slot contact structure for n-t...
- Patent number 7,719,062
- Issue date May 18, 2010
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing corrosion in copper damascene processes
- Patent number 7,582,558
- Issue date Sep 1, 2009
- Intel Corporation
- Vinay B. Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier process/structure for transistor trench contact applications
- Patent number 7,525,197
- Issue date Apr 28, 2009
- Intel Corporation
- Vinay Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 7,402,519
- Issue date Jul 22, 2008
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-directional micromechanical latching linear actuator
- Patent number 6,607,305
- Issue date Aug 19, 2003
- Wisconsin Alumni Research Foundation
- Kevin J. Fischer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SOURCE AND DRAIN REGIONS FOR LATERALLY ADJACENT GATE-ALL-AROUND (GA...
- Publication number 20240071831
- Publication date Feb 29, 2024
- Intel Corporation
- Chang Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
- Publication number 20230197779
- Publication date Jun 22, 2023
- Intel Corporation
- Marni NABORS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TWO-LEVEL BACKEND MEMORY
- Publication number 20220415892
- Publication date Dec 29, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESUL...
- Publication number 20220415780
- Publication date Dec 29, 2022
- Intel Corporation
- William HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS ELECTROSTATIC DISCHARGE (ESD) INTEGRATED CIRCUIT STR...
- Publication number 20220199610
- Publication date Jun 23, 2022
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...
- Publication number 20220173046
- Publication date Jun 2, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220102385
- Publication date Mar 31, 2022
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...
- Publication number 20220045065
- Publication date Feb 10, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE TRANSISTORS AND METHODS OF FABRICATION
- Publication number 20210408289
- Publication date Dec 30, 2021
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...
- Publication number 20210125990
- Publication date Apr 29, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVD HARDMASK FOR DAMASCENE PATTERNING
- Publication number 20180122744
- Publication date May 3, 2018
- Intel Corporation
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVD HARDMASK FOR DAMASCENE PATTERNING
- Publication number 20170040263
- Publication date Feb 9, 2017
- Intel Corporation
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thickened Stress Relief and Power Distribution Layer
- Publication number 20170011997
- Publication date Jan 12, 2017
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20160372366
- Publication date Dec 22, 2016
- Intel Corporation
- Jun HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKENED STRESS RELIEF AND POWER DISTRIBUTION LAYER
- Publication number 20150179562
- Publication date Jun 25, 2015
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20150097292
- Publication date Apr 9, 2015
- Intel Corporation
- Jun HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP INTERCONNECT WITH HOOD LAYER AND METHOD OF FORMIING
- Publication number 20140191401
- Publication date Jul 10, 2014
- Kevin Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR ENHANCING DIELECTRIC BREAKDOWN PERFORMANCE
- Publication number 20140151889
- Publication date Jun 5, 2014
- Pavel S. Plekhanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVD HARDMASK FOR DAMASCENE PATTERNING
- Publication number 20130320564
- Publication date Dec 5, 2013
- Ruth A. Brain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP CAPACITORS AND METHODS OF ASSEMBLING SAME
- Publication number 20130270675
- Publication date Oct 17, 2013
- Michael A. Childs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION
- Publication number 20120286395
- Publication date Nov 15, 2012
- Kevin John Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...
- Publication number 20120068273
- Publication date Mar 22, 2012
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20120007242
- Publication date Jan 12, 2012
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SENSOR USING A VIBRATING MEMS RESONATOR OF A CHIP INTERCONN...
- Publication number 20110150031
- Publication date Jun 23, 2011
- Mohamed A. Abdelmoneum
- G01 - MEASURING TESTING
Information Patent Application
STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...
- Publication number 20110133259
- Publication date Jun 9, 2011
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION
- Publication number 20100224960
- Publication date Sep 9, 2010
- Kevin John Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier process/structure for transistor trench contact applications
- Publication number 20090170309
- Publication date Jul 2, 2009
- Vinay Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects having sealing structures to enable selective metal c...
- Publication number 20080179748
- Publication date Jul 31, 2008
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tuned tensile stress low resistivity slot contact structure for n-t...
- Publication number 20080157224
- Publication date Jul 3, 2008
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stressed barrier plug slot contact structure for transistor perform...
- Publication number 20080157208
- Publication date Jul 3, 2008
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS

Kevin J. Fischer

Person

Patents Grantslast 30 patents

Integrated circuit assemblies with direct chip attach to circuit bo...

Substrate-less electrostatic discharge (ESD) integrated circuit str...

Thin film transistor based memory cells on both sides of a layer of...

Thin film transistor based memory cells on both sides of a layer of...

AVD hardmask for damascene patterning

Thickened stress relief and power distribution layer

Interconnects having sealing structures to enable selective metal c...

AVD hardmask for damascene patterning

On-chip capacitors and methods of assembling same

AVD hardmask for damascene patterning

Thickened stress relief and power distribution layer

Interconnects having sealing structures to enable selective metal c...

Airgap interconnect with hood layer and method of forming

Techniques for enhancing dielectric breakdown performance

Interconnects having sealing structures to enable selective metal c...

Thermal sensor using a vibrating MEMS resonator of a chip interconn...

Stressed barrier plug slot contact structure for transistor perform...

Stressed barrier plug slot contact structure for transistor perform...

Interconnects having sealing structures to enable selective metal c...

Stressed barrier plug slot contact structure for transistor perform...

Barrier formation and structure to use in semiconductor devices

Tuned tensile stress low resistivity slot contact structure for n-t...

Reducing corrosion in copper damascene processes

Barrier process/structure for transistor trench contact applications

Interconnects having sealing structures to enable selective metal c...

Bi-directional micromechanical latching linear actuator

Patents Applicationslast 30 patents

SOURCE AND DRAIN REGIONS FOR LATERALLY ADJACENT GATE-ALL-AROUND (GA...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY

STACKED TWO-LEVEL BACKEND MEMORY

DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESUL...

SUBSTRATE-LESS ELECTROSTATIC DISCHARGE (ESD) INTEGRATED CIRCUIT STR...

INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...

SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES

THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...

NANOWIRE TRANSISTORS AND METHODS OF FABRICATION

THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...

AVD HARDMASK FOR DAMASCENE PATTERNING

AVD HARDMASK FOR DAMASCENE PATTERNING

Thickened Stress Relief and Power Distribution Layer

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

THICKENED STRESS RELIEF AND POWER DISTRIBUTION LAYER

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

AIRGAP INTERCONNECT WITH HOOD LAYER AND METHOD OF FORMIING

TECHNIQUES FOR ENHANCING DIELECTRIC BREAKDOWN PERFORMANCE

AVD HARDMASK FOR DAMASCENE PATTERNING

ON-CHIP CAPACITORS AND METHODS OF ASSEMBLING SAME

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

THERMAL SENSOR USING A VIBRATING MEMS RESONATOR OF A CHIP INTERCONN...

STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

Barrier process/structure for transistor trench contact applications

Interconnects having sealing structures to enable selective metal c...

Tuned tensile stress low resistivity slot contact structure for n-t...

Stressed barrier plug slot contact structure for transistor perform...