Kia S. Low

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC having viabar interconnection and related method
- Patent number 8,492,268
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having viabar interconnection and related method
- Patent number 8,299,622
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inclusion of low-k dielectric material between bit lines
- Patent number 7,125,790
- Issue date Oct 24, 2006
- Infineon Technologies AG
- Kia Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic switching device
- Patent number 7,097,777
- Issue date Aug 29, 2006
- Infineon Technologies AG
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Grant
Encapsulation of conductive lines of semiconductor devices
- Patent number 7,087,438
- Issue date Aug 8, 2006
- Infineon Technologies AG
- Ihar Kasko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer integration scheme in MRAM technology
- Patent number 6,985,384
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned mask to reduce cell layout area
- Patent number 6,974,770
- Issue date Dec 13, 2005
- Infineon Technologies AG
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step magnetic tunnel junction stack deposition
- Patent number 6,884,630
- Issue date Apr 26, 2005
- Infineon Technologies AG
- Arunava Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM MTJ stack to conductive line alignment method
- Patent number 6,858,441
- Issue date Feb 22, 2005
- Infineon Technologies AG
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming surface-smoothing layer for semiconductor devices...
- Patent number 6,846,683
- Issue date Jan 25, 2005
- Infineon Technologies AG
- Kia-Seng Low
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic memory
- Patent number 6,768,150
- Issue date Jul 27, 2004
- Infineon Technologies Aktiengesellschaft
- Kia Seng Low
- G11 - INFORMATION STORAGE
Information Patent Grant
Bilayer CMP process to improve surface roughness of magnetic stack...
- Patent number 6,743,642
- Issue date Jun 1, 2004
- International Business Machines Corporation
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,740,539
- Issue date May 25, 2004
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating cap layer and conductive cap layer for semiconductor dev...
- Patent number 6,680,500
- Issue date Jan 20, 2004
- Infineon Technologies AG
- Kia-Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,570,256
- Issue date May 27, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD
- Publication number 20120164758
- Publication date Jun 28, 2012
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD
- Publication number 20100032846
- Publication date Feb 11, 2010
- International Business Machines Corporation
- Dureseti Chidambarrao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation of conductive lines of semiconductor devices
- Publication number 20060019431
- Publication date Jan 26, 2006
- Ihar Kasko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic switching device
- Publication number 20050207064
- Publication date Sep 22, 2005
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
Inclusion of low-k dielectric material between bit lines
- Publication number 20050085096
- Publication date Apr 21, 2005
- Infineon Technologies North America Corp.
- Kia Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned mask to reduce cell layout area
- Publication number 20040259358
- Publication date Dec 23, 2004
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER CMP PROCESS TO IMPROVE SURFACE ROUGHNESS OF MAGNETIC STACK...
- Publication number 20040087038
- Publication date May 6, 2004
- International Business Machines Corporation
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
Two-step magnetic tunnel junction stack deposition
- Publication number 20040087039
- Publication date May 6, 2004
- Arunava Gupta
- B82 - NANO-TECHNOLOGY
Information Patent Application
Patterning metal stack layers of magnetic switching device, utilizi...
- Publication number 20040084400
- Publication date May 6, 2004
- Gregory Costrini
- G11 - INFORMATION STORAGE
Information Patent Application
Spacer integration scheme in MRAM technology
- Publication number 20040063223
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM MTJ stack to conductive line alignment method
- Publication number 20040043579
- Publication date Mar 4, 2004
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CAP LAYER AND CONDUCTIVE CAP LAYER FOR SEMICONDUCTOR DEV...
- Publication number 20040021188
- Publication date Feb 5, 2004
- Infineon Technologies North America Corp.
- Kia-Seng Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-smoothing conductive layer for semiconductor devices with m...
- Publication number 20030211726
- Publication date Nov 13, 2003
- Infineon Technologies North America Corp.
- Kia-Seng Low
- G11 - INFORMATION STORAGE
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030153198
- Publication date Aug 14, 2003
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030017642
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single step chemical mechanical polish process to improve the surfa...
- Publication number 20020098705
- Publication date Jul 25, 2002
- Infineon Technologies North America Corp.
- Kia-Seng Low
- B82 - NANO-TECHNOLOGY

Person

Patents Grantslast 30 patents

IC having viabar interconnection and related method

IC having viabar interconnection and related method

Inclusion of low-k dielectric material between bit lines

Magnetic switching device

Encapsulation of conductive lines of semiconductor devices

Spacer integration scheme in MRAM technology

Self-aligned mask to reduce cell layout area

Two-step magnetic tunnel junction stack deposition

MRAM MTJ stack to conductive line alignment method

Method of forming surface-smoothing layer for semiconductor devices...

Magnetic memory

Bilayer CMP process to improve surface roughness of magnetic stack...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Insulating cap layer and conductive cap layer for semiconductor dev...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Patents Applicationslast 30 patents

IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD

IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD

Encapsulation of conductive lines of semiconductor devices

Magnetic switching device

Inclusion of low-k dielectric material between bit lines

Self-aligned mask to reduce cell layout area

BILAYER CMP PROCESS TO IMPROVE SURFACE ROUGHNESS OF MAGNETIC STACK...

Two-step magnetic tunnel junction stack deposition

Patterning metal stack layers of magnetic switching device, utilizi...

Spacer integration scheme in MRAM technology

MRAM MTJ stack to conductive line alignment method

INSULATING CAP LAYER AND CONDUCTIVE CAP LAYER FOR SEMICONDUCTOR DEV...

Surface-smoothing conductive layer for semiconductor devices with m...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Single step chemical mechanical polish process to improve the surfa...