Kien N. CHUC

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flow control features of CVD chambers
- Patent number 12,146,219
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kien N. Chuc
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit for a high throughput processing chamber
- Patent number 11,512,391
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Kalyanjit Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Radio frequency conduit
- Patent number D946534
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Adam Fischbach
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Modulating film properties by optimizing plasma coupling materials
- Patent number 11,270,905
- Issue date Mar 8, 2022
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical control features in wafer process equipment
- Patent number 11,264,213
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit for a high throughput processing chamber
- Patent number 10,724,138
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- Kalyanjit Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro-volume deposition chamber
- Patent number 10,711,347
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Dale R. DuBois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flow control features of CVD chambers
- Patent number 10,550,472
- Issue date Feb 4, 2020
- Applied Materials, Inc.
- Kien N. Chuc
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical control features in wafer process equipment
- Patent number 10,354,843
- Issue date Jul 16, 2019
- Applied Materials, Inc.
- Qiwei Liang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor processing system and methods using capacitively coup...
- Patent number 10,283,321
- Issue date May 7, 2019
- Applied Materials, Inc.
- Jang-Gyoo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas distribution apparatus for processing chambers
- Patent number 10,240,234
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Dale R. Du Bois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit including flow isolator ring
- Patent number 10,113,231
- Issue date Oct 30, 2018
- Applied Materials, Inc.
- Dale R. Dubois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit for a high throughput processing chamber
- Patent number 10,017,855
- Issue date Jul 10, 2018
- Applied Materials, Inc.
- Kalyanjit Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical control features in wafer process equipment
- Patent number 9,978,564
- Issue date May 22, 2018
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing system and methods using capacitively coup...
- Patent number 9,144,147
- Issue date Sep 22, 2015
- Applied Materials, Inc.
- Jang-Gyoo Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical control features in wafer process equipment
- Patent number 9,132,436
- Issue date Sep 15, 2015
- Applied Materials, Inc.
- Qiwei Liang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Flow control features of CVD chambers
- Patent number 8,894,767
- Issue date Nov 25, 2014
- Applied Materials, Inc.
- Kien N. Chuc
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma source design
- Patent number 8,771,538
- Issue date Jul 8, 2014
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma source design
- Patent number 8,742,665
- Issue date Jun 3, 2014
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor inductive coil antenna with flat surface facing the...
- Patent number 6,401,652
- Issue date Jun 11, 2002
- Applied Materials, Inc.
- Jonathan D. Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and dry vapor generator channel assembly for conveying a liq...
- Patent number 5,537,508
- Issue date Jul 16, 1996
- Applied Materials, Inc.
- Peter F. Ebbing
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Calibration technique for monochromators and spectrophotometers
- Patent number 5,212,537
- Issue date May 18, 1993
- Applied Materials, Inc.
- Monoocher Birang
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus to inhibit obstruction of optical transmission...
- Patent number 5,129,994
- Issue date Jul 14, 1992
- Applied Materials, Inc.
- Peter F. Ebbing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULATING FILM PROPERTIES BY OPTIMIZING PLASMA COUPLING MATERIALS
- Publication number 20210005500
- Publication date Jan 7, 2021
- Applied Materials, Inc.
- Eswaranand VENKATASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER
- Publication number 20200325577
- Publication date Oct 15, 2020
- Applied Materials, Inc.
- Kalyanjit GHOSH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLOW CONTROL FEATURES OF CVD CHAMBERS
- Publication number 20200149166
- Publication date May 14, 2020
- Applied Materials, Inc.
- Kien N. CHUC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT
- Publication number 20190385823
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Qiwei Liang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER
- Publication number 20180274095
- Publication date Sep 27, 2018
- Applied Materials, Inc.
- Kalyanjit GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas Distribution Apparatus for Processing Chambers
- Publication number 20180237915
- Publication date Aug 23, 2018
- Applied Materials, Inc.
- Dale R. DU BOIS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Micro-Volume Deposition Chamber
- Publication number 20170298509
- Publication date Oct 19, 2017
- Applied Materials, Inc.
- Dale R. DuBois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT
- Publication number 20170236691
- Publication date Aug 17, 2017
- Applied Materials, Inc.
- Qiwei Liang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20170226637
- Publication date Aug 10, 2017
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS KIT INCLUDING FLOW ISOLATOR RING
- Publication number 20160312359
- Publication date Oct 27, 2016
- Applied Materials, Inc.
- Dale R. DUBOIS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER
- Publication number 20160181088
- Publication date Jun 23, 2016
- Applied Materials, Inc.
- Kalyanjit GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT
- Publication number 20160005572
- Publication date Jan 7, 2016
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLOW CONTROL FEATURES OF CVD CHAMBERS
- Publication number 20150013793
- Publication date Jan 15, 2015
- Applied Materials, Inc.
- Kien N. CHUC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT
- Publication number 20140097270
- Publication date Apr 10, 2014
- Applied Materials, Inc.
- Qiwei Liang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20140083362
- Publication date Mar 27, 2014
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...
- Publication number 20130153148
- Publication date Jun 20, 2013
- Applied Materials, Inc.
- Jang-Gyoo Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...
- Publication number 20130082197
- Publication date Apr 4, 2013
- Applied Materials, Inc.
- Jang-Gyoo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...
- Publication number 20120180954
- Publication date Jul 19, 2012
- Applied Materials, Inc.
- Jang-Gyoo Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20120073501
- Publication date Mar 29, 2012
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA SOURCE DESIGN
- Publication number 20110115378
- Publication date May 19, 2011
- Applied Materials, Inc.
- Dmitry LUBOMIRSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SOURCE DESIGN
- Publication number 20110114601
- Publication date May 19, 2011
- Applied Materials, Inc.
- Dmitry LUBOMIRSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW CONTROL FEATURES OF CVD CHAMBERS
- Publication number 20110011338
- Publication date Jan 20, 2011
- Applied Materials, Inc.
- Kien N. Chuc
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20070289534
- Publication date Dec 20, 2007
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20070281106
- Publication date Dec 6, 2007
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS CHAMBER FOR DIELECTRIC GAPFILL
- Publication number 20070277734
- Publication date Dec 6, 2007
- Applied Materials, Inc.
- Dmitry Lubomirsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kien N. CHUC

Person

Patents Grantslast 30 patents

Flow control features of CVD chambers

Process kit for a high throughput processing chamber

Radio frequency conduit

Modulating film properties by optimizing plasma coupling materials

Chemical control features in wafer process equipment

Process kit for a high throughput processing chamber

Micro-volume deposition chamber

Flow control features of CVD chambers

Chemical control features in wafer process equipment

Semiconductor processing system and methods using capacitively coup...

Gas distribution apparatus for processing chambers

Process kit including flow isolator ring

Process kit for a high throughput processing chamber

Chemical control features in wafer process equipment

Semiconductor processing system and methods using capacitively coup...

Chemical control features in wafer process equipment

Flow control features of CVD chambers

Plasma source design

Plasma source design

Plasma reactor inductive coil antenna with flat surface facing the...

Method and dry vapor generator channel assembly for conveying a liq...

Calibration technique for monochromators and spectrophotometers

Method and apparatus to inhibit obstruction of optical transmission...

Patents Applicationslast 30 patents

MODULATING FILM PROPERTIES BY OPTIMIZING PLASMA COUPLING MATERIALS

PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER

FLOW CONTROL FEATURES OF CVD CHAMBERS

CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT

PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER

Gas Distribution Apparatus for Processing Chambers

Micro-Volume Deposition Chamber

CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT

PROCESS CHAMBER FOR DIELECTRIC GAPFILL

PROCESS KIT INCLUDING FLOW ISOLATOR RING

PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER

CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT

FLOW CONTROL FEATURES OF CVD CHAMBERS

CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT

PROCESS CHAMBER FOR DIELECTRIC GAPFILL

SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...

SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...

SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUP...

PROCESS CHAMBER FOR DIELECTRIC GAPFILL

PLASMA SOURCE DESIGN

PLASMA SOURCE DESIGN

FLOW CONTROL FEATURES OF CVD CHAMBERS

PROCESS CHAMBER FOR DIELECTRIC GAPFILL

PROCESS CHAMBER FOR DIELECTRIC GAPFILL

PROCESS CHAMBER FOR DIELECTRIC GAPFILL