Chemical control features in wafer process equipment

Information

  • Patent Grant
  • 11264213
  • Patent Number
    11,264,213
  • Date Filed
    Monday, July 15, 2019
    5 years ago
  • Date Issued
    Tuesday, March 1, 2022
    2 years ago
Abstract
Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.
Description
TECHNICAL FIELD

The present technology relates to semiconductor processes and equipment. More specifically, the present technology relates to processing system plasma components.


BACKGROUND

Integrated circuits are made possible by processes which produce intricately patterned material layers on substrate surfaces. Producing patterned material on a substrate requires controlled methods for removal of exposed material. Chemical etching is used for a variety of purposes including transferring a pattern in photoresist into underlying layers, thinning layers, or thinning lateral dimensions of features already present on the surface. Often it is desirable to have an etch process that etches one material faster than another facilitating, for example, a pattern transfer process. Such an etch process is said to be selective to the first material. As a result of the diversity of materials, circuits, and processes, etch processes have been developed with a selectivity towards a variety of materials.


Dry etches produced in local plasmas formed within the substrate processing region can penetrate more constrained trenches and exhibit less deformation of delicate remaining structures. However, as integrated circuit technology continues to scale down in size, the equipment that delivers the precursors can impact the uniformity and quality of the precursors and plasma species used.


Thus, there is a need for improved system components that can be used in plasma environments effectively while providing suitable degradation profiles. These and other needs are addressed by the present technology.


SUMMARY

Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.


The assemblies may include an annular body having an inner annular wall located at an inner diameter, an outer annular wall located at an outer diameter, as well as an upper surface and a lower surface. The annular body may further include a first upper recess formed in the upper surface, a first lower recess formed in the lower surface at the inner annular wall, and a second lower recess formed in the lower surface below and radially outward of the first lower recess. The annular body may also define a first fluid channel in the upper surface that is located in the annular body radially inward of the first upper recess. The assemblies may include an upper plate coupled with the annular body at the first upper recess and covering the first fluid channel, and the upper plate may define a plurality of first apertures. The assemblies may also include a lower plate coupled with the annular body at the first lower recess and having a plurality of second apertures defined in the plate where the second apertures align with the first apertures defined in the upper plate. The lower plate may also define a plurality of third apertures located between the second apertures. The upper and lower plates may be coupled with one another such that the first and second apertures are aligned to form a channel through the upper and lower plates.


The upper and lower plates of the assemblies may be bonded together. The annular body of the assemblies may further define a second fluid channel in the upper surface that is located radially outward of the first fluid channel, and a plurality of ports may be defined in a portion of the annular body defining an outer wall of the first fluid channel and an inner wall of the second fluid channel. The second fluid channel may be located radially outward of the upper recess such that the second fluid channel is not covered by the upper plate. The annular body may define a second upper recess near the top of the second fluid channel in both the inner wall and an outer wall, and the gas distribution assembly may include an annular member positioned within the second upper recess so as to cover the second fluid channel. The upper recess may include a bottom portion that intersects the outer wall of the first fluid channel.


The assemblies may further include a pair of isolation channels, where one of the pair of isolation channels is defined in the upper surface of the annular body, and the other of the pair of isolation channels is defined in the lower surface of the annular body. The pair of isolation channels may be vertically aligned with one another. The second fluid channel may be located radially inward of the upper recess such that the second fluid channel is covered by the upper plate in embodiments. A portion of the upper plate may also extend into the second channel below a bottom of the upper recess. The plurality of ports may be angled upward from the second fluid channel to the first fluid channel such that the ports are fluidly accessible below the portion of the upper plate extending into the second channel. The isolation channels may be disposed in embodiments so that one of the pair of isolation channels is defined in the upper plate at a location radially inward from the upper recess, and the other of the pair of isolation channels is defined in the lower surface of the annular body so that the pair of isolation channels are vertically aligned with one another. The annular body may also define an annular temperature channel configured to receive a cooling fluid operable to maintain a temperature of the annular body. The temperature channel may also be configured to receive a heating element disposed within the channel and operable to maintain a temperature of the annular body.


Gas distribution assemblies are also described that may include an annular body. The annular body may include an inner annular wall located at an inner diameter, an outer annular wall located at an outer diameter, and an upper surface and a lower surface. An upper recess may be formed in the upper surface and a lower recess may be formed in the lower surface. A first fluid channel may be defined in the lower surface that is located in the annular body radially inward of the lower recess. The assemblies may also include an upper plate coupled with the annular body at the upper recess, where the upper plate defines a plurality of first apertures. The assemblies may also include a lower plate coupled with the annular body at the lower recess, and covering the first fluid channel. The lower plate may define a plurality of second apertures that align with the first apertures defined in the upper plate. The lower plate may further define a plurality of third apertures located between the second apertures. The upper and lower plates may be coupled with one another such that the first and second apertures are aligned to form a channel through the upper and lower plates.


The gas distribution assemblies may include a second fluid channel defined in the lower surface that is located in the annular body radially outward of the first fluid channel. A plurality of ports may be defined in a portion of the annular body defining an outer wall of the first fluid channel and an inner wall of the second fluid channel, and the plurality of ports may be configured to fluidly couple the second fluid channel with the first fluid channel. The second fluid channel may be located radially inward of the lower recess such that the second fluid channel may be covered by the lower plate, and where a portion of the lower plate extends into the second channel above a top of the lower recess. The plurality of ports may be angled downward from the second fluid channel to the first fluid channel such that the ports are fluidly accessible above the portion of the lower plate extending into the second channel. The first apertures may also have a conical shape of decreasing diameter as the first apertures extend through the upper plate. The second and third apertures may have a conical shape of increasing diameter as the second and third apertures extend through the lower plate. Each of the second and third apertures may also include at least three sections of different shape or diameter.


Gas distribution assemblies are also described having an annular body having an inner wall located at an inner diameter, an outer wall located at an outer diameter, an upper surface, and a lower surface. The assemblies may also include an upper plate coupled with the annular body, and the upper plate may define a plurality of first apertures. An intermediate plate may be coupled with the upper plate, and the intermediate plate may define a plurality of second and third apertures, where the second apertures align with the first apertures of the upper plate. The assemblies may also include a lower plate coupled with the annular body and the intermediate plate. The lower plate may define a plurality of fourth apertures that align with the first apertures of the upper plate and the second apertures of the intermediate plate to form a first set of fluid channels through the plates. The lower plate may also define a plurality of fifth apertures that align with the third apertures of the intermediate plate to form a second set of fluid channels through the intermediate and lower plates, where the second set of fluid channels are fluidly isolated from the first set of fluid channels. The lower plate may further define a sixth set of apertures that form a third set of fluid channels through the lower plate, where the third set of fluid channels are fluidly isolated from the first and second set of fluid channels.


The lower plate of the gas distribution assemblies may include an orientation of the fourth, fifth, and sixth apertures such that a majority of fourth apertures are each surrounded by at least four of the fifth apertures and four of the sixth apertures. The fifth apertures may be located around the fourth apertures with centers of the fifth apertures at about 90° intervals from one another about a center of the fourth apertures, and the sixth apertures may be located around the fourth apertures with centers of the sixth apertures at about 90° intervals from one another about the center of the fourth apertures and offset from the fifth apertures by about 45°. The fifth apertures may be located around the fourth apertures with centers of the fifth apertures at about 60° intervals from one another about a center of the fourth apertures, and where the sixth apertures are located around the fourth apertures with centers of the sixth apertures at about 60° intervals from one another about the center of the fourth apertures and offset from the fifth apertures by about 30°.


Such technology may provide numerous benefits over conventional systems and techniques. For example, leakage through the assembly may be minimized or avoided providing improved flow characteristics, which may lead to improved process uniformity. Additionally, multiple precursors may be delivered through the assembly while being maintained fluidly isolated from one another. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the below description and attached figures.





BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings.



FIG. 1 shows a top plan view of one embodiment of an exemplary processing tool.



FIGS. 2A-2E show schematic cross-sectional views of an exemplary processing chamber.



FIGS. 3A-3E show schematic views of exemplary showerhead configurations according to the disclosed technology.



FIGS. 4A-4B show additional schematic views of exemplary showerhead configurations according to the disclosed technology.



FIGS. 5A-5C show additional schematic views of exemplary showerhead configurations according to the disclosed technology.





In the appended figures, similar components and/or features may have the same numerical reference label. Further, various components of the same type may be distinguished by following the reference label by a letter that distinguishes among the similar components and/or features. If only the first numerical reference label is used in the specification, the description is applicable to any one of the similar components and/or features having the same first numerical reference label irrespective of the letter suffix.


DETAILED DESCRIPTION

The present technology includes improved gas distribution assembly or showerhead designs for distributing processing gases to produce flow patterns for forming deposition layers on a semiconductor substrate of a more uniform height and/or etching deposited layers in a more uniform fashion. While conventional showerhead designs may simply provide pass-through distribution systems for processing and precursor gases, the presently described technology allows for improved control of the flow characteristics of gases as they are delivered to a substrate processing chamber. In so doing, deposition operations may produce more accurate film profiles during manufacturing operations.


Although some conventional gas distribution assemblies or showerheads may include multiple fluid channels covered by a plate, for example, such designs routinely suffer from gaps along the intersections of the plate with the portions of the body located between the channels and the inner walls. When the plate is coupled with the body, for example via bonding, brazing, etc., the plate may warp. Because the coupling may be performed only around the outer edge, no additional bonding may exist at other interfaces of the plate and body. Even slight warping of the plate may produce an uneven surface at the interfaces between the upper plate and annular body, and interface locations where warping has occurred may not properly couple with the annular body. As such, in operation, fluid may leak between the first and second fluid channels, as well as between the first fluid channel and a central region. Such leakage can affect fluid delivery into the processing region, which can impact deposition or etching. Aspects of the present technology, however, overcome many if not all of these issues by providing components that are less likely to warp, and/or designs that are less impacted by warping.



FIG. 1 shows a top plan view of one embodiment of a processing tool 100 of deposition, etching, baking, and/or curing chambers according to disclosed embodiments. In the figure, a pair of FOUPs (front opening unified pods) 102 supply substrates (e.g., various specified diameter semiconductor wafers) that may be received by robotic arms 104 and placed into a low-pressure holding area 106 before being placed into one of the substrate processing sections 108a-f of the tandem process chambers 109a-c. A second robotic arm 110 may be used to transport the substrates from the holding area 106 to the processing chambers 108a-f and back.


The substrate processing sections 108a-f of the tandem process chambers 109a-c may include one or more system components for depositing, annealing, curing and/or etching substrates or films thereon. Exemplary films may be flowable dielectrics, but many types of films may be formed or processed with the processing tool. In one configuration, two pairs of the tandem processing sections of the processing chamber (e.g., 108c-d and 108e-f) may be used to deposit the dielectric material on the substrate, and the third pair of tandem processing sections (e.g., 108a-b) may be used to anneal the deposited dielectric. In another configuration, the two pairs of the tandem processing sections of processing chambers (e.g., 108c-d and 108e-f) may be configured to both deposit and anneal a dielectric film on the substrate, while the third pair of tandem processing sections (e.g., 108a-b) may be used for UV or E-beam curing of the deposited film. In still another configuration, all three pairs of tandem processing sections (e.g., 108a-f) may be configured to deposit and cure a dielectric film on the substrate or etch features into a deposited film.


In yet another configuration, two pairs of tandem processing sections (e.g., 108c-d and 108e-f) may be used for both deposition and UV or E-beam curing of the dielectric, while a third pair of tandem processing sections (e.g. 108a-b) may be used for annealing the dielectric film. In addition, one or more of the tandem processing sections 108a-f may be configured as a treatment chamber, and may be a wet or dry treatment chamber. These process chambers may include heating the dielectric film in an atmosphere that includes moisture. Thus, embodiments of system 100 may include wet treatment tandem processing sections 108a-b and anneal tandem processing sections 108c-d to perform both wet and dry anneals on the deposited dielectric film. It will be appreciated that additional configurations of deposition, annealing, and curing chambers for dielectric films are contemplated by system 100.



FIG. 2A is a cross-sectional view of an exemplary process chamber section 200 with partitioned plasma generation regions within the processing chambers. During film deposition (e.g., silicon oxide, silicon nitride, silicon oxynitride, or silicon oxycarbide), a process gas may be flowed into the first plasma region 215 through a gas inlet assembly 205. A remote plasma system (RPS) 201 may process a gas which then travels through gas inlet assembly 205. Two distinct gas supply channels are visible within the gas inlet assembly 205. A first channel 206 carries a gas that passes through the remote plasma system (RPS) 201, while a second channel 207 bypasses the RPS 201. The first channel 206 may be used for the process gas and the second channel 207 may be used for a treatment gas in disclosed embodiments. The process gas may be excited prior to entering the first plasma region 215 within a remote plasma system (RPS) 201. A lid 212, a showerhead 225, and a substrate support 265, having a substrate 255 disposed thereon, are shown according to disclosed embodiments. The lid 212 may be pyramidal, conical, or of another similar structure with a narrow top portion expanding to a wide bottom portion. Additional geometries of the lid 212 may also be used. The lid (or conductive top portion) 212 and showerhead 225 are shown with an insulating ring 220 in between, which allows an AC potential to be applied to the lid 212 relative to showerhead 225. The insulating ring 220 may be positioned between the lid 212 and the showerhead 225 enabling a capacitively coupled plasma (CCP) to be formed in the first plasma region. A baffle (not shown) may additionally be located in the first plasma region 215 to affect the flow of fluid into the region through gas inlet assembly 205.


A fluid, such as a precursor, for example a silicon-containing precursor, may be flowed into the processing region 233 by embodiments of the showerhead described herein. Excited species derived from the process gas in the plasma region 215 may travel through apertures in the showerhead 225 and react with the precursor flowing into the processing region 233 from the showerhead. Little or no plasma may be present in the processing region 233. Excited derivatives of the process gas and the precursor may combine in the region above the substrate and, on occasion, on the substrate to form a film on the substrate that may be flowable in disclosed applications. For flowable films, as the film grows, more recently added material may possess a higher mobility than underlying material. Mobility may decrease as organic content is reduced by evaporation. Gaps may be filled by the flowable film using this technique without leaving traditional densities of organic content within the film after deposition is completed. A curing step may still be used to further reduce or remove the organic content from a deposited film.


Exciting the process gas in the first plasma region 215 directly, exciting the process gas in the RPS, or both, may provide several benefits. The concentration of the excited species derived from the process gas may be increased within the processing region 233 due to the plasma in the first plasma region 215. This increase may result from the location of the plasma in the first plasma region 215. The processing region 233 may be located closer to the first plasma region 215 than the remote plasma system (RPS) 201, leaving less time for the excited species to leave excited states through collisions with other gas molecules, walls of the chamber, and surfaces of the showerhead.


The uniformity of the concentration of the excited species derived from the process gas may also be increased within the processing region 233. This may result from the shape of the first plasma region 215, which may be more similar to the shape of the processing region 233. Excited species created in the remote plasma system (RPS) 201 may travel greater distances in order to pass through apertures near the edges of the showerhead 225 relative to species that pass through apertures near the center of the showerhead 225. The greater distance may result in a reduced excitation of the excited species and, for example, may result in a slower growth rate near the edge of a substrate. Exciting the process gas in the first plasma region 215 may mitigate this variation.


The processing gas may be excited in the RPS 201 and may be passed through the showerhead 225 to the processing region 233 in the excited state. Alternatively, power may be applied to the first processing region to either excite a plasma gas or enhance an already exited process gas from the RPS. While a plasma may be generated in the processing region 233, a plasma may alternatively not be generated in the processing region. In one example, the only excitation of the processing gas or precursors may be from exciting the processing gas in the RPS 201 to react with the precursors in the processing region 233.


The processing chamber and this discussed tool are more fully described in patent application Ser. No. 12/210,940 filed on Sep. 15, 2008, and patent application Ser. No. 12/210,982 filed on Sep. 15, 2008, which are incorporated herein by reference to the extent not inconsistent with the claimed aspects and description herein.



FIGS. 2B-2C are side schematic views of one embodiment of the precursor flow processes in the processing chambers and the gas distribution assemblies described herein. The gas distribution assemblies for use in the processing chamber section 200 may be referred to as dual channel showerheads (DCSH) or triple channel showerheads (TCSH) and are detailed in the embodiments described in FIGS. 3A-3G, 4A-4B, and 5A-5C herein. The dual or triple channel showerhead may allow for flowable deposition of a dielectric material, and separation of precursor and processing fluids during operation. The showerhead may alternatively be utilized for etching processes that allow for separation of etchants outside of the reaction zone to provide limited interaction with chamber components.


Precursors may be introduced into the distribution zone by first being introduced into an internal showerhead volume 294 defined in the showerhead 225 by a first manifold 226, or upper plate, and second manifold 227, or lower plate. The manifolds may be perforated plates that define a plurality of apertures. The precursors in the internal showerhead volume 294 may flow 295 into the processing region 233 via apertures 296 formed in the lower plate. This flow path may be isolated from the rest of the process gases in the chamber, and may provide for the precursors to be in an unreacted or substantially unreacted state until entry into the processing region 233 defined between the substrate 217 and a bottom of the lower plate 227. Once in the processing region 233, the precursor may react with a processing gas. The precursor may be introduced into the internal showerhead volume 294 defined in the showerhead 225 through a side channel formed in the showerhead, such as channels 322, 422 as shown in the showerhead embodiments herein. The process gas may be in a plasma state including radicals from the RPS unit or from a plasma generated in the first plasma region. Additionally, a plasma may be generated in the processing region.


Processing gases may be provided into the first plasma region 215, or upper volume, defined by the faceplate 217 and the top of the showerhead 225. The processing gas may be plasma excited in the first plasma region 215 to produce process gas plasma and radicals. Alternatively, the processing gas may already be in a plasma state after passing through a remote plasma system prior to introduction to the first plasma processing region 215 defined by the faceplate 217 and the top of the showerhead 225.


The processing gas including plasma and radicals may then be delivered to the processing region 233 for reaction with the precursors though channels, such as channels 290, formed through the apertures in the showerhead plates or manifolds. The processing gasses passing though the channels may be fluidly isolated from the internal showerhead volume 294 and may not react with the precursors passing through the internal showerhead volume 294 as both the processing gas and the precursors pass through the showerhead 225. Once in the processing volume, the processing gas and precursors may mix and react.


In addition to the process gas and a dielectric material precursor, there may be other gases introduced at varied times for varied purposes. A treatment gas may be introduced to remove unwanted species from the chamber walls, the substrate, the deposited film and/or the film during deposition. A treatment gas may be excited in a plasma and then used to reduce or remove residual content inside the chamber. In other disclosed embodiments the treatment gas may be used without a plasma. When the treatment gas includes water vapor, the delivery may be achieved using a mass flow meter (MFM), an injection valve, or by commercially available water vapor generators. The treatment gas may be introduced from the first processing region, either through the RPS unit or bypassing the RPS unit, and may further be excited in the first plasma region.


The axis 292 of the opening of apertures 291 and the axis 297 of the opening of apertures 296 may be parallel or substantially parallel to one another. Alternatively, the axis 292 and axis 297 may be angled from each other, such as from about 1° to about 80°, for example, from about 1° to about 30°. Alternatively, each of the respective axes 292 may be angled from each other, such as from about 1° to about 80°, for example, from about 1° to about 30°, and each of the respective axis 297 may be angled from each other, such as from about 1° to about 80°, for example, from about 1° to about 30°.


The respective openings may be angled, such as shown for aperture 291 in FIG. 2B, with the opening having an angle from about 1° to about 80°, such as from about 1° to about 30°. The axis 292 of the opening of apertures 291 and the axis 297 of the opening of apertures 296 may be perpendicular or substantially perpendicular to the surface of the substrate 217. Alternatively, the axis 292 and axis 297 may be angled from the substrate surface, such as less than about 5°.



FIG. 2C illustrates a partial schematic view of the processing chamber 200 and showerhead 225 illustrating the precursor flow 295 from the internal volume 294 through apertures 296 into the processing region 233. The figure also illustrates an alternative embodiment showing axis 297 and 297′ of two apertures 296 being angled from one another.



FIG. 2D shows a simplified cross-sectional view of another exemplary processing system 200 according to embodiments of the present technology that may include an alternative fluid delivery system. Distribution of the processing gas may be achieved by use of a faceplate 217 as shown. Processing gases may be delivered through a fluid supply system 210, and the chamber may or may not include components as previously described including RPS 201, first plasma region 215, insulating ring 220, showerhead 225, processing region 233, pedestal 265, and substrate 255. The system may also include cooling plate 203 in the modified distribution system.


Plasma generating gases and/or plasma excited species, depending on use of the RPS 201, may pass through a plurality of holes, shown in FIG. 2E, in faceplate 217 for a more uniform delivery into the first plasma region 215. Exemplary configurations include having the gas inlet assembly 205 open into a gas supply region 258 partitioned from the first plasma region 215 by faceplate 217 so that the gases/species flow through the holes in the faceplate 217 into the first plasma region 215. Structural and operational features may be selected to prevent significant backflow of plasma from the first plasma region 215 back into the supply region 258, gas inlet assembly 205, and fluid supply system 210. The structural features may include the selection of dimensions and cross-sectional geometry of the apertures in faceplate 217 that deactivates back-streaming plasma. The operational features may include maintaining a pressure difference between the gas supply region 258 and first plasma region 215 that maintains a unidirectional flow of plasma through the showerhead 225.


The processing system may further include a power supply 240 electrically coupled with the processing chamber to provide electric power to the faceplate 217 and/or showerhead 225 to generate a plasma in the first plasma region 215 or processing region 233. The power supply may be configured to deliver an adjustable amount of power to the chamber depending on the process performed.



FIG. 2E shows a detailed view of the features affecting the processing gas distribution through faceplate 217. As shown in FIGS. 2D and 2E, faceplate 217, cooling plate 203, and gas inlet assembly 205 intersect to define a gas supply region 258 into which process gases may be delivered from gas inlet 205. The gases may fill the gas supply region 258 and flow to first plasma region 215 through apertures 259 in faceplate 217. The apertures 259 may be configured to direct flow in a substantially unidirectional manner such that process gases may flow into processing region 233, but may be partially or fully prevented from backflow into the gas supply region 258 after traversing the faceplate 217.


An additional dual-channel showerhead, as well as this processing system and chamber, are more fully described in patent application Ser. No. 13/251,714 filed on Oct. 3, 2011, which is hereby incorporated by reference for all purposes to the extent not inconsistent with the claimed features and description herein.



FIG. 3A illustrates an upper perspective view of a gas distribution assembly 300. In usage, the gas distribution system 300 may have a substantially horizontal orientation such that an axis of the gas apertures formed therethrough may be perpendicular or substantially perpendicular to the plane of the substrate support (see substrate support 265 in FIG. 2A). FIG. 3B illustrates a bottom perspective view of the gas distribution assembly 300. FIG. 3C is a bottom plan view of the gas distribution assembly 300. FIGS. 3D and 3E are cross sectional views of disclosed embodiments of gas distribution assembly 300 taken along line A-A of FIG. 3C.


Referring to FIGS. 3A-3E, the gas distribution assembly 300 generally includes the annular body 340, the upper plate 320, and the lower plate 325. The annular body 340 may be a ring which has an inner annular wall 301 located at an inner diameter, an outer annular wall 305 located at an outer diameter, an upper surface 315, and a lower surface 310. The upper surface 315 and lower surface 310 define the thickness of the annular body 340. A conduit 350 or annular temperature channel may be defined within the annular body and may be configured to receive a cooling fluid or a heating element that may be used to maintain or regulate the temperature of the annular body. As shown in FIG. 3A, the cooling channel 350 may include an inlet and outlet on the outer diameter 305 of the annular body. This may provide access from the side of the processing chamber from which a cooling fluid may be flowed. An additional embodiment is shown in FIG. 3B, in which conduit 355 may be formed in the bottom surface 310 and a heating element may be disposed therein. A heater recess 342 may be formed in the bottom surface 310 and be adapted to hold the heating element, and which provides access for disposing the heating element within the annular temperature channel or conduit 355.


One or more recesses and/or channels may be formed in or defined by the annular body as shown in disclosed embodiments including that illustrated in FIG. 3D. The annular body may include an upper recess 303 formed in the upper surface, and a first lower recess 302 formed in the lower surface at the inner annular wall 301. The upper recess 303 may be a first upper recess formed in the annular body 340. The annular body may also include a second lower recess 304 formed in the lower surface 310 below and radially outward from the first lower recess 302. As shown in FIG. 3D, a first fluid channel 306 may be defined in the upper surface 315, and may be located in the annular body radially inward of the upper recess 303. The first fluid channel 306 may be annular in shape and be formed the entire distance around the annular body 340. In disclosed embodiments, a bottom portion of the upper recess 303 intersects an outer wall of the first fluid channel 306. The first fluid channel may also be at least partially radially outward of the second lower recess 304. A plurality of ports 312 may be defined in an inner wall of the first fluid channel, also the inner annular wall 301 of the annular body 340. The ports 312 may provide access between the first fluid channel and the internal volume defined between the upper plate 320 and lower plate 325. The ports may be defined around the circumference of the channel at specific intervals, and may facilitate distribution across the entire region of the volume defined between the upper and lower plates. The intervals of spacing between the ports 312 may be constant, or may be varied in different locations to affect the flow of fluid into the volume. The inner and outer walls, radially, of the first fluid channel 306 may be of similar or dissimilar height. For example, the inner wall may be formed higher than the outer wall to affect the distribution of fluids in the first fluid channel to avoid or substantially avoid the flow of fluid over the inner wall of the first fluid channel.


Again referring to FIG. 3D, a second fluid channel 308a may be defined in the upper surface 315 that is located in the annular body radially outward of the first fluid channel 306. Second fluid channel 308a may be an annular shape and be located radially outward from and concentric with first fluid channel 306. The second fluid channel 308a may also be located radially outward of the first upper recess 303 such that the second fluid channel 308a is not covered by the upper plate 320 as discussed below. A second plurality of ports 314 may be defined in the portion of the annular body 340 defining the outer wall of the first fluid channel 306 and the inner wall of the second fluid channel 308a. The second plurality of ports 314 may be located at intervals of a pre-defined distance around the channel to provide fluid access to the first fluid channel 306 at several locations about the second fluid channel 308a. A second upper recess 309 may be formed in a top portion of the second fluid channel 308a in both the inner wall and outer wall of the second fluid channel. The second upper recess may be configured to receive an annular member 316 that may be positioned to cover the second fluid channel by extending radially inward and outward into the annular body past the inner and outer walls of the channel into the recess spaces 309. The annular member 316 may be braised or bonded with the annular body 340 to fluidly isolate the second fluid channel 308a from above. In operation, a precursor may be flowed from outside the process chamber to a delivery channel 322 located in the side of the annular body 340. The fluid may flow into the second fluid channel 308a, through the second plurality of ports 314 into the first fluid channel 306, through the first plurality of ports 312 into the internal volume defined between the upper and lower plates, and through the third apertures 375 located in the bottom plate. As such, a fluid provided in such a fashion can be isolated or substantially isolated from any fluid delivered into the first plasma region through apertures 360 until the fluids separately exit the lower plate 325.


By providing annular member 316 to cover the second fluid channel 308a, leakage between the first and second fluid channels may be substantially eliminated, and in disclosed embodiments may be completely eliminated. Annular member 316 may be coupled with the annular body 340, such as by bonding for example, on both sides of the channel in both recesses 309. Because the annular member 316 does not extend radially beyond the width of the second fluid channel 308a and recesses 309, annular member 316 is less prone to radial warping. As such, an improved covering profile may be produced, and leakage from the second fluid channel may be substantially or completely prevented.


The upper plate 320 may be a disk-shaped body, and may be coupled with the annular body 340 at the first upper recess 303. The upper plate 320 may thus cover the first fluid channel 306 to prevent or substantially prevent fluid flow from the top of the first fluid channel 306. The upper plate may have a diameter selected to mate with the diameter of the upper recess 303, and the upper plate may comprise a plurality of first apertures 360 formed therethrough. The first apertures 360 may extend beyond a bottom surface of the upper plate 320 thereby forming a number of raised cylindrical bodies. In between each raised cylindrical body may be a gap. As seen in FIG. 3A, the first apertures 360 may be arranged in a polygonal pattern on the upper plate 320, such that an imaginary line drawn through the centers of the outermost first apertures 360 define or substantially define a polygonal figure, which may be for example, a six-sided polygon.


The pattern may also feature an array of staggered rows from about 5 to about 60 rows, such as from about 15 to about 25 rows of first apertures 360. Each row may have, along the y-axis, from about 5 to about 20 first apertures 360, with each row being spaced between about 0.4 and about 0.7 inches apart. Each first aperture 360 in a row may be displaced along the x-axis from a prior aperture between about 0.4 and about 0.8 inches from each respective diameter. The first apertures 360 may be staggered along the x-axis from an aperture in another row by between about 0.2 and about 0.4 inches from each respective diameter. The first apertures 360 may be equally spaced from one another in each row. Referring to FIG. 3D, an edge portion of the upper plate 320 may comprise a second thickness greater than a first thickness located more towards the central portion of the plate, and the second thickness may be equivalent or substantially equivalent to the height of the outer wall of first upper recess 303. The edge portion may extend radially inward from an outer edge a distance equivalent or substantially equivalent to a bottom portion of the upper recess. Accordingly, the edge portion may not extend radially inward past the inward most portion of first upper recess 303 in disclosed embodiments.


The lower plate 325 may have a disk-shaped body having a number of second apertures 365 and third apertures 375 formed therethrough, as especially seen in FIG. 3C. The lower plate 325 may have multiple thicknesses, with the thickness of defined portions greater than the central thickness of the upper plate 320, and in disclosed embodiments at least about twice the thickness of the upper plate 320. The lower plate 325 may also have a diameter that mates with the diameter of the inner annular wall 301 of the annular body 340 at the first lower recess 302. As mentioned, the lower plate 325 may comprise multiple thicknesses, and for example, a first thickness of the plate may be the thickness through which the third apertures 375 extend. A second thickness greater than the first may be the thickness of an edge region of the plate that intersects the first lower recess 302 of the annular body 340. The second thickness with respect to the first lower recess may be dimensioned similar to the edge portion of the upper plate with respect to the first upper recess. In disclosed embodiments, the first and second thicknesses are substantially similar. A third thickness greater than the second may be a thickness of the plate around the second apertures 365. For example, the second apertures 365 may be defined by the lower plate 325 as cylindrical bodies extending up to the upper plate 320. In this way, channels may be formed between the first and second apertures that are fluidly isolated from one another. Additionally, the volume formed between the upper and lower plates may be fluidly isolated from the channels formed between the first and second apertures. As such, a fluid flowing through the first apertures 360 will flow through the second apertures 365 and a fluid within the internal volume between the plates will flow through the third apertures 375, and the fluids will be fluidly isolated from one another until they exit the lower plate 325 through either the second or third apertures. This separation may provide numerous benefits including preventing a radical precursor from contacting a second precursor prior to reaching a reaction zone. By preventing the interaction of the gases, deposition within the chamber may be minimized prior to the processing region in which deposition is desired.


The second apertures 365 may be arranged in a pattern that aligns with the pattern of the first apertures 360 as described above. In one embodiment, when the upper plate 320 and bottom plate 325 are positioned one on top of the other, the axes of the first apertures 360 and second apertures 365 align. In disclosed embodiments, the upper and lower plates may be coupled with one another or directly bonded together. Under either scenario, the coupling of the plates may occur such that the first and second apertures are aligned to form a channel through the upper and lower plates. The plurality of first apertures 360 and the plurality of second apertures 365 may have their respective axes parallel or substantially parallel to each other, for example, the apertures 360, 365 may be concentric. Alternatively, the plurality of first apertures 360 and the plurality of second apertures 365 may have the respective axis disposed at an angle from about 1° to about 30° from one another. At the center of the bottom plate 325 there may be no second aperture 365.


As stated previously, the gas distribution assembly 300 generally consists of the annular body 340, the upper plate 320, and the lower plate 325. The lower plate 325 may be positioned within the first lower recess 303 with the raised cylindrical bodies facing toward the bottom surface of the upper plate 320, as shown in FIG. 3D. The bottom plate 325 may then be positioned in the first lower recess 304 and rotatably oriented so that the axes of the first and second apertures 360, 365 may be aligned. The upper plate 320 may be sealingly coupled with the bottom plate 325 to fluidly isolate the first and second apertures 360, 365 from the third apertures 375. For example, the upper plate 320 may be brazed to the bottom plate 325 such that a seal is created between a surface of the raised cylindrical bodies on the lower plate 325, and a surface of the bottom of the upper plate 320. The upper plate 320 and bottom plate 325 may then be E-beam welded or otherwise bonded to the annular body 340. The upper plate 320 may be E-beam welded such that a seal is created between an outer edge of the circular body and an inner edge of the upper recess 303. The bottom plate 325 may be E-beam welded such that a seal is created between an outer edge of the circular body and the inner annular wall 301. In disclosed embodiments, the surfaces of the gas distribution assembly 300 may be electro-polished, plated with metal, or coated with various metal-based substances or oxides.


The plurality of second apertures 365 and the plurality of third apertures 375 may form alternating staggered rows. The third apertures 375 may be arranged in between at least two of the second apertures 365 of the bottom plate 325. Between each second aperture 365 there may be a third aperture 375, which is evenly spaced between the two second apertures 365. There may also be a number of third apertures 375 positioned around the center of the bottom plate 325 in a hexagonal pattern, such as for example six third apertures, or a number of third apertures 375 forming another geometric shape. There may be no third aperture 375 formed in the center of the bottom plate 325. There may also be no third apertures 375 positioned between the perimeter second apertures 365 which form the vertices of the polygonal pattern of second apertures. Alternatively there may be third apertures 375 located between the perimeter second apertures 365, and there may also be additional third apertures 375 located outwardly from the perimeter second apertures 365 forming the outermost ring of apertures as shown, for example, in FIG. 3C.


Alternatively, the arrangement of the first and second apertures may make any other geometrical pattern, and may be distributed as rings of apertures located concentrically outward from each other and based on a centrally located position on the plate. As one example, and without limiting the scope of the technology, FIG. 3A shows a pattern formed by the apertures that includes concentric hexagonal rings extending outwardly from the center. Each outwardly located ring may have the same number, more, or less apertures than the preceding ring located inwardly. In one example, each concentric ring may have an additional number of apertures based on the geometric shape of each ring. In the example of a six-sided polygon, each ring moving outwardly may have six apertures more than the ring located directly inward, with the first internal ring having six apertures. With a first ring of apertures located nearest to the center of the upper and bottom plates, the upper and bottom plates may have more than two rings, and depending on the geometric pattern of apertures used, may have between about one and about fifty rings of apertures. Alternatively, the plates may have between about two and about forty rings, or up to about thirty rings, about twenty rings, about fifteen rings, about twelve rings, about ten rings, about nine rings, about eight rings, about seven rings, about six rings, etc. or less. In one example, as shown in FIG. 3A, there may be nine hexagonal rings on the exemplary upper plate.


The concentric rings of apertures may also not have one of the concentric rings of apertures, or may have one of the rings of apertures extending outward removed from between other rings. For example with reference to FIG. 3A, where an exemplary nine hexagonal rings are on the plate, the plate may instead have eight rings, but it may be ring four that is removed. In such an example, channels may not be formed where the fourth ring would otherwise be located which may redistribute the gas flow of a fluid being passed through the apertures. The rings may still also have certain apertures removed from the geometric pattern. For example again with reference to FIG. 3A, a tenth hexagonal ring of apertures may be formed on the plate shown as the outermost ring. However, the ring may not include apertures that would form the vertices of the hexagonal pattern, or other apertures within the ring.


The first, second, and third apertures 360, 365, 375 may all be adapted to allow the passage of fluid therethrough. The first and second apertures 360, 365 may have cylindrical shape and may, alternatively, have a varied cross-sectional shape including conical, cylindrical, or a combination of multiple shapes. In one example, as shown in FIG. 3D, the first and second apertures may have a substantially cylindrical shape, and the third apertures may be formed by a series of cylinders of different diameters. For example, the third apertures may comprise three cylinders where the second cylinder is of a diameter smaller than the diameters of the other cylinders. These and numerous other variations can be used to modulate the flow of fluid through the apertures.


When all first and second apertures are of the same diameter, the flow of gas through the channels may not be uniform. As process gases flow into the processing chamber, the flow of gas may be such as to preferentially flow a greater volume of gas through certain channels. As such, certain of the apertures may be reduced in diameter from certain other apertures in order to redistribute the precursor flow as it is delivered into a first plasma region. The apertures may be selectively reduced in diameter due to their relative position, such as near a baffle, and as such, apertures located near the baffle may be reduced in diameter to reduce the flow of process gas through those apertures. In one example, as shown in FIG. 3A, where nine hexagonal rings of first apertures are located concentrically on the plates, certain rings of apertures may have some or all of the apertures reduced in diameter. For example, ring four may include a subset of first apertures that have a smaller diameter than the first apertures in the other rings. Alternatively, rings two through eight, two through seven, two through six, two through five, two through four, three through seven, three through six, three through five, four through seven, four through six, two and three, three and four, four and five, five and six, etc., or some other combination of rings may have reduced aperture diameters for some or all of the apertures located in those rings.


Referring again to FIG. 3D, a pair of isolation channels, 318 may be formed in the annular body 340. One of the pair of isolation channels 318 may be defined in the upper surface 315 of the annular body 340, and the other of the pair of isolation channels 318 may be defined in the lower surface 310 of the annular body 340. The pair of isolation channels may be vertically aligned with one another, and in disclosed embodiments may be in direct vertical alignment. Alternatively, the pair of isolation channels may be offset from vertical alignment in either direction. The channels may provide locations for isolation barriers such as o-rings in disclosed embodiments.


Turning to FIG. 3E, additional features of gas distribution assemblies are shown according to disclosed embodiments, and may include many of the features described above with respect to FIG. 3D. The assembly 300 includes annular body 340 having inner annular wall 301, outer annular wall 305, upper surface 315, and lower surface 310. The annular body 340 may additionally include an upper recess 303, a first lower recess 302, and a second lower recess 304. The annular body may also have a first fluid channel 306 formed in the upper surface 315 with a plurality of ports 312 defined in the inner channel wall that provide fluid access to a volume formed between upper plate 320 and lower plate 325. Lower plate 325 may be coupled with annular body 340 at first lower recess 302. Lower plate 325 may additionally define first and second apertures as discussed above with regard to FIG. 3D.


Upper plate 320 may be coupled with annular body 340 at upper recess 303. First fluid channel 306 may be defined similar to first fluid channel 306 of FIG. 3D. Alternatively, the inner and outer walls of the first fluid channel 306 may be of substantially similar height, and in disclosed embodiments may be of identical height. Upper plate 320 may cover first fluid channel 306 in order to prevent a flow path from the top of the first fluid channel 306. The first plurality of ports 312 may be defined in the annular body similar to that of FIG. 3D. Alternatively, the first plurality of ports 312 may be partially formed in the upper surface 315 at the inner annular wall 301. When upper plate 320 is coupled with the annular body 340, the upper plate may further define the top of the plurality of ports 312.


A second fluid channel 308b may be formed in the upper surface 315 of annular body 340, and may be configured to receive a fluid delivered through fluid delivery channel 322 as previously described. Second fluid channel 308b, however, may be located radially inward of the first upper recess 303 such that the second fluid channel 308b is covered by the upper plate 320. An outer wall of second fluid channel 308b may intersect a bottom portion of upper recess 303. A second plurality of ports 314 may be defined by a portion of the annular body forming an inner wall of the second fluid channel 308b and the outer wall of first fluid channel 306. The ports may provide fluid communication between the first and second fluid channels, and may be located similarly as described above. Upper plate 320 may be configured to limit warping at each interface of contact with the annular body 340. For example, upper plate 320 may have a first thickness in the central portion of the upper plate 320 where the apertures are located, and may be a second thickness greater than the first thickness at the edge portions of the plate. These edge portions may extend from the upper recess 303 over the second fluid channel 308b, the first fluid channel 306, and the inner annular wall 301. The increased thickness of the upper plate 320 at the edge regions may better absorb the stress produced during the coupling of the upper plate to the annular body, and thereby reduce warping.


A portion of upper plate 320 may extend a distance into the second fluid channel 308b. The portion of the upper plate may extend into the second channel below a level of the bottom of the upper recess 303. In disclosed embodiments, second fluid channel 308b is formed to a greater depth in the upper surface 315 than the first fluid channel 306. The portion of upper plate 320 extending into the second fluid channel 308b may extend to a depth equivalent to the depth of the first fluid channel 306 within the annular body 340. By having a portion of the upper plate extend into the second fluid channel 308b, warping that may occur in the upper plate when it is coupled with the annular body 340 may not produce any leak paths between the first and second fluid channels as the extent of warping may be overcome by the amount of the upper plate 320 that extends into the second fluid channel 308b. The second plurality of ports 314 may be defined similar to those of FIG. 3D, or alternatively may be partially formed in the upper surface similar to the first plurality of ports 312. The top of the plurality of ports 314 may be defined by the bottom surface of the upper plate 320. The second plurality of ports 314 may be formed at an angle increasing vertically between the second fluid channel 308b and the first fluid channel 306. By forming the ports at an angle, the ports may not be blocked by the portion of the upper plate extending into the second fluid channel 308b. In disclosed embodiments the second plurality of ports 314 may be slots of various shapes or dimensions formed in the annular body. The slots may be formed at an angle increasing or upward from the second fluid channel 308b to the first fluid channel 306 such that the ports are fluidly accessible below the portion of the upper plate 320 extending into the second fluid channel 308b.


A pair of isolation channels 324 may be formed in the gas distribution assembly in disclosed embodiments where at least a portion of the isolation channels are vertically aligned with the portion of the annular body forming the inner wall of the second fluid channel 308b and the inner wall of the first fluid channel 306. To produce this configuration, one of the pair of isolation channels may be defined in the upper plate at a location radially inward from the first upper recess. The other of the pair of isolation channels may be defined in the lower surface 310 of the annular body, and the pair of isolation channels may be vertically aligned with one another. In disclosed embodiments the pair of isolation channels may be in direct vertical alignment. In operation, the isolation channels may receive o-rings, for example, or other isolation devices. By providing the isolation channels at a location that is at least partially aligned with the shared wall of the first and second fluid channels, the compression produced at the isolation channels may be used to offset, reduce, or remove warping that may have occurred at the interface of the upper plate 320 and the annular body.


Referring to FIGS. 4A-4B, gas distribution assembly 400, or showerhead, is provided including a first or upper plate 420 and a second or lower plate 425, and the top of the lower plate 425 may be configured to be coupled with the bottom of the upper plate 420. The upper and lower plates may be perforated plates with a plurality of apertures defined in each plate. In usage, the orientation of the showerhead 400 to the substrate may be done in such a way that the axis of any apertures formed in the showerhead may be perpendicular or substantially perpendicular to the substrate plane.


Referring to FIG. 4B, annular body 440 may include an upper recess 403 in upper surface 415, and a lower recess 402 in lower surface 410. A first fluid channel 406 may be defined in the lower surface 410 and may be located in the annular body radially inward of the lower recess 402. The first fluid channel may be annular in shape, and the channel may be covered by lower plate 425. A plurality of ports 412 may be at least partially defined in the annular body at the inner annular wall 401, and may be located along the entire channel at defined intervals that may be equal or modified across the plurality of ports. In disclosed embodiments, lower plate 425 may define a top portion of the plurality of ports 412. Upper plate 420 may be coupled with the annular body 440 at upper recess 403, and the upper plate 420 may define a plurality of first apertures 460. Lower plate 425 may be coupled with the annular body 440 at the lower recess 402, and may cover first fluid channel 406. Lower plate 425 may define a plurality of second apertures 465 that may align with the first apertures 460 defined in the upper plate 420 in order to form a first set of channels through the assembly 400. The lower plate 425 may also define a plurality of third apertures 475 that are located between and around the second apertures 465. The lower plate 425 may include raised portions around second apertures 465 that extend up to the upper plate 420 to produce fluidly isolated channels through the assembly.


The upper and lower plates may be sealingly coupled with one another such that the first and second apertures are aligned to form a channel through the upper and lower plates with the raised portions of the lower plate such that an internal volume is defined between the upper and lower plate. The volume may be fluidly accessed through the plurality of ports 412. The assembly may be configured such that a first fluid may flow through the first apertures and extend through the assembly 400 through the isolated channels formed between the first and second apertures. Additionally, a second fluid may be flowed through the assembly via the first fluid channel 406 and delivered into the volume defined between the upper and lower plates. The fluid flowing through the volume may flow through the third apertures and around the raised portions of the lower plate such that the first and second fluid may be fluidly isolated through the showerhead, and remain separated until they exit the lower plate through the second and third apertures respectively.


The first apertures 460 may be shaped to suppress the migration of ionically-charged species out of the first plasma region 215 described previously, while allowing uncharged neutral or radical species to pass through the showerhead 225, or gas distribution assembly 400. These uncharged species may include highly reactive species that are transported with less reactive carrier gas through the holes. As noted above, the migration of ionic species through the holes may be reduced, and in some instances completely suppressed. Controlling the amount of ionic species passing through the gas distribution assembly 400 may provide increased control over the gas mixture brought into contact with the underlying wafer substrate, which in turn increases control of the deposition and/or etch characteristics of the gas mixture. Accordingly, in disclosed embodiments, the first apertures may include a conical shape extending through the upper plate with decreasing diameter in order to control fluid characteristics. This upper plate may specifically act as an ion-supression plate or ion blocker such that a configuration effectively combines ion-suppression directly into the showerhead design, and an additional suppression element may not be additionally required.


Each first aperture 460 may have a conical inlet portion tapering to a first cylindrical portion that intersects second apertures 465. The second apertures may include multiple sections of various shapes to further affect fluid flow through the channels formed between the first and second apertures. In an exemplary design, the second apertures 465 may include multiple cylindrical sections of increasing diameter leading to a conical section extending with increasing diameter to the bottom of the lower plate 425. Third apertures 475 may similarly include multiple sections of various shapes, and in an exemplary configuration the third apertures 475 may include multiple cylindrical sections of decreasing diameter leading to a conical section extending with increasing diameter to the bottom of the lower plate 425. In disclosed embodiments, the second and third apertures include at least three sections of different shape or diameter.


For ion-suppression assemblies such as exemplary configuration assembly 400, the number of apertures may be greater than the number of apertures in configurations such as exemplary assemblies of FIGS. 3D and 3E. Providing a greater number of apertures may increase the density of species delivered to the processing region of the chamber. FIG. 4A shows a bottom view of gas distribution assembly 400 including lower plate 425 with second apertures 465 and third apertures 475. Although only one quadrant of apertures is shown, it will be readily understood that the apertures are defined similarly in all four quadrants of the assembly. While FIG. 3A shows an exemplary nine hexagonal rings of apertures, a similarly sized gas distribution assembly such as shown in FIG. 4A may include between about eighteen and twenty-five rings of apertures. The total number of apertures in the high-density design illustrated in FIGS. 4A-4B may include between 2-10 times as many total second and third apertures. The high-density configuration as shown in FIG. 3E may include an additional second aperture 365 directly in the center of the plate.


Referring back to FIG. 4B, the gas distribution assembly may additionally include a second fluid channel 408 defined in the lower surface 410 that is located in the annular body 440 radially outward of the first fluid channel 406. The second fluid channel 408 may be formed around the entire annular body 360, and may also be concentric with the first fluid channel 406. A second plurality of ports 414 may be defined in at least a portion of the annular body defining an outer wall of the first fluid channel 406 and an inner wall of the second fluid channel 408. The second fluid channel 408 may also be located radially inward of the lower recess such that the second fluid channel is covered by the lower plate 425. Similar to the design described in FIG. 4E, a portion of the lower plate may extend up into the second fluid channel 408.


The portion of the lower plate 425 may extend into the second channel above a level of the top of the lower recess 402. In disclosed embodiments, second fluid channel 408 is formed to a greater height in the lower surface 410 than the first fluid channel 406. The portion of lower plate 425 extending into the second fluid channel 408 may extend to a height equivalent to the height of the first fluid channel 406 or less within the annular body 440, or to a height equivalent to about half of the height of first fluid channel 406. As explained above, a portion of the lower plate extending into the second fluid channel 408 may limit the effects of warping that may occur in the lower plate when it is coupled with the annular body 440. The second plurality of ports 414 may be defined similar to those of FIG. 3D or 3E but in the lower surface 410. The bottom of the plurality of ports 414 may be defined by the top surface of the lower plate 425.


The second plurality of ports 414 may be formed at an angle decreasing vertically between the second fluid channel 408 and the first fluid channel 406. By forming the ports at an angle, the ports may not be blocked by the portion of the lower plate extending into the second fluid channel 408. In disclosed embodiments the second plurality of ports 414 may be slots of various shapes or dimensions formed in the annular body, and may be angled downward from the second fluid channel 408 to the first fluid channel 406 such that the ports are fluidly accessible above the portion of the lower plate extending into the second fluid channel 408. In operation, a fluid may be delivered through the gas distribution assembly 400 through a side port in the chamber, for example, fluid delivery channel 422. The fluid may flow into second fluid channel 408 and then through the second plurality of ports 414 that may fluidly couple the second fluid channel 408 with the first fluid channel 406. The fluid may then flow through the first plurality of ports 412 that may fluidly couple the first fluid channel 406 with the volume defined between the upper plate 420 and lower plate 425. The fluid may continue to flow through third apertures 475 into the processing region. In this configuration, such a fluid may be fluidly isolated from the first and second apertures that form channels through the gas distribution assembly. In this way, the distribution assembly may prevent the flow of this fluid from accessing the first apertures, and may prevent the fluid from flowing through the top of the gas distribution assembly without a pressure differential or forced flow.



FIG. 5A shows an exemplary gas distribution assembly 500 configured to provide three isolated fluid paths to a processing region. The assembly 500 may include similar components as previously described including an annular body 540 having an inner annular wall 501 located at an inner diameter, an outer annular wall 505 located at an outer diameter, an upper surface 515, and a lower surface 510. Gas distribution assembly 500 may include an upper plate 520 coupled with the annular body 540 that defines a first set of apertures. Intermediate plate 530 may be coupled with the upper plate 520 and may comprise a plurality of second apertures and a plurality of third apertures. The intermediate plate 530 may be coupled such that the second apertures align with the first apertures of the upper plate. The assembly may additionally include a lower plate 525 coupled with the annular body 540 and the intermediate plate 530. The lower plate 525 may define a plurality of fourth apertures that align with the first apertures of the upper plate and the second apertures of the intermediate plate to form a first plurality of fluid channels 561 through the plates. The lower plate may also define a fifth set of apertures that align with the third apertures of the intermediate plate to form a second plurality of fluid channels 566 through the intermediate and lower plates. The second plurality of fluid channels 566 may be fluidly isolated from the first plurality of fluid channels 561. The lower plate may also define a sixth set of apertures that form a third plurality of fluid channels 576 through the lower plate. The third plurality of fluid channels 576 may be fluidly isolated from the first and second pluralities of fluid channels.


In operation, the gas distribution assembly may be configured such that two fluids may be delivered into the showerhead from the side, but maintained fluidly separate in two fluidly isolated volumes 565, 570 produced in the assembly. A first fluid may be delivered from above the gas distribution assembly 500 and may include radical species produced in an RPS or first plasma region, for example. The first fluid may flow through the first plurality of fluid channels 561 that may be individually isolated and may not be accessed from within the assembly volumes. A second fluid may be introduced into the showerhead from a side port or first delivery channel that delivers the second fluid between the upper plate 520 and intermediate plate 530. The second fluid may flow within this first defined volume 565 and through the second plurality of fluid channels. These channels may also be fluidly isolated from the other channels formed through the assembly. A third fluid may be introduced into the showerhead from an additional side port or second delivery channel that delivers the third fluid between the intermediate plate 530 and lower plate 525. The third fluid may flow within this second defined volume 570 and through the third plurality of fluid channels, which may be fluidly isolated from the other channels formed through the assembly. The additional side port or second delivery channel, as well as the second defined volume 570, may be fluidly isolated from the first delivery channel and first defined volume 565. In this way, three fluids may be delivered to a processing region through a single gas distribution assembly, but may be separated until they each exit the gas distribution assembly and enter the processing region.


Although a variety of aperture configurations are encompassed by the disclosed technology, FIGS. 5B and 5C illustrate two exemplary configurations of fourth apertures 567, fifth apertures 568, and sixth apertures 577. The figures show partial plan views of lower plate 525 and exemplary orientations of fourth, fifth, and sixth apertures. In some disclosed configurations, the lower plate may include an orientation of fourth, fifth, and sixth apertures such that a majority of fourth apertures 567 are each surrounded by at least four of the fifth apertures 568 and four of the sixth apertures 577.


As shown in FIG. 5B, fourth apertures 567 may have four of the fifth apertures 568 positioned around each of the fourth apertures 567. Additionally, four of the sixth apertures 577 may also be positioned around each of the fourth apertures 567. In this configuration, the fifth apertures 568a-d may be located around the fourth apertures 567 with the centers of the fifth apertures at about 90° intervals from one another as identified about a center of one of the fourth apertures 567. Similarly, the sixth apertures 577 may be located around the fourth apertures with centers of the sixth apertures at about 90° intervals from one another as identified about a center of the fourth apertures 577. The sixth apertures 577 may also be offset from fifth apertures 568 by about 45° as identified about a center of the fourth apertures 577. Each of the fifth apertures 568 may additionally have four of the sixth apertures 577 located around the fifth apertures 568 at about 90° intervals from one another as identified about a center of the fifth apertures 568. The apertures may also be considered as rows of apertures based on the fourth apertures 567 and fifth apertures 568. As shown in FIG. 5B, each horizontal row of fourth apertures 567 or fifth apertures 568 alternates sixth apertures 577 with each of the fourth or fifth apertures of the individual rows. The rows are additionally displaced by one aperture in alternating rows, such that each of the fourth or fifth apertures has a located sixth aperture above or below it in each alternating row.


As shown in FIG. 5C, fourth apertures 567 may have four or more of the fifth apertures 568 positioned around each of the fourth apertures 567. The sixth apertures 568 may be located in alternating columns with the fourth apertures 567. Additionally, six of the sixth apertures 577 may also be positioned around each of the fourth apertures 567. In this configuration, the fifth apertures 568 may be located around the fourth apertures 567 with the centers of the fifth apertures at about 60° intervals from one another as identified about a center of the fourth apertures 567. Similarly, the sixth apertures 577 may be located around the fourth apertures with centers of the sixth apertures at about 60° intervals from one another as identified about a center of the fourth apertures 577. The sixth apertures 577 may also be offset from fifth apertures 568 by about 30° as identified about a center of the fourth apertures 577. The fifth apertures 568 may be located a first radial distance from the center of each of the fourth apertures 567. Additionally, the sixth apertures 577 may be located a second radial distance from the center of each of the fourth apertures 567. As illustrated in FIG. 5C, the second radial distance may be less than the first radial distance. Other disclosed embodiments may have the second radial distance greater than the first radial distance. The apertures may again be considered as alternating horizontal rows of apertures of fourth or fifth apertures. As shown in the figure, each fourth or fifth aperture is separated from the next fourth or fifth aperture in a row by two sixth apertures. The rows of apertures may be offset such that each row is displaced by half the distance between any two fourth or fifth apertures such that every other row of apertures is aligned in terms of the sixth apertures 577.


In the preceding description, for the purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present invention. It will be apparent to one skilled in the art, however, that certain embodiments may be practiced without some of these details, or with additional details.


Having disclosed several embodiments, it will be recognized by those of skill in the art that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the disclosed embodiments. Additionally, a number of well-known processes and elements have not been described in order to avoid unnecessarily obscuring the present invention. Accordingly, the above description should not be taken as limiting the scope of the invention.


Where a range of values is provided, it is understood that each intervening value, to the smallest fraction of the unit of the lower limit, unless the context clearly dictates otherwise, between the upper and lower limits of that range is also specifically disclosed. Each smaller range between any stated value or intervening value in a stated range and any other stated or intervening value in that stated range is encompassed. The upper and lower limits of those smaller ranges may independently be included or excluded in the range, and each range where either, neither, or both limits are included in the smaller ranges is also encompassed within the invention, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.


As used herein and in the appended claims, the singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “an aperture” includes a plurality of such apertures, and reference to “the plate” includes reference to one or more plates and equivalents thereof known to those skilled in the art, and so forth.


Also, the words “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)”, and “including”, when used in this specification and in the following claims, are intended to specify the presence of stated features, integers, components, or steps, but they do not preclude the presence or addition of one or more other features, integers, components, steps, acts, or groups.

Claims
  • 1. A gas distribution assembly, comprising: an annular body characterized by an inner annular wall located at an inner diameter, an outer annular wall located at an outer diameter, an upper surface defining an upper recess, and a lower surface defining a lower recess;an upper plate coupled with the annular body along the upper recess of the upper surface of the annular body and defining a top surface of the gas distribution assembly, wherein the upper plate defines a plurality of first apertures, and wherein the upper plate defines a first recessed volume within a surface of the upper plate and about the first apertures;an intermediate plate coupled with the upper plate along the surface of the upper plate defining the first recessed volume, wherein the intermediate plate couples with the upper plate to isolate the first recessed volume from the first apertures, wherein the intermediate plate defines a plurality of second apertures and a plurality of third apertures, wherein the plurality of second apertures are axially aligned with the plurality of first apertures, and wherein all third apertures of the plurality of third apertures are fluidly coupled with the first recessed volume; anda lower plate coupled with the lower recess of the annular body and the intermediate plate and contacting the intermediate plate, wherein the lower plate defines a plurality of fourth apertures, a plurality of fifth apertures, and a plurality of sixth apertures, wherein the plurality of fourth apertures are axially aligned with the plurality of first apertures and the plurality of second apertures, wherein the plurality of fifth apertures are axially aligned with the plurality of third apertures, and wherein the upper plate, the intermediate plate, and the lower plate are coupled with one another such that the plurality of first apertures, the plurality of second apertures, and the plurality of fourth apertures form a plurality of first fluid channels extending vertically through the upper plate, the intermediate plate, and the lower plate in a straight vertical path through the entire gas distribution assembly.
  • 2. The gas distribution assembly of claim 1, wherein the plurality of third apertures and the plurality of fifth apertures form a plurality of second fluid channels extending through the intermediate plate and the lower plate.
  • 3. The gas distribution assembly of claim 2, wherein the plurality of sixth apertures form a plurality of third fluid channels extending through the lower plate.
  • 4. The gas distribution assembly of claim 3, wherein the plurality of first fluid channels, the plurality of second fluid channels, and the plurality of third fluid channels are fluidly isolated from one another.
  • 5. The gas distribution assembly of claim 1, wherein the intermediate plate and the lower plate define a second recessed volume between the intermediate plate and the lower plate.
  • 6. The gas distribution assembly of claim 5, wherein the plurality of sixth apertures provide fluid access from the second volume.
  • 7. The gas distribution assembly of claim 1, wherein each aperture of the plurality of sixth apertures comprise at least three sections of different shape or diameter.
  • 8. A gas distribution assembly, comprising: an annular body characterized by an inner annular wall located at an inner diameter, an outer annular wall located at an outer diameter, an upper surface defining an upper recess, and a lower surface defining a lower recess;an upper plate coupled with the annular body along the upper recess of the upper surface of the annular body and defining a top surface of the gas distribution assembly, wherein the upper plate defines a first recessed volume from a surface of the upper plate opposite a surface defining the top surface of the gas distribution assembly, and wherein the upper plate defines a plurality of first apertures;an intermediate plate coupled with the upper plate, wherein the intermediate plate defines a plurality of second apertures and a plurality of third apertures, and wherein each aperture of the plurality of second apertures align with an aperture of the plurality of first apertures of the upper plate; anda lower plate coupled with the lower recess of the annular body and the intermediate plate, wherein the lower plate is in contact with the intermediate plate, the lower plate defining: a plurality of fourth apertures that are axially aligned with the plurality of first apertures of the upper plate and the plurality of second apertures of the intermediate plate to form a first set of fluid channels through the upper plate, the intermediate plate, and the lower plate, wherein the first set of fluid channels extend vertically in a direct path through the gas distribution assembly from a top surface of the gas distribution assembly through a bottom surface of the gas distribution assembly,a plurality of fifth apertures that align with the plurality of third apertures of the intermediate plate to form a second set of fluid channels through the intermediate plate and the lower plate, wherein the second set of fluid channels are fluidly isolated from the first set of fluid channels, anda plurality of sixth apertures that form a third set of fluid channels through the lower plate, wherein the third set of fluid channels are fluidly isolated from the first set of fluid channels and the second set of fluid channels.
  • 9. The gas distribution assembly of claim 8, wherein each aperture of the plurality of sixth apertures comprise at least three sections of different shape or diameter.
  • 10. The gas distribution assembly of claim 8, wherein the lower plate includes an orientation of the plurality of fourth apertures, the plurality of fifth apertures, and the plurality of sixth apertures such that a majority of fourth apertures of the plurality of fourth apertures are each surrounded by at least four fifth apertures of the plurality of fifth apertures.
  • 11. The gas distribution assembly of claim 10, wherein the majority of fourth apertures of the plurality of fourth apertures are also each surrounded by at least four of the sixth apertures of the plurality of sixth apertures.
  • 12. The gas distribution assembly of claim 11, wherein the fifth apertures are located around the fourth apertures with centers of the fifth apertures at about 90° intervals from one another about a center of the fourth apertures, and wherein the sixth apertures are located around the fourth apertures with centers of the sixth apertures at about 90° intervals from one another about the center of the fourth apertures and offset from the fifth apertures by about 45°.
  • 13. The gas distribution assembly of claim 11, wherein the fifth apertures are located around the fourth apertures with centers of the fifth apertures at about 60° intervals from one another about a center of the fourth apertures, and wherein the sixth apertures are located around the fourth apertures with centers of the sixth apertures at about 60° intervals from one another about the center of the fourth apertures and offset from the fifth apertures by about 30°.
  • 14. The gas distribution assembly of claim 8, wherein each aperture of the plurality of third apertures extends from the first recessed volume of the upper plate.
  • 15. The gas distribution assembly of claim 8, wherein the intermediate plate defines a second recessed volume along a surface opposite a surface in contact with the upper plate, wherein the second recessed volume extends about each of the second apertures and each of the third apertures.
  • 16. The gas distribution assembly of claim 15, wherein each sixth apertures of the plurality of sixth apertures provides fluid access from the second recessed volume.
  • 17. A gas distribution assembly, comprising: an annular body characterized by an inner annular wall located at an inner diameter, an outer annular wall located at an outer diameter, an upper surface defining an upper recess, and a lower surface defining a lower recess;an upper plate coupled with the annular body and seated in the upper recess of the upper surface of the annular body and defining a top surface of the gas distribution assembly, wherein the upper plate defines a plurality of first apertures, and wherein the upper plate defines a first recessed volume within a surface of the upper plate and about the first apertures;an intermediate plate coupled with the upper plate along the surface of the upper plate defining the first recessed volume, wherein the intermediate plate defines a plurality of second apertures and a plurality of third apertures, wherein the plurality of second apertures are axially aligned with the plurality of first apertures, and wherein all third apertures of the plurality of third apertures are fluidly coupled with the first recessed volume; anda lower plate contacting the intermediate plate, wherein the lower plate is coupled with and seated in the lower recess of the annular body, wherein the lower plate defines a bottom surface of the gas distribution assembly, wherein the lower plate defines a plurality of fourth apertures, a plurality of fifth apertures, and a plurality of sixth apertures, wherein the plurality of fourth apertures are axially aligned with the plurality of first apertures and the plurality of second apertures, wherein the plurality of fifth apertures are axially aligned with the plurality of third apertures, and wherein the upper plate, the intermediate plate, and the lower plate are coupled with one another such that the plurality of first apertures, the plurality of second apertures, and the plurality of fourth apertures form a plurality of first fluid channels extending vertically through the upper plate, the intermediate plate, and the lower plate.
  • 18. The gas distribution assembly of claim 1, wherein the upper surface of the annular body defines a first fluid channel radially inward of the upper recess.
  • 19. The gas distribution assembly of claim 1, wherein the upper plate defines a topmost surface of the gas distribution assembly.
  • 20. The gas distribution assembly of claim 8, wherein the upper surface of the annular body defines a first fluid channel radially inward of the upper recess, wherein the upper surface of the annular body defines a second fluid channel radially outward of the first fluid channel, and wherein the first fluid channel and the second fluid channel are in fluid communication.
CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 15/581,357, filed Apr. 28, 2017, which is a continuation of U.S. patent application Ser. No. 14/853,838, filed Sep. 14, 2015, now U.S. Pat. No. 9,978,564, which is a divisional of U.S. patent application Ser. No. 13/799,840, filed on Mar. 13, 2013, now U.S. Pat. No. 9,132,436, which claims the benefit of U.S. Provisional Application No. 61/704,257, filed Sep. 21, 2012. The entire disclosures of which are hereby incorporated by reference for all purposes.

US Referenced Citations (2406)
Number Name Date Kind
2369620 Sullivan et al. Feb 1945 A
3401302 Thorpe Sep 1968 A
3451840 Hough Jun 1969 A
3537474 Rohrer Nov 1970 A
3756511 Shinroku Sep 1973 A
3937857 Brummett et al. Feb 1976 A
3969077 Hill Jul 1976 A
4006047 Brummett et al. Feb 1977 A
4190488 Winters Feb 1980 A
4209357 Gorin et al. Jun 1980 A
4214946 Forget et al. Jul 1980 A
4232060 Mallory, Jr. Nov 1980 A
4234628 DuRose Nov 1980 A
4265943 Goldstein et al. May 1981 A
4340462 Koch Jul 1982 A
4341592 Shortes et al. Jul 1982 A
4361418 Tscheppe Nov 1982 A
4361441 Tylko Nov 1982 A
4364803 Nidola et al. Dec 1982 A
4368223 Kobayashi et al. Jan 1983 A
4374698 Sanders et al. Feb 1983 A
4397812 Mallory, Jr. Aug 1983 A
4468413 Bachmann Aug 1984 A
4503807 Nakayama et al. Mar 1985 A
4508054 Baumberger Apr 1985 A
4543110 Engelhardt et al. Sep 1985 A
4565601 Kakehi et al. Jan 1986 A
4579618 Celestino et al. Apr 1986 A
4585920 Hoog et al. Apr 1986 A
4600464 Desilets et al. Jul 1986 A
4610775 Phifer Sep 1986 A
4625678 Shloya et al. Dec 1986 A
4632857 Mallory, Jr. Dec 1986 A
4656052 Satou et al. Apr 1987 A
4656076 Vetanen et al. Apr 1987 A
4668335 Mockler May 1987 A
4690746 McInerney et al. Sep 1987 A
4715937 Moslehi et al. Dec 1987 A
4749440 Blackwood et al. Jun 1988 A
4753898 Parrillo et al. Jun 1988 A
4786360 Cote et al. Nov 1988 A
4792378 Rose et al. Dec 1988 A
4793897 Dunfield et al. Dec 1988 A
4807016 Douglas Feb 1989 A
4810520 Wu Mar 1989 A
4816638 Ukai et al. Mar 1989 A
4820377 Davis et al. Apr 1989 A
4828649 Davis May 1989 A
4857140 Loewenstein Aug 1989 A
4867841 Loewenstein et al. Sep 1989 A
4904621 Lowenstein et al. Feb 1990 A
4913929 Moslehi et al. Apr 1990 A
4919750 Bausmith et al. Apr 1990 A
4946903 Gardella et al. Aug 1990 A
4951601 Maydan et al. Aug 1990 A
4960488 Law et al. Oct 1990 A
4980018 Mu et al. Dec 1990 A
4981551 Palmour Jan 1991 A
4985372 Narita et al. Jan 1991 A
4987856 Hey et al. Jan 1991 A
4991542 Kohmura et al. Feb 1991 A
4992136 Tachi et al. Feb 1991 A
4993358 Mahawili Feb 1991 A
4994404 Sheng et al. Feb 1991 A
5000113 Wang et al. Mar 1991 A
5006192 Deguchi Apr 1991 A
5010842 Oda et al. Apr 1991 A
5013691 Lory et al. May 1991 A
5028565 Chang Jul 1991 A
5030319 Nishino et al. Jul 1991 A
5038713 Kawakami et al. Aug 1991 A
5045244 Marlett Sep 1991 A
5061838 Lane et al. Oct 1991 A
5069938 Lorimer et al. Dec 1991 A
5074456 Degner et al. Dec 1991 A
5083030 Stavov Jan 1992 A
5089441 Moslehi Feb 1992 A
5089442 Olmer Feb 1992 A
5147692 Bengston Sep 1992 A
5156881 Okano et al. Oct 1992 A
5180435 Markunas et al. Jan 1993 A
5186718 Tepman et al. Feb 1993 A
5188706 Hori et al. Feb 1993 A
5198034 deBoer et al. Mar 1993 A
5200016 Namose Apr 1993 A
5203911 Sricharoenchalkit et al. Apr 1993 A
5215787 Homma Jun 1993 A
5217559 Moslehi et al. Jun 1993 A
5221427 Koinuma et al. Jun 1993 A
5228501 Tepman et al. Jul 1993 A
5231690 Soma et al. Jul 1993 A
5235139 Bengston et al. Aug 1993 A
5238499 van de Ven et al. Aug 1993 A
5240497 Shacham et al. Aug 1993 A
5248371 Maher et al. Sep 1993 A
5248527 Uchida et al. Sep 1993 A
5252178 Moslehi Oct 1993 A
5266157 Kadomura Nov 1993 A
5269881 Sekiya Dec 1993 A
5270125 America et al. Dec 1993 A
5271972 Kwok et al. Dec 1993 A
5274917 Corbett, III et al. Jan 1994 A
5275977 Otsubo et al. Jan 1994 A
5277087 Wilson, Jr. et al. Jan 1994 A
5277750 Wolgang Jan 1994 A
5279669 Lee Jan 1994 A
5279705 Tanaka Jan 1994 A
5279865 Chebi et al. Jan 1994 A
5288518 Homma Feb 1994 A
5290382 Zarowin et al. Mar 1994 A
5290383 Koshimizu Mar 1994 A
5292370 Tsai et al. Mar 1994 A
5292682 Stevens et al. Mar 1994 A
5300463 Cathey et al. Apr 1994 A
5302233 Kim et al. Apr 1994 A
5304250 Sameshima et al. Apr 1994 A
5306530 Strongin et al. Apr 1994 A
5314724 Tsukune et al. May 1994 A
5318668 Tamaki et al. Jun 1994 A
5319247 Matsuura Jun 1994 A
5326427 Jerbic Jul 1994 A
5328558 Kawamura et al. Jul 1994 A
5328810 Lowrey et al. Jul 1994 A
5330578 Sakama Jul 1994 A
5334552 Homma Aug 1994 A
5345999 Hosokawa Sep 1994 A
5352636 Beinglass Oct 1994 A
5356478 Chen et al. Oct 1994 A
5362526 Wang et al. Nov 1994 A
5366585 Robertson et al. Nov 1994 A
5368897 Kurihara et al. Nov 1994 A
5378316 Franke et al. Jan 1995 A
5380560 Kaja et al. Jan 1995 A
5382311 Ishikawa et al. Jan 1995 A
5384284 Doan et al. Jan 1995 A
5385763 Okano et al. Jan 1995 A
5399237 Keswick et al. Mar 1995 A
5399529 Homma Mar 1995 A
5403434 Moslehi Apr 1995 A
5413670 Langan et al. May 1995 A
5413967 Matsuda et al. May 1995 A
5415753 Hurwitt May 1995 A
5415890 Kloiber et al. May 1995 A
5416048 Blalock et al. May 1995 A
5420075 Homma et al. May 1995 A
5429995 Nishiyama et al. Jul 1995 A
5439553 Grant et al. Aug 1995 A
5451169 Corbett, III et al. Sep 1995 A
5451259 Krogh Sep 1995 A
5453124 Moslehi et al. Sep 1995 A
5454170 Cook Oct 1995 A
5464499 Moslehi Nov 1995 A
5468342 Nulty et al. Nov 1995 A
5474589 Ohga et al. Dec 1995 A
5478403 Shinigawa et al. Dec 1995 A
5478462 Walsh Dec 1995 A
5483920 Pryor Jan 1996 A
5494494 Mizuno et al. Feb 1996 A
5500249 Telford et al. Mar 1996 A
5500256 Watabe Mar 1996 A
5505816 Barnes et al. Apr 1996 A
5510216 Calabrese et al. Apr 1996 A
5516367 Lei et al. May 1996 A
5518962 Murao May 1996 A
5531835 Fodor et al. Jul 1996 A
5534070 Okamura et al. Jul 1996 A
5536360 Nguyen et al. Jul 1996 A
5549780 Koinuma et al. Aug 1996 A
5556521 Ghanbari Sep 1996 A
5558717 Zhao et al. Sep 1996 A
5560779 Knowles et al. Oct 1996 A
5563105 Dobuzinsky et al. Oct 1996 A
5567243 Foster et al. Oct 1996 A
5571576 Qian et al. Nov 1996 A
5575853 Arami et al. Nov 1996 A
5578130 Hayashi et al. Nov 1996 A
5578161 Auda Nov 1996 A
5580385 Paranjpe et al. Dec 1996 A
5580421 Hiatt et al. Dec 1996 A
5591269 Arami et al. Jan 1997 A
5592358 Shamouilian Jan 1997 A
5595606 Fujikawa et al. Jan 1997 A
5597439 Salzman Jan 1997 A
5599740 Jang et al. Feb 1997 A
5605637 Shan et al. Feb 1997 A
5614055 Fairbairn et al. Mar 1997 A
5616518 Foo et al. Apr 1997 A
5624582 Cain Apr 1997 A
5626922 Miyanaga et al. May 1997 A
5628829 Foster et al. May 1997 A
5635086 Warren, Jr. Jun 1997 A
5645645 Zhang et al. Jul 1997 A
5648125 Cane Jul 1997 A
5648175 Russell et al. Jul 1997 A
5656093 Burkhart et al. Aug 1997 A
5660957 Chou et al. Aug 1997 A
5661093 Ravi et al. Aug 1997 A
5670066 Barnes et al. Sep 1997 A
5674787 Zhao et al. Oct 1997 A
5676758 Hasgawa et al. Oct 1997 A
5679606 Wang et al. Oct 1997 A
5685946 Fathauer et al. Nov 1997 A
5688331 Aruga et al. Nov 1997 A
5695810 Dubin et al. Dec 1997 A
5712185 Tsai et al. Jan 1998 A
5716500 Bardos et al. Feb 1998 A
5716506 Maclay et al. Feb 1998 A
5719085 Moon et al. Feb 1998 A
5733816 Iyer et al. Mar 1998 A
5747373 Yu May 1998 A
5753886 Iwamura et al. May 1998 A
5755859 Brusic et al. May 1998 A
5756400 Ye et al. May 1998 A
5756402 Jimbo et al. May 1998 A
5772770 Suda et al. Jun 1998 A
5781693 Balance et al. Jul 1998 A
5786276 Brooks et al. Jul 1998 A
5788825 Park et al. Aug 1998 A
5789300 Fulford Aug 1998 A
5792376 Kanai et al. Aug 1998 A
5800686 Littau et al. Sep 1998 A
5804259 Robles Sep 1998 A
5812403 Fong et al. Sep 1998 A
5814238 Ashby et al. Sep 1998 A
5814365 Mahawill Sep 1998 A
5819434 Herchen Oct 1998 A
5820723 Benjamin et al. Oct 1998 A
5824599 Schacham-Diamand et al. Oct 1998 A
5830805 Schacham-Diamand et al. Nov 1998 A
5835334 McMillin et al. Nov 1998 A
5843538 Ehrsam et al. Dec 1998 A
5843847 Pu et al. Dec 1998 A
5844195 Fairbairn et al. Dec 1998 A
5846332 Zhao et al. Dec 1998 A
5846373 Pirkle et al. Dec 1998 A
5846375 Gilchrist et al. Dec 1998 A
5846598 Semkow et al. Dec 1998 A
5846883 Moslehi Dec 1998 A
5849639 Molloy et al. Dec 1998 A
5850105 Dawson et al. Dec 1998 A
5855681 Maydan et al. Jan 1999 A
5855685 Tobe et al. Jan 1999 A
5856240 Sinha et al. Jan 1999 A
5858876 Chew Jan 1999 A
5863376 Wicker Jan 1999 A
5865896 Nowak Feb 1999 A
5866483 Shiau et al. Feb 1999 A
5868897 Ohkawa Feb 1999 A
5872052 Iyer Feb 1999 A
5872058 Van Cleemput et al. Feb 1999 A
5882424 Taylor et al. Mar 1999 A
5882786 Nassau et al. Mar 1999 A
5883012 Chiou Mar 1999 A
5885358 Maydan et al. Mar 1999 A
5885404 Kim et al. Mar 1999 A
5885749 Huggins et al. Mar 1999 A
5888906 Sandhu et al. Mar 1999 A
5891349 Tobe et al. Apr 1999 A
5891513 Dubin et al. Apr 1999 A
5897751 Makowiecki Apr 1999 A
5899752 Hey et al. May 1999 A
5900163 Yi et al. May 1999 A
5904827 Reynolds May 1999 A
5907790 Kellam May 1999 A
5910340 Uchida et al. Jun 1999 A
5913147 Dubin et al. Jun 1999 A
5913978 Kato et al. Jun 1999 A
5915190 Pirkle Jun 1999 A
5918116 Chittipeddi Jun 1999 A
5919332 Koshiishi et al. Jul 1999 A
5920792 Lin Jul 1999 A
5926737 Ameen et al. Jul 1999 A
5928528 Kubota et al. Jul 1999 A
5932077 Reynolds Aug 1999 A
5933757 Yoshikawa et al. Aug 1999 A
5935334 Fong et al. Aug 1999 A
5935340 Xia et al. Aug 1999 A
5937323 Orczyk et al. Aug 1999 A
5939831 Fong et al. Aug 1999 A
5942075 Nagahata et al. Aug 1999 A
5944049 Beyer et al. Aug 1999 A
5944902 Redeker et al. Aug 1999 A
5948702 Rotondaro Sep 1999 A
5951601 Lesinski et al. Sep 1999 A
5951776 Selyutin et al. Sep 1999 A
5951896 Mahawill Sep 1999 A
5953591 Ishihara et al. Sep 1999 A
5953635 Andideh Sep 1999 A
5963840 Xia et al. Oct 1999 A
5968379 Zhao et al. Oct 1999 A
5968587 Frankel et al. Oct 1999 A
5968610 Liu et al. Oct 1999 A
5969422 Ting et al. Oct 1999 A
5976327 Tanaka Nov 1999 A
5982100 Ghanbari Nov 1999 A
5990000 Hong et al. Nov 1999 A
5990013 Berenguer et al. Nov 1999 A
5993916 Zhao et al. Nov 1999 A
5994209 Yieh et al. Nov 1999 A
5997649 Hillman Dec 1999 A
5997721 Limbach et al. Dec 1999 A
5997962 Ogasawara et al. Dec 1999 A
6004884 Abraham Dec 1999 A
6007635 Mahawill Dec 1999 A
6007785 Liou Dec 1999 A
6010962 Liu et al. Jan 2000 A
6013191 Nasser-Faili et al. Jan 2000 A
6013584 M'Saad Jan 2000 A
6015724 Yamazaki et al. Jan 2000 A
6015747 Lopatin et al. Jan 2000 A
6017414 Koemtzopoulos et al. Jan 2000 A
6143158 Nishino et al. Jan 2000 A
6019848 Kiyama et al. Feb 2000 A
6020271 Yanagida Feb 2000 A
6022446 Shan et al. Feb 2000 A
6030666 Lam et al. Feb 2000 A
6030881 Papasouliotis et al. Feb 2000 A
6035101 Sajoto et al. Mar 2000 A
6036878 Collins et al. Mar 2000 A
6037018 Jang et al. Mar 2000 A
6037266 Tao et al. Mar 2000 A
6037273 Gronet et al. Mar 2000 A
6039834 Tanaka et al. Mar 2000 A
6039851 Iyer Mar 2000 A
6050085 Mayer Apr 2000 A
6053982 Halpin et al. Apr 2000 A
6059643 Hu et al. May 2000 A
6063683 Wu et al. May 2000 A
6063712 Gilton et al. May 2000 A
6065424 Shacham-Diamand et al. May 2000 A
6065425 Takaki et al. May 2000 A
6072147 Koshiishi Jun 2000 A
6072227 Yau et al. Jun 2000 A
6074512 Collins et al. Jun 2000 A
6074514 Bjorkman et al. Jun 2000 A
6077384 Collins et al. Jun 2000 A
6077386 Smith, Jr. et al. Jun 2000 A
6077780 Dubin Jun 2000 A
6079356 Umotoy et al. Jun 2000 A
6080446 Tobe Jun 2000 A
6080529 Ye et al. Jun 2000 A
6081414 Flanigan et al. Jun 2000 A
6083344 Hanawa et al. Jul 2000 A
6083844 Bui-Le et al. Jul 2000 A
6086677 Umotoy et al. Jul 2000 A
6087278 Kim et al. Jul 2000 A
6090212 Mahawill Jul 2000 A
6093457 Okumura Jul 2000 A
6093594 Yeap et al. Jul 2000 A
6099697 Hausmann Aug 2000 A
6107199 Allen et al. Aug 2000 A
6110530 Chen et al. Aug 2000 A
6110556 Bang et al. Aug 2000 A
6110832 Morgan et al. Aug 2000 A
6110836 Cohen et al. Aug 2000 A
6110838 Loewenstein Aug 2000 A
6113771 Landau et al. Sep 2000 A
6114216 Yieh et al. Sep 2000 A
6117245 Mandrekar et al. Sep 2000 A
6120640 Shih et al. Sep 2000 A
6124003 Mikami et al. Sep 2000 A
6126753 Shinriki et al. Oct 2000 A
6132512 Horie et al. Oct 2000 A
6136163 Cheung et al. Oct 2000 A
6136165 Moslehi et al. Oct 2000 A
6136685 Narwankar et al. Oct 2000 A
6136693 Chan et al. Oct 2000 A
6140234 Uzoh et al. Oct 2000 A
6144099 Lopatin et al. Nov 2000 A
6147009 Grill et al. Nov 2000 A
6148761 Majewski et al. Nov 2000 A
6149828 Vaartstra Nov 2000 A
6150628 Smith et al. Nov 2000 A
6153935 Edelstein et al. Nov 2000 A
6161500 Kopacz et al. Dec 2000 A
6161576 Maher et al. Dec 2000 A
6162302 Raghavan et al. Dec 2000 A
6162323 Koshimizu Dec 2000 A
6162370 Hackett et al. Dec 2000 A
6165912 McConnell et al. Dec 2000 A
6167834 Wang et al. Jan 2001 B1
6169021 Akram et al. Jan 2001 B1
6170428 Redeker et al. Jan 2001 B1
6170429 Schoepp Jan 2001 B1
6171661 Zheng et al. Jan 2001 B1
6174450 Patrick et al. Jan 2001 B1
6174810 Patrick et al. Jan 2001 B1
6174812 Hsuing et al. Jan 2001 B1
6176198 Kao et al. Jan 2001 B1
6176667 Fairbairn Jan 2001 B1
6177245 Ward et al. Jan 2001 B1
6178919 Li et al. Jan 2001 B1
6179924 Zhao et al. Jan 2001 B1
6180523 Lee et al. Jan 2001 B1
6182602 Redeker et al. Feb 2001 B1
6182603 Shang et al. Feb 2001 B1
6184121 Buchwalter et al. Feb 2001 B1
6184489 Ito et al. Feb 2001 B1
6186091 Chu et al. Feb 2001 B1
6189483 Ishikawa et al. Feb 2001 B1
6190233 Hong et al. Feb 2001 B1
6194038 Rossman Feb 2001 B1
6197181 Chen Mar 2001 B1
6197364 Paunovic et al. Mar 2001 B1
6197680 Lin et al. Mar 2001 B1
6197688 Simpson Mar 2001 B1
6197705 Vassiliev Mar 2001 B1
6198616 Dahimene et al. Mar 2001 B1
6200412 Kilgore et al. Mar 2001 B1
6203620 Moslehi Mar 2001 B1
6203863 Liu et al. Mar 2001 B1
6204200 Shieh et al. Mar 2001 B1
6209480 Moslehi et al. Apr 2001 B1
6210486 Mizukami et al. Apr 2001 B1
6217658 Orczyk et al. Apr 2001 B1
6220201 Nowak Apr 2001 B1
6225745 Srivastava May 2001 B1
6228233 Lakshmikanthan et al. May 2001 B1
6228751 Yamazaki et al. May 2001 B1
6228758 Pellerin et al. May 2001 B1
6235643 Mui et al. May 2001 B1
6237527 Kellerman et al. May 2001 B1
6238513 Arnold et al. May 2001 B1
6238582 Williams et al. May 2001 B1
6197151 Kaji et al. Jun 2001 B1
6241845 Gadgil et al. Jun 2001 B1
6242349 Nogami et al. Jun 2001 B1
6242360 Fischer et al. Jun 2001 B1
6244211 Nishikawa et al. Jun 2001 B1
6245192 Dhindsa et al. Jun 2001 B1
6245396 Nogami Jun 2001 B1
6245670 Cheung et al. Jun 2001 B1
6251236 Stevens Jun 2001 B1
6251802 Moore et al. Jun 2001 B1
6258170 Somekh et al. Jul 2001 B1
6258220 Dordi et al. Jul 2001 B1
6258223 Cheung et al. Jul 2001 B1
6258270 Hilgendorff et al. Jul 2001 B1
6261637 Oberle Jul 2001 B1
6267074 Okumura Jul 2001 B1
6277733 Smith Aug 2001 B1
6277752 Chen Aug 2001 B1
6277763 Kugimiya et al. Aug 2001 B1
6281072 Li et al. Aug 2001 B1
6281135 Han et al. Aug 2001 B1
6284146 Kim et al. Sep 2001 B1
6287643 Powell et al. Sep 2001 B1
6291282 Wilk et al. Sep 2001 B1
6291348 Lopatin et al. Sep 2001 B1
6302964 Umotoy et al. Oct 2001 B1
6303044 Koemtzopoulos Oct 2001 B1
6303418 Cha et al. Oct 2001 B1
6306246 Melvin et al. Oct 2001 B1
6306772 Lin Oct 2001 B1
6308654 Schneider et al. Oct 2001 B1
6308776 Sloan Oct 2001 B1
6310755 Busato et al. Oct 2001 B1
6312554 Ye Nov 2001 B1
6312995 Yu Nov 2001 B1
6319387 Krishnamoorthy et al. Nov 2001 B1
6321587 Laush Nov 2001 B1
6322716 Qiao et al. Nov 2001 B1
6323128 Sambucetti et al. Nov 2001 B1
6329297 Balish et al. Dec 2001 B1
6335288 Kwan et al. Jan 2002 B1
6340435 Bjorkman et al. Jan 2002 B1
6342733 Hu et al. Jan 2002 B1
RE37546 Mahawill Feb 2002 E
6344410 Lopatin et al. Feb 2002 B1
6348407 Gupta et al. Feb 2002 B1
6350320 Sherstinsky et al. Feb 2002 B1
6350697 Richardson Feb 2002 B1
6351013 Luning et al. Feb 2002 B1
6352081 Lu et al. Mar 2002 B1
6355573 Okumura Mar 2002 B1
6358827 Chen et al. Mar 2002 B1
6364949 Or et al. Apr 2002 B1
6364954 Umotoy et al. Apr 2002 B2
6364957 Schneider et al. Apr 2002 B1
6364958 Lai et al. Apr 2002 B1
6372657 Hineman et al. Apr 2002 B1
6375748 Yudovsky et al. Apr 2002 B1
6376386 Oshima Apr 2002 B1
6379575 Yin et al. Apr 2002 B1
6383896 Kirimura et al. May 2002 B1
6383951 Li May 2002 B1
6387182 Horie et al. May 2002 B1
6387207 Janakiraman et al. May 2002 B1
6391753 Yu May 2002 B1
6395150 Van Cleemput et al. May 2002 B1
6403491 Liu et al. Jun 2002 B1
6415736 Hao Jul 2002 B1
6416647 Dordi et al. Jul 2002 B1
6418874 Cox et al. Jul 2002 B1
6423284 Arno Jul 2002 B1
6427623 Ko Aug 2002 B2
6429465 Yagi et al. Aug 2002 B1
6432819 Pavate et al. Aug 2002 B1
6432831 Dhindsa Aug 2002 B2
6436193 Kasai et al. Aug 2002 B1
6436816 Lee et al. Aug 2002 B1
6437512 Chen et al. Aug 2002 B1
6440863 Tsai et al. Aug 2002 B1
6441492 Cunningham Aug 2002 B1
6444083 Steger et al. Sep 2002 B1
6446572 Brcka Sep 2002 B1
6447636 Qian et al. Sep 2002 B1
6448537 Nering Sep 2002 B1
6458718 Todd Oct 2002 B1
6461974 Ni et al. Oct 2002 B1
6462371 Weimer et al. Oct 2002 B1
6462372 Xia et al. Oct 2002 B1
6463782 Shen et al. Oct 2002 B1
6464795 Sherstinsky et al. Oct 2002 B1
6465051 Sahin et al. Oct 2002 B1
6465350 Taylor et al. Oct 2002 B1
6465366 Nemani et al. Oct 2002 B1
6471779 Nishio et al. Oct 2002 B1
6477980 White et al. Nov 2002 B1
6479373 Dreybrodt et al. Nov 2002 B2
6488984 Wada et al. Dec 2002 B1
6494959 Samoilov et al. Dec 2002 B1
6499425 Sandhu et al. Dec 2002 B1
6500728 Wang Dec 2002 B1
6503843 Xia et al. Jan 2003 B1
6506291 Tsai et al. Jan 2003 B2
6509283 Thomas Jan 2003 B1
6509623 Zhao Jan 2003 B2
6514377 Morimoto et al. Feb 2003 B1
6516815 Stevens et al. Feb 2003 B1
6518548 Sugaya et al. Feb 2003 B2
6527968 Wang et al. Mar 2003 B1
6528409 Lopatin et al. Mar 2003 B1
6528751 Hoffman et al. Mar 2003 B1
6531069 Srivastava et al. Mar 2003 B1
6537707 Lee Mar 2003 B1
6537733 Campana et al. Mar 2003 B2
6541397 Bencher Apr 2003 B1
6541671 Martinez et al. Apr 2003 B1
6544340 Yudovsky Apr 2003 B2
6547977 Yan et al. Apr 2003 B1
6551924 Dalton et al. Apr 2003 B1
6558564 Loewenhardt May 2003 B1
6565661 Nguyen May 2003 B1
6565729 Chen et al. May 2003 B2
6569773 Gellrich et al. May 2003 B1
6572937 Hakovirta et al. Jun 2003 B2
6573030 Fairbairn et al. Jun 2003 B1
6573606 Sambucetti et al. Jun 2003 B2
6576151 Vereecke et al. Jun 2003 B1
6585851 Ohmi et al. Jul 2003 B1
6586163 Okabe et al. Jul 2003 B1
6596599 Guo Jul 2003 B1
6596654 Bayman et al. Jul 2003 B1
6602434 Hung et al. Aug 2003 B1
6602806 Xia et al. Aug 2003 B1
6603269 Vo et al. Aug 2003 B1
6605874 Leu et al. Aug 2003 B2
6616967 Test Sep 2003 B1
6627532 Gaillard et al. Sep 2003 B1
6635575 Xia et al. Oct 2003 B1
6635578 Xu et al. Oct 2003 B1
6638810 Bakli et al. Oct 2003 B2
6638855 Chang et al. Oct 2003 B1
6645301 Sainty et al. Nov 2003 B2
6645550 Cheung et al. Nov 2003 B1
6656831 Lee et al. Dec 2003 B1
6656837 Xu et al. Dec 2003 B2
6656848 Scanlan et al. Dec 2003 B1
6663715 Yuda et al. Dec 2003 B1
6673200 Gu et al. Jan 2004 B1
6677242 Liu et al. Jan 2004 B1
6679981 Pan et al. Jan 2004 B1
6688375 Turner Feb 2004 B1
6692903 Chen et al. Feb 2004 B2
6713356 Skotnicki et al. Mar 2004 B1
6713835 Horak et al. Mar 2004 B1
6717189 Inoue et al. Apr 2004 B2
6720213 Gambino et al. Apr 2004 B1
6733620 Sugiyama et al. May 2004 B1
6736147 Satoh et al. May 2004 B2
6736987 Cho May 2004 B1
6740247 Han et al. May 2004 B1
6740585 Yoon et al. May 2004 B2
6740977 Ahn et al. May 2004 B2
6743473 Parkhe et al. Jun 2004 B1
6743732 Lin et al. Jun 2004 B1
6756235 Liu et al. Jun 2004 B1
6759261 Shimokohbe et al. Jul 2004 B2
6762127 Boiteux et al. Jul 2004 B2
6762435 Towle Jul 2004 B2
6764958 Nemani et al. Jul 2004 B1
6765273 Chau et al. Jul 2004 B1
6767834 Chung et al. Jul 2004 B2
6768079 Kosakai Jul 2004 B2
6770166 Fisher Aug 2004 B1
6772827 Keller et al. Aug 2004 B2
6779481 Kent et al. Aug 2004 B2
6792889 Nakano et al. Sep 2004 B2
6794290 Papasouliotis et al. Sep 2004 B1
6794311 Huang et al. Sep 2004 B2
6796314 Graff et al. Sep 2004 B1
6797189 Hung et al. Sep 2004 B2
6797634 Suzuki Sep 2004 B2
6800336 Fornsel et al. Oct 2004 B1
6800830 Mahawili Oct 2004 B2
6802944 Ahmad et al. Oct 2004 B2
6808564 Dietze Oct 2004 B2
6808747 Shih et al. Oct 2004 B1
6808748 Kapoor et al. Oct 2004 B2
6815633 Chen et al. Nov 2004 B1
6818561 Sonderman Nov 2004 B1
6821571 Huang Nov 2004 B2
6823589 White et al. Nov 2004 B2
6826451 del Puerto et al. Nov 2004 B2
6828241 Kholodenko et al. Dec 2004 B2
6830624 Janakiraman et al. Dec 2004 B2
6835995 Li Dec 2004 B2
6838684 Bakker et al. Jan 2005 B2
6846401 Wijenberg et al. Jan 2005 B2
6846745 Papasouliotis et al. Jan 2005 B1
6849854 Sainty Feb 2005 B2
6852550 Tuttle et al. Feb 2005 B2
6852584 Chen et al. Feb 2005 B1
6853533 Parkhe et al. Feb 2005 B2
6858153 Bjorkman et al. Feb 2005 B2
6861097 Goosey et al. Mar 2005 B1
6861332 Park et al. Mar 2005 B2
6869880 Krishnaraj et al. Mar 2005 B2
6872909 Holber et al. Mar 2005 B2
6875280 Ikeda et al. Apr 2005 B2
6878206 Tzu et al. Apr 2005 B2
6879981 Rothschild et al. Apr 2005 B2
6883733 Lind et al. Apr 2005 B1
6886491 Kim et al. May 2005 B2
6892669 Xu et al. May 2005 B2
6893967 Wright et al. May 2005 B1
6897532 Schwarz et al. May 2005 B1
6900596 Yang et al. May 2005 B2
6903511 Chistyakov Jun 2005 B2
6908862 Li et al. Jun 2005 B2
6911112 An Jun 2005 B2
6911401 Khandan et al. Jun 2005 B2
6916399 Rozenzon et al. Jul 2005 B1
6921556 Shimizu et al. Jul 2005 B2
6924191 Liu et al. Aug 2005 B2
6930047 Yamazaki Aug 2005 B2
6935269 Lee et al. Aug 2005 B2
6942753 Choi et al. Sep 2005 B2
6946033 Tsuei Sep 2005 B2
6951821 Hamelin et al. Oct 2005 B2
6958175 Sakamoto et al. Oct 2005 B2
6958286 Chen et al. Oct 2005 B2
6969619 Winniczek Nov 2005 B1
6972840 Gu et al. Dec 2005 B1
6974523 Benzing et al. Dec 2005 B2
6995073 Liou Feb 2006 B2
7017269 White et al. Mar 2006 B2
7017514 Shepherd Mar 2006 B1
7018941 Cui et al. Mar 2006 B2
7025857 Higashiura Apr 2006 B2
7030034 Fucsko et al. Apr 2006 B2
7037846 Srivastava et al. May 2006 B2
7049200 Arghavani et al. May 2006 B2
7049244 Becker et al. May 2006 B2
7052553 Shih et al. May 2006 B1
7071532 Geffken et al. Jul 2006 B2
7084070 Lee et al. Aug 2006 B1
7115525 Abatchev et al. Oct 2006 B2
7122949 Strikovski Oct 2006 B2
7138767 Chen et al. Nov 2006 B2
7145725 Hasel et al. Dec 2006 B2
7148155 Tarafdar et al. Dec 2006 B1
7153779 Trapp Dec 2006 B2
7166233 Johnson et al. Jan 2007 B2
7183214 Nam et al. Feb 2007 B2
7196342 Ershov et al. Mar 2007 B2
7226805 Hallin et al. Jun 2007 B2
7235137 Kitayama et al. Jun 2007 B2
7244474 Hanawa et al. Jul 2007 B2
7252011 Traverso Aug 2007 B2
7252716 Kim Aug 2007 B2
7253123 Arghavani et al. Aug 2007 B2
7255773 Ogasawara et al. Aug 2007 B2
7256370 Guiver Aug 2007 B2
7273526 Shinriki Sep 2007 B2
7274004 Benjamin et al. Sep 2007 B2
7288482 Panda et al. Oct 2007 B2
7291360 Hanawa et al. Nov 2007 B2
7297894 Tsukamoto Nov 2007 B1
7316761 Doan et al. Jan 2008 B2
7329608 Babayan et al. Feb 2008 B2
7341633 Lubomirsky et al. Mar 2008 B2
7344912 Okoroanyanwu Mar 2008 B1
7358192 Merry et al. Apr 2008 B2
7361865 Maki et al. Apr 2008 B2
7364956 Saito Apr 2008 B2
7365016 Ouellet et al. Apr 2008 B2
7396480 Kao et al. Jul 2008 B2
7396773 Blosse et al. Jul 2008 B1
7416989 Liu et al. Aug 2008 B1
7465358 Weidman et al. Dec 2008 B2
7465953 Koh et al. Dec 2008 B1
7468319 Lee Dec 2008 B2
7479303 Byun et al. Jan 2009 B2
7484473 Keller et al. Feb 2009 B2
7488688 Chung et al. Feb 2009 B2
7494545 Lam et al. Feb 2009 B2
7500445 Zhao et al. Mar 2009 B2
7504040 Lijima et al. Mar 2009 B2
7513214 Okumura et al. Apr 2009 B2
7520957 Kao et al. Apr 2009 B2
7543546 Shibata et al. Jun 2009 B2
7553756 Hayashi et al. Jun 2009 B2
7575007 Tang et al. Aug 2009 B2
7581511 Mardian et al. Sep 2009 B2
7604708 Wood et al. Oct 2009 B2
7611980 Wells Nov 2009 B2
7628897 Mungekar et al. Dec 2009 B2
7658799 Ishikawa et al. Feb 2010 B2
7682518 Chandrachood et al. Mar 2010 B2
7695590 Hanawa et al. Apr 2010 B2
7708859 Huang May 2010 B2
7722925 White et al. May 2010 B2
7723221 Hayashi May 2010 B2
7749326 Kim Jul 2010 B2
7780790 Nogami Aug 2010 B2
7785672 Choi et al. Aug 2010 B2
7790634 Munro et al. Sep 2010 B2
7806077 Lee et al. Oct 2010 B2
7806078 Yoshida Oct 2010 B2
7807578 Bencher et al. Oct 2010 B2
7825038 Ingle et al. Nov 2010 B2
7837828 Ikeda et al. Nov 2010 B2
7845309 Condrashoff et al. Dec 2010 B2
7867926 Satoh et al. Jan 2011 B2
7906818 Pekny Mar 2011 B2
7915139 Lang et al. Mar 2011 B1
7922863 Ripley Apr 2011 B2
7932181 Singh et al. Apr 2011 B2
7939422 Ingle et al. May 2011 B2
7968441 Xu Jun 2011 B2
7976631 Burrows Jul 2011 B2
7977249 Liu Jul 2011 B1
7981806 Jung Jul 2011 B2
7989365 Park et al. Aug 2011 B2
8008166 Sanchez et al. Aug 2011 B2
8048811 Feustel et al. Nov 2011 B2
8058179 Draeger et al. Nov 2011 B1
8071482 Kawada Dec 2011 B2
8074599 Choi et al. Dec 2011 B2
8076198 Lee et al. Dec 2011 B2
8083853 Choi et al. Dec 2011 B2
8088691 Kiehlbauch et al. Jan 2012 B2
8114245 Ohmi et al. Feb 2012 B2
8119530 Hori et al. Feb 2012 B2
8133323 Kakegawa Mar 2012 B2
8133349 Panagopoulos Mar 2012 B1
8173228 Choi et al. May 2012 B2
8183134 Wu May 2012 B2
8187486 Liu et al. May 2012 B1
8199454 Koyama et al. Jun 2012 B2
8202441 Chandrachood et al. Jun 2012 B2
8211808 Sapre et al. Jul 2012 B2
8216486 Dhindsa Jul 2012 B2
8222128 Sasaki et al. Jul 2012 B2
8252194 Kiehlbauch et al. Aug 2012 B2
8272346 Bettencourt et al. Sep 2012 B2
8277888 DeDontney Oct 2012 B2
8295089 Jeong et al. Oct 2012 B2
8298627 Minami et al. Oct 2012 B2
8298959 Cheshire Oct 2012 B2
8309440 Sanchez et al. Nov 2012 B2
8312839 Baek Nov 2012 B2
8313610 Dhindsa Nov 2012 B2
8328939 Choi et al. Dec 2012 B2
8329262 Miller et al. Dec 2012 B2
8336188 Monteen Dec 2012 B2
8343306 Tanaka et al. Jan 2013 B2
8357435 Lubomirsky Jan 2013 B2
8361892 Tam et al. Jan 2013 B2
8368308 Banna et al. Feb 2013 B2
8390980 Sansoni et al. Mar 2013 B2
8398777 Collins et al. Mar 2013 B2
8427067 Espiau et al. Apr 2013 B2
8435902 Tang et al. May 2013 B2
8440523 Guillorn et al. May 2013 B1
8466073 Wang et al. Jun 2013 B2
8475674 Thadani et al. Jul 2013 B2
8480850 Tyler et al. Jul 2013 B2
8491805 Kushibiki et al. Jul 2013 B2
8501629 Tang et al. Aug 2013 B2
8506713 Takagi Aug 2013 B2
8512509 Bera Aug 2013 B2
8528889 Nakano et al. Sep 2013 B2
8540844 Hudson et al. Sep 2013 B2
8551248 Goodlin Oct 2013 B2
8551891 Liang Oct 2013 B2
8573152 De La Llera Nov 2013 B2
8622021 Taylor et al. Jan 2014 B2
8623471 Tyler et al. Jan 2014 B2
8633423 Lin et al. Jan 2014 B2
8642481 Wang et al. Feb 2014 B2
8652298 Dhindsa et al. Feb 2014 B2
8668836 Mizukami et al. Mar 2014 B2
8679354 O'Hara Mar 2014 B2
8679982 Wang et al. Mar 2014 B2
8679983 Wang et al. Mar 2014 B2
8691023 Bao et al. Apr 2014 B2
8702902 Blom et al. Apr 2014 B2
8741778 Yang et al. Jun 2014 B2
8747610 Chen et al. Jun 2014 B2
8747680 Deshpande Jun 2014 B1
8748322 Fung et al. Jun 2014 B1
8765574 Zhang et al. Jul 2014 B2
8771536 Zhang et al. Jul 2014 B2
8771539 Zhang et al. Jul 2014 B2
8772888 Jung et al. Jul 2014 B2
8778079 Begarney Jul 2014 B2
8801952 Wang et al. Aug 2014 B1
8802572 Nemani et al. Aug 2014 B2
8808563 Wang et al. Aug 2014 B2
8815720 Godet et al. Aug 2014 B2
8835316 Yin et al. Sep 2014 B2
8846163 Kao et al. Sep 2014 B2
8869742 Dhindsa Oct 2014 B2
8871651 Choi et al. Oct 2014 B1
8888087 Okabe et al. Nov 2014 B2
8894767 Chuc Nov 2014 B2
8895449 Zhu et al. Nov 2014 B1
8900364 Wright Dec 2014 B2
8920597 Ramaswamy Dec 2014 B2
8921234 Liu et al. Dec 2014 B2
8927390 Sapre et al. Jan 2015 B2
8932947 Han et al. Jan 2015 B1
8937017 Cheshire et al. Jan 2015 B2
8945414 Su et al. Feb 2015 B1
8946665 Shim et al. Feb 2015 B2
8946828 Sun et al. Feb 2015 B2
8951429 Liu et al. Feb 2015 B1
8956980 Chen et al. Feb 2015 B1
8969212 Ren et al. Mar 2015 B2
8970114 Busche et al. Mar 2015 B2
8980005 Carlson Mar 2015 B2
8980758 Ling et al. Mar 2015 B1
8980763 Wang et al. Mar 2015 B2
8992723 Sorensen et al. Mar 2015 B2
8999656 Jirstrom et al. Apr 2015 B2
8999839 Su et al. Apr 2015 B2
8999856 Zhang et al. Apr 2015 B2
9012302 Sapre et al. Apr 2015 B2
9017481 Petti Apr 2015 B1
9023732 Wang et al. May 2015 B2
9023734 Chen et al. May 2015 B2
9034770 Park et al. May 2015 B2
9039911 Hudson et al. May 2015 B2
9040353 Yajima et al. May 2015 B2
9040422 Wang et al. May 2015 B2
9057128 Olgado Jun 2015 B2
9064815 Zhang et al. Jun 2015 B2
9064816 Kim et al. Jun 2015 B2
9068265 Lubomirsky et al. Jun 2015 B2
9072158 Ikeda et al. Jun 2015 B2
9093371 Wang et al. Jul 2015 B2
9093389 Nemani Jul 2015 B2
9093390 Wang et al. Jul 2015 B2
9099398 Kang et al. Aug 2015 B2
9111877 Chen et al. Aug 2015 B2
9111907 Kamineni Aug 2015 B2
9114438 Hoinkis et al. Aug 2015 B2
9117855 Cho et al. Aug 2015 B2
9132436 Liang Sep 2015 B2
9136273 Purayath et al. Sep 2015 B1
9144147 Yang et al. Sep 2015 B2
9153442 Wang et al. Oct 2015 B2
9159606 Purayath et al. Oct 2015 B1
9165783 Nemani et al. Oct 2015 B2
9165786 Purayath et al. Oct 2015 B1
9184055 Wang et al. Nov 2015 B2
9190290 Xue et al. Nov 2015 B2
9190293 Wang et al. Nov 2015 B2
9190302 Ni Nov 2015 B2
9202708 Chen et al. Dec 2015 B1
9209012 Chen et al. Dec 2015 B2
9236265 Korolik et al. Jan 2016 B2
9236266 Zhang et al. Jan 2016 B2
9240315 Hsieh et al. Jan 2016 B1
9245762 Zhang et al. Jan 2016 B2
9263278 Purayath et al. Feb 2016 B2
9267739 Chen et al. Feb 2016 B2
9269590 Luere et al. Feb 2016 B2
9275834 Park et al. Mar 2016 B1
9281384 Takeguchi Mar 2016 B2
9287095 Nguyen et al. Mar 2016 B2
9287134 Wang et al. Mar 2016 B2
9293568 Ko Mar 2016 B2
9299537 Kobayashi et al. Mar 2016 B2
9299538 Kobayashi et al. Mar 2016 B2
9299539 Makhratchev Mar 2016 B2
9299575 Park et al. Mar 2016 B2
9299582 Ingle et al. Mar 2016 B2
9299583 Wang et al. Mar 2016 B1
9309598 Wang et al. Apr 2016 B2
9324576 Zhang et al. Apr 2016 B2
9343272 Pandit et al. May 2016 B1
9343327 Zhang et al. May 2016 B2
9349605 Xu et al. May 2016 B1
9355856 Wang et al. May 2016 B2
9355862 Pandit et al. May 2016 B2
9355863 Chen et al. May 2016 B2
9355922 Park et al. May 2016 B2
9362130 Ingle et al. Jun 2016 B2
9362163 Danek et al. Jun 2016 B2
9368364 Park et al. Jun 2016 B2
9373517 Yang et al. Jun 2016 B2
9373522 Wang et al. Jun 2016 B1
9378969 Hsu et al. Jun 2016 B2
9378978 Purayath et al. Jun 2016 B2
9384997 Ren et al. Jul 2016 B2
9385028 Nemani et al. Jul 2016 B2
9390937 Chen et al. Jul 2016 B2
9396961 Arghavani et al. Jul 2016 B2
9396989 Purayath et al. Jul 2016 B2
9406523 Chen et al. Aug 2016 B2
9412608 Wang et al. Aug 2016 B2
9412752 Yeh et al. Aug 2016 B1
9418858 Wang et al. Aug 2016 B2
9425041 Berry et al. Aug 2016 B2
9425057 Cho et al. Aug 2016 B2
9425058 Kim et al. Aug 2016 B2
9431268 Lill et al. Aug 2016 B2
9431414 Jang et al. Aug 2016 B2
9343358 Montgomery Sep 2016 B1
9437451 Chen et al. Sep 2016 B2
9443749 Smith Sep 2016 B2
9449795 Sabri et al. Sep 2016 B2
9449843 Korolik et al. Sep 2016 B1
9449845 Liu et al. Sep 2016 B2
9449846 Liu et al. Sep 2016 B2
9449850 Wang et al. Sep 2016 B2
9460893 Kawamata et al. Oct 2016 B2
9460959 Xie et al. Oct 2016 B1
9466469 Khaja Oct 2016 B2
9472412 Zhang et al. Oct 2016 B2
9472417 Ingle et al. Oct 2016 B2
9478432 Chen et al. Oct 2016 B2
9478433 Zhou et al. Oct 2016 B1
9478434 Wang et al. Oct 2016 B2
9493879 Hoinkis et al. Nov 2016 B2
9496167 Purayath et al. Nov 2016 B2
9499898 Nguyen et al. Nov 2016 B2
9502258 Xue et al. Nov 2016 B2
9508529 Valcore et al. Nov 2016 B2
9520303 Wang et al. Dec 2016 B2
9528183 Wu et al. Dec 2016 B2
9534724 Jiang et al. Jan 2017 B2
9543163 Ling et al. Jan 2017 B2
9564296 Kobayashi et al. Feb 2017 B2
9564338 Zhang et al. Feb 2017 B1
9576788 Liu et al. Feb 2017 B2
9576809 Korolik et al. Feb 2017 B2
9576815 Xu Feb 2017 B2
9583399 Chen et al. Feb 2017 B1
9607856 Wang et al. Mar 2017 B2
9613822 Chen et al. Apr 2017 B2
9659753 Cho et al. May 2017 B2
9659791 Wang et al. May 2017 B2
9659792 Wang et al. May 2017 B2
9663856 Kasai May 2017 B2
9666449 Koval et al. May 2017 B2
9677176 Chandrasekharan Jun 2017 B2
9679750 Choi Jun 2017 B2
9691645 Benjaminson et al. Jun 2017 B2
9704723 Wang et al. Jul 2017 B2
9711366 Ingle et al. Jul 2017 B2
9721789 Yang et al. Aug 2017 B1
9728437 Tran et al. Aug 2017 B2
9741593 Benjaminson et al. Aug 2017 B2
9754800 Zhang et al. Sep 2017 B2
9768034 Xu et al. Sep 2017 B1
9773648 Cho et al. Sep 2017 B2
9773695 Purayath et al. Sep 2017 B2
9779956 Zhang et al. Oct 2017 B1
9812462 Pang et al. Nov 2017 B1
9822009 Kagaya et al. Nov 2017 B2
9831097 Ingle et al. Nov 2017 B2
9837249 Kobayashi et al. Dec 2017 B2
9837284 Chen et al. Dec 2017 B2
9837286 Yang et al. Dec 2017 B2
9840777 Zhou Dec 2017 B2
9842744 Zhang et al. Dec 2017 B2
9865484 Citla et al. Jan 2018 B1
9881805 Li et al. Jan 2018 B2
9885117 Lubomirsky et al. Feb 2018 B2
9887096 Park et al. Feb 2018 B2
9903020 Kim et al. Feb 2018 B2
9934942 Lubomirsky Apr 2018 B1
9941097 Yamazawa Apr 2018 B2
9947549 Park et al. Apr 2018 B1
9960045 Purayath et al. May 2018 B1
9966240 Park et al. May 2018 B2
9978564 Liang May 2018 B2
9991134 Wang et al. Jun 2018 B2
10026621 Ko et al. Jul 2018 B2
10032606 Yang et al. Jul 2018 B2
10043674 Korolik et al. Aug 2018 B1
10043684 Arnepalli et al. Aug 2018 B1
10049891 Wang et al. Aug 2018 B1
10062578 Zhang et al. Aug 2018 B2
10062579 Chen et al. Aug 2018 B2
10062585 Lubomirsky Aug 2018 B2
10062587 Chen et al. Aug 2018 B2
10083830 Seino et al. Sep 2018 B2
10121689 Konkola et al. Nov 2018 B2
10147620 Benjaminson et al. Dec 2018 B2
10147736 Linuma Dec 2018 B2
10217614 Tucker et al. Feb 2019 B2
10240231 Du Mar 2019 B2
10256079 Lubomirsky et al. Apr 2019 B2
10269541 Stowell et al. Apr 2019 B2
10319600 Li et al. Jun 2019 B1
10319739 Purayath Jun 2019 B2
10354843 Liang Jul 2019 B2
10418246 Kuratomi Sep 2019 B2
10465294 Wang et al. Nov 2019 B2
10468276 Benjaminson et al. Nov 2019 B2
10472717 Sawachi Nov 2019 B2
10480074 Zhou et al. Nov 2019 B2
10504754 Tan et al. Dec 2019 B2
10533252 Chiu Jan 2020 B2
10541145 Ogawa Jan 2020 B2
10550472 Chuc Feb 2020 B2
10615007 Stowell et al. Apr 2020 B2
10679870 Samir et al. Jun 2020 B2
10699921 Samir Jun 2020 B2
10770300 Kuratomi Sep 2020 B2
10934621 Sung et al. Mar 2021 B2
20010003014 Yuda Jun 2001 A1
20010006093 Tabuchi Jul 2001 A1
20010008803 Takamatsu et al. Jul 2001 A1
20010015175 Masuda et al. Aug 2001 A1
20010015261 Kobayashi et al. Aug 2001 A1
20010023741 Collison et al. Sep 2001 A1
20010027026 Dhindsa et al. Oct 2001 A1
20010028093 Yamazaki et al. Oct 2001 A1
20010028922 Sandhu Oct 2001 A1
20010029112 Toyoda et al. Oct 2001 A1
20010029891 Oh et al. Oct 2001 A1
20010030366 Nakano et al. Oct 2001 A1
20010034106 Moise et al. Oct 2001 A1
20010034121 Fu et al. Oct 2001 A1
20010035124 Okayama et al. Nov 2001 A1
20010035127 Metzner Nov 2001 A1
20010036706 Kitamura Nov 2001 A1
20010037856 Park Nov 2001 A1
20010037941 Thompson Nov 2001 A1
20010039921 Rolfson et al. Nov 2001 A1
20010042512 Xu et al. Nov 2001 A1
20010042799 Kim et al. Nov 2001 A1
20010045269 Yamada Nov 2001 A1
20010047760 Moslehi Dec 2001 A1
20010053585 Kikuchi et al. Dec 2001 A1
20010053610 Athavale Dec 2001 A1
20010054381 Umotoy et al. Dec 2001 A1
20010054387 Frankel et al. Dec 2001 A1
20020000202 Yuda et al. Jan 2002 A1
20020001778 Latchford et al. Jan 2002 A1
20020009560 Ozono Jan 2002 A1
20020009885 Brankner et al. Jan 2002 A1
20020011210 Satoh et al. Jan 2002 A1
20020011214 Kamarehi et al. Jan 2002 A1
20020015791 Tobe et al. Feb 2002 A1
20020016080 Khan et al. Feb 2002 A1
20020016085 Huang et al. Feb 2002 A1
20020017243 Pyo Feb 2002 A1
20020020429 Selbrede et al. Feb 2002 A1
20020023899 Khater et al. Feb 2002 A1
20020028582 Nallan et al. Mar 2002 A1
20020028585 Chung et al. Mar 2002 A1
20020029747 Powell et al. Mar 2002 A1
20020033233 Savas Mar 2002 A1
20020036143 Segawa et al. Mar 2002 A1
20020038791 Okumura et al. Apr 2002 A1
20020040764 Kwan et al. Apr 2002 A1
20020040766 Takahashi Apr 2002 A1
20020042192 Tanaka et al. Apr 2002 A1
20020043690 Doyle et al. Apr 2002 A1
20020045966 Lee et al. Apr 2002 A1
20020046991 Smith et al. Apr 2002 A1
20020048963 Campbell et al. Apr 2002 A1
20020050246 Parkhe May 2002 A1
20020054962 Huang May 2002 A1
20020062954 Getchel et al. May 2002 A1
20020069820 Yudovsky Jun 2002 A1
20020070414 Drescher et al. Jun 2002 A1
20020073925 Noble et al. Jun 2002 A1
20020074573 Takeuchi et al. Jun 2002 A1
20020075624 Wang et al. Jun 2002 A1
20020086501 O'Donnell et al. Jul 2002 A1
20020090781 Skotnicki et al. Jul 2002 A1
20020090835 Chakravarti et al. Jul 2002 A1
20020094378 O'Donnell Jul 2002 A1
20020094591 Sill et al. Jul 2002 A1
20020096493 Hattori Jul 2002 A1
20020098681 Hu et al. Jul 2002 A1
20020106845 Chao et al. Aug 2002 A1
20020112819 Kamarehi et al. Aug 2002 A1
20020124867 Kim et al. Sep 2002 A1
20020129769 Kim et al. Sep 2002 A1
20020129902 Babayan et al. Sep 2002 A1
20020144657 Chiang et al. Oct 2002 A1
20020153808 Skotnicki et al. Oct 2002 A1
20020164885 Lill et al. Nov 2002 A1
20020170678 Hayashi et al. Nov 2002 A1
20020177322 Li et al. Nov 2002 A1
20020179248 Kabansky et al. Dec 2002 A1
20020182878 Hirose et al. Dec 2002 A1
20020185226 Lea et al. Dec 2002 A1
20020187280 Johnson et al. Dec 2002 A1
20020187655 Tan et al. Dec 2002 A1
20020197823 Yoo et al. Dec 2002 A1
20030000473 Chae et al. Jan 2003 A1
20030000647 Yudovsky et al. Jan 2003 A1
20030003757 Naltan et al. Jan 2003 A1
20030007910 Lazarovich et al. Jan 2003 A1
20030010452 Park et al. Jan 2003 A1
20030010645 Ting et al. Jan 2003 A1
20030015515 Ito et al. Jan 2003 A1
20030019428 Ku et al. Jan 2003 A1
20030019580 Strang Jan 2003 A1
20030026060 Hiramatsu et al. Feb 2003 A1
20030029566 Roth Feb 2003 A1
20030029567 Dhindsa et al. Feb 2003 A1
20030029715 Yu et al. Feb 2003 A1
20030031905 Saito et al. Feb 2003 A1
20030032284 Enomoto et al. Feb 2003 A1
20030038127 Liu et al. Feb 2003 A1
20030038305 Wasshuber Feb 2003 A1
20030054608 Tseng et al. Mar 2003 A1
20030066482 Pokharna et al. Apr 2003 A1
20030066607 White et al. Apr 2003 A1
20030070761 Turlot et al. Apr 2003 A1
20030071035 Brailove Apr 2003 A1
20030072639 White et al. Apr 2003 A1
20030075808 Inoue et al. Apr 2003 A1
20030077857 Xia et al. Apr 2003 A1
20030077909 Jiwari Apr 2003 A1
20030079686 Chen et al. May 2003 A1
20030087488 Fink May 2003 A1
20030087531 Kang et al. May 2003 A1
20030091938 Fairbairn et al. May 2003 A1
20030094134 Minami et al. May 2003 A1
20030098125 An May 2003 A1
20030101938 Ronsse et al. Jun 2003 A1
20030109143 Hsieh et al. Jun 2003 A1
20030116087 Nguyen et al. Jun 2003 A1
20030116439 Seo et al. Jun 2003 A1
20030119328 Fujisato Jun 2003 A1
20030121608 Chen et al. Jul 2003 A1
20030121609 Ohmi et al. Jul 2003 A1
20030124465 Lee et al. Jul 2003 A1
20030124842 Hytros et al. Jul 2003 A1
20030127049 Han et al. Jul 2003 A1
20030127740 Hsu et al. Jul 2003 A1
20030129106 Sorensen et al. Jul 2003 A1
20030129827 Lee et al. Jul 2003 A1
20030132319 Hytros et al. Jul 2003 A1
20030136520 Yudovsky et al. Jul 2003 A1
20030140844 Maa et al. Jul 2003 A1
20030143328 Chen et al. Jul 2003 A1
20030148035 Lingampalli Aug 2003 A1
20030150530 Lin et al. Aug 2003 A1
20030152691 Baude Aug 2003 A1
20030159307 Sago et al. Aug 2003 A1
20030164226 Kanno et al. Sep 2003 A1
20030168439 Kanno et al. Sep 2003 A1
20030170390 Derraa et al. Sep 2003 A1
20030170945 Igeta et al. Sep 2003 A1
20030173333 Wang et al. Sep 2003 A1
20030173347 Guiver Sep 2003 A1
20030173675 Watanabe Sep 2003 A1
20030181040 Ivanov et al. Sep 2003 A1
20030183244 Rossman Oct 2003 A1
20030190426 Padhi et al. Oct 2003 A1
20030196757 Todorow et al. Oct 2003 A1
20030196760 Tyler et al. Oct 2003 A1
20030199170 Li Oct 2003 A1
20030200929 Otsuki Oct 2003 A1
20030201764 Jafari et al. Oct 2003 A1
20030205329 Gujer et al. Nov 2003 A1
20030205479 Lin et al. Nov 2003 A1
20030209323 Yokogaki et al. Nov 2003 A1
20030215570 Seutter et al. Nov 2003 A1
20030215963 AmRhein et al. Nov 2003 A1
20030216044 Lin et al. Nov 2003 A1
20030217810 Chen et al. Nov 2003 A1
20030217812 Yoshiki et al. Nov 2003 A1
20030221780 Lei et al. Dec 2003 A1
20030224217 Byun et al. Dec 2003 A1
20030224617 Baek et al. Dec 2003 A1
20030230385 Bach et al. Dec 2003 A1
20040002221 O'Donnell et al. Jan 2004 A1
20040003828 Jackson Jan 2004 A1
20040005726 Huang Jan 2004 A1
20040018304 Chung et al. Jan 2004 A1
20040020801 Solling Feb 2004 A1
20040025788 Ogasawara et al. Feb 2004 A1
20040026371 Nguyen et al. Feb 2004 A1
20040033678 Arghavani et al. Feb 2004 A1
20040033684 Li Feb 2004 A1
20040035364 Tomoyoshi et al. Feb 2004 A1
20040050328 Kumagai et al. Mar 2004 A1
20040058070 Takeuchi et al. Mar 2004 A1
20040058293 Nguyen et al. Mar 2004 A1
20040060514 Janakiraman et al. Apr 2004 A1
20040061447 Saigusa et al. Apr 2004 A1
20040069225 Fairbairn et al. Apr 2004 A1
20040070346 Choi Apr 2004 A1
20040072446 Liu et al. Apr 2004 A1
20040076529 Gnauck et al. Apr 2004 A1
20040083962 Bang May 2004 A1
20040083967 Yuda et al. May 2004 A1
20040087139 Yeh et al. May 2004 A1
20040092063 Okumura May 2004 A1
20040099213 Adomaitis et al. May 2004 A1
20040099285 Wang et al. May 2004 A1
20040099378 Kim et al. May 2004 A1
20040101667 O'Loughlin et al. May 2004 A1
20040103844 Chou et al. Jun 2004 A1
20040107908 Collins et al. Jun 2004 A1
20040108067 Fischione et al. Jun 2004 A1
20040108068 Senzaki et al. Jun 2004 A1
20040115876 Goundar et al. Jun 2004 A1
20040115947 Fink et al. Jun 2004 A1
20040118519 Sen et al. Jun 2004 A1
20040123800 Schlottmann Jul 2004 A1
20040124280 Shih et al. Jul 2004 A1
20040129671 Ji et al. Jul 2004 A1
20040137161 Segawa et al. Jul 2004 A1
20040140053 Srivastava et al. Jul 2004 A1
20040144311 Chen et al. Jul 2004 A1
20040144490 Zhao et al. Jul 2004 A1
20040147126 Yamashita et al. Jul 2004 A1
20040149223 Collison et al. Aug 2004 A1
20040149387 Kim et al. Aug 2004 A1
20040149394 Doan et al. Aug 2004 A1
20040149699 Hofman et al. Aug 2004 A1
20040152342 Li Aug 2004 A1
20040154535 Chen et al. Aug 2004 A1
20040157444 Chiu Aug 2004 A1
20040161921 Ryu Aug 2004 A1
20040163590 Tran et al. Aug 2004 A1
20040163594 Windhorn Aug 2004 A1
20040163601 Kadotani et al. Aug 2004 A1
20040175913 Johnson et al. Sep 2004 A1
20040175929 Schmitt et al. Sep 2004 A1
20040182315 Laflamme et al. Sep 2004 A1
20040187787 Dawson Sep 2004 A1
20040192032 Ohmori et al. Sep 2004 A1
20040194799 Kim et al. Oct 2004 A1
20040195208 Pavel et al. Oct 2004 A1
20040195216 Strang Oct 2004 A1
20040200499 Harvey Oct 2004 A1
20040201843 Glenn et al. Oct 2004 A1
20040206730 Holber et al. Oct 2004 A1
20040211357 Gadgil et al. Oct 2004 A1
20040219723 Peng et al. Nov 2004 A1
20040219737 Quon Nov 2004 A1
20040219789 Wood et al. Nov 2004 A1
20040221809 Ohmi et al. Nov 2004 A1
20040231706 Bhatnagar et al. Nov 2004 A1
20040237897 Hanawa et al. Dec 2004 A1
20040238123 Becknell et al. Dec 2004 A1
20040259367 Constantine et al. Dec 2004 A1
20040261721 Steger Dec 2004 A1
20040263827 Xu Dec 2004 A1
20050000430 Jang et al. Jan 2005 A1
20050000432 Keller et al. Jan 2005 A1
20050001276 Gao et al. Jan 2005 A1
20050003669 Han et al. Jan 2005 A1
20050003676 Ho et al. Jan 2005 A1
20050009340 Saijo et al. Jan 2005 A1
20050009358 Choi et al. Jan 2005 A1
20050026430 Kim et al. Feb 2005 A1
20050026431 Kazumi et al. Feb 2005 A1
20050034815 Kasai et al. Feb 2005 A1
20050035455 Hu et al. Feb 2005 A1
20050039679 Kieshock Feb 2005 A1
20050051094 Schaepkens et al. Mar 2005 A1
20050054167 Choi et al. Mar 2005 A1
20050056218 Sun et al. Mar 2005 A1
20050073051 Yamamoto et al. Apr 2005 A1
20050077284 Natsuhara et al. Apr 2005 A1
20050079706 Kumar et al. Apr 2005 A1
20050087517 Ott et al. Apr 2005 A1
20050090078 Ishihara Apr 2005 A1
20050090120 Hasegawa et al. Apr 2005 A1
20050098111 Shimizu et al. May 2005 A1
20050098265 Fink et al. May 2005 A1
20050103267 Hur et al. May 2005 A1
20050103440 Sato et al. May 2005 A1
20050105991 Hofmeister et al. May 2005 A1
20050109279 Suzuki May 2005 A1
20050112876 Wu May 2005 A1
20050112901 Ji et al. May 2005 A1
20050123690 Derderian et al. Jun 2005 A1
20050133849 Jeon et al. Jun 2005 A1
20050136188 Chang Jun 2005 A1
20050136684 Mukai et al. Jun 2005 A1
20050139578 Fukuda et al. Jun 2005 A1
20050145173 Holber et al. Jul 2005 A1
20050145341 Suzuki Jul 2005 A1
20050164479 Perng et al. Jul 2005 A1
20050167052 Ishihara et al. Aug 2005 A1
20050167394 Liu et al. Aug 2005 A1
20050176258 Hirose et al. Aug 2005 A1
20050178746 Gorin Aug 2005 A1
20050178748 Buchberger et al. Aug 2005 A1
20050181588 Kim Aug 2005 A1
20050183666 Tsuji et al. Aug 2005 A1
20050183827 White et al. Aug 2005 A1
20050194094 Yasaka Sep 2005 A1
20050196967 Savas et al. Sep 2005 A1
20050199489 Stevens et al. Sep 2005 A1
20050205110 Kao et al. Sep 2005 A1
20050205862 Koemtzopoulos et al. Sep 2005 A1
20050208215 Eguchi et al. Sep 2005 A1
20050208217 Shinriki et al. Sep 2005 A1
20050214477 Hanawa et al. Sep 2005 A1
20050217582 Kim et al. Oct 2005 A1
20050218507 Kao et al. Oct 2005 A1
20050219786 Brown et al. Oct 2005 A1
20050221552 Kao et al. Oct 2005 A1
20050224181 Merry et al. Oct 2005 A1
20050229848 Shinriki et al. Oct 2005 A1
20050230350 Kao et al. Oct 2005 A1
20050236694 Wu et al. Oct 2005 A1
20050238807 Lin et al. Oct 2005 A1
20050239282 Chen et al. Oct 2005 A1
20050241579 Kidd Nov 2005 A1
20050241583 Buechel et al. Nov 2005 A1
20050241763 Huang Nov 2005 A1
20050247672 Tatsumi Nov 2005 A1
20050251990 Choi et al. Nov 2005 A1
20050257890 Park et al. Nov 2005 A1
20050258160 Goto et al. Nov 2005 A1
20050266622 Arghavani et al. Dec 2005 A1
20050266650 Ahn et al. Dec 2005 A1
20050266691 Gu et al. Dec 2005 A1
20050268856 Miller et al. Dec 2005 A1
20050269030 Kent et al. Dec 2005 A1
20050271812 Myo et al. Dec 2005 A1
20050274324 Takahashi et al. Dec 2005 A1
20050274396 Shih et al. Dec 2005 A1
20050279454 Snijders Dec 2005 A1
20050283321 Yue et al. Dec 2005 A1
20050287688 Won et al. Dec 2005 A1
20050287755 Bachmann Dec 2005 A1
20050287771 Seamons et al. Dec 2005 A1
20060000802 Kumar et al. Jan 2006 A1
20060000805 Todorow et al. Jan 2006 A1
20060005856 Sun et al. Jan 2006 A1
20060005930 Ikeda et al. Jan 2006 A1
20060006057 Laermer Jan 2006 A1
20060008676 Ebata et al. Jan 2006 A1
20060011298 Lim et al. Jan 2006 A1
20060011299 Condrashoff et al. Jan 2006 A1
20060016783 Wu et al. Jan 2006 A1
20060019456 Bu et al. Jan 2006 A1
20060019477 Hanawa et al. Jan 2006 A1
20060019486 Yu et al. Jan 2006 A1
20060021574 Armour Feb 2006 A1
20060021701 Tobe et al. Feb 2006 A1
20060021703 Umotoy et al. Feb 2006 A1
20060024954 Wu et al. Feb 2006 A1
20060024956 Zhijian et al. Feb 2006 A1
20060032833 Kawaguchi et al. Feb 2006 A1
20060033678 Lubomirsky et al. Feb 2006 A1
20060040055 Nguyen et al. Feb 2006 A1
20060042545 Shibata et al. Mar 2006 A1
20060043066 Kamp Mar 2006 A1
20060046412 Nguyen et al. Mar 2006 A1
20060046419 Sandhu et al. Mar 2006 A1
20060046470 Becknell Mar 2006 A1
20060051966 Or et al. Mar 2006 A1
20060051968 Joshi et al. Mar 2006 A1
20060054184 Mozetic et al. Mar 2006 A1
20060054280 Jang Mar 2006 A1
20060057828 Omura et al. Mar 2006 A1
20060060942 Minixhofer et al. Mar 2006 A1
20060065629 Chen et al. Mar 2006 A1
20060073349 Aihara et al. Apr 2006 A1
20060075969 Fischer Apr 2006 A1
20060076108 Holland et al. Apr 2006 A1
20060081337 Himori et al. Apr 2006 A1
20060087644 McMillin et al. Apr 2006 A1
20060090700 Satoh et al. May 2006 A1
20060093756 Rajagopalan et al. May 2006 A1
20060097397 Russell et al. May 2006 A1
20060102076 Smith et al. May 2006 A1
20060102587 Kimura May 2006 A1
20060113038 Gondhalekar et al. Jun 2006 A1
20060118178 Desbiolles et al. Jun 2006 A1
20060118240 Holber et al. Jun 2006 A1
20060121724 Yue et al. Jun 2006 A1
20060124151 Yamasaki et al. Jun 2006 A1
20060124242 Kanarik et al. Jun 2006 A1
20060130971 Chang et al. Jun 2006 A1
20060137613 Kasai Jun 2006 A1
20060151115 Kim et al. Jul 2006 A1
20060157449 Takahashi et al. Jul 2006 A1
20060162661 Jung et al. Jul 2006 A1
20060166107 Chen et al. Jul 2006 A1
20060166515 Karim et al. Jul 2006 A1
20060169327 Shajii et al. Aug 2006 A1
20060169410 Maeda et al. Aug 2006 A1
20060178008 Yeh et al. Aug 2006 A1
20060183270 Humpston Aug 2006 A1
20060185592 Matsuura Aug 2006 A1
20060191479 Mizukami et al. Aug 2006 A1
20060191637 Zajac et al. Aug 2006 A1
20060207504 Hasebe et al. Sep 2006 A1
20060207595 Ohmi et al. Sep 2006 A1
20060207971 Moriya et al. Sep 2006 A1
20060210713 Brcka Sep 2006 A1
20060210723 Ishizaka Sep 2006 A1
20060211163 Ouellet et al. Sep 2006 A1
20060215347 Wakabayashi et al. Sep 2006 A1
20060216878 Lee Sep 2006 A1
20060219360 Iwasaki Oct 2006 A1
20060222481 Foree Oct 2006 A1
20060226121 Aoi Oct 2006 A1
20060228496 Choi Oct 2006 A1
20060228889 Edelberg et al. Oct 2006 A1
20060236932 Yokogawa et al. Oct 2006 A1
20060240661 Annapragada et al. Oct 2006 A1
20060244107 Sugihara Nov 2006 A1
20060245852 Iwabuchi Nov 2006 A1
20060246217 Weidman et al. Nov 2006 A1
20060251800 Weidman et al. Nov 2006 A1
20060251801 Weidman et al. Nov 2006 A1
20060252252 Zhu et al. Nov 2006 A1
20060252265 Jin et al. Nov 2006 A1
20060254716 Mosden et al. Nov 2006 A1
20060260750 Rueger Nov 2006 A1
20060261490 Su et al. Nov 2006 A1
20060264043 Stewart et al. Nov 2006 A1
20060266288 Choi Nov 2006 A1
20060285270 Lee Dec 2006 A1
20060286774 Singh et al. Dec 2006 A1
20060289384 Pavel et al. Dec 2006 A1
20060292846 Pinto et al. Dec 2006 A1
20070007276 Steger Jan 2007 A1
20070022952 Ritchie et al. Feb 2007 A1
20070022954 Ilzuka et al. Feb 2007 A1
20070023320 Itakura et al. Feb 2007 A1
20070025907 Rezeq Feb 2007 A1
20070039548 Johnson Feb 2007 A1
20070048977 Lee et al. Mar 2007 A1
20070051471 Kawaguchi et al. Mar 2007 A1
20070056925 Liu et al. Mar 2007 A1
20070062453 Ishikawa Mar 2007 A1
20070066084 Wajda et al. Mar 2007 A1
20070068625 Funk et al. Mar 2007 A1
20070071888 Shanmugasundram et al. Mar 2007 A1
20070072408 Enomoto et al. Mar 2007 A1
20070077737 Kobayashi Apr 2007 A1
20070079758 Holland et al. Apr 2007 A1
20070087949 Wu et al. Apr 2007 A1
20070090325 Hwang et al. Apr 2007 A1
20070096658 Saigusa et al. May 2007 A1
20070099428 Shamiryan et al. May 2007 A1
20070099431 Li May 2007 A1
20070099438 Ye et al. May 2007 A1
20070107750 Sawin et al. May 2007 A1
20070108404 Stewart et al. May 2007 A1
20070111519 Lubomirsky et al. May 2007 A1
20070117396 Wu et al. May 2007 A1
20070119370 Ma May 2007 A1
20070119371 Ma May 2007 A1
20070123051 Arghavani et al. May 2007 A1
20070128864 Ma Jun 2007 A1
20070128876 Fukiage Jun 2007 A1
20070131274 Stollwerck et al. Jun 2007 A1
20070145023 Holber et al. Jun 2007 A1
20070148349 Fukada Jun 2007 A1
20070154838 Lee Jul 2007 A1
20070163440 Kim et al. Jul 2007 A1
20070169703 Elliot et al. Jul 2007 A1
20070175861 Hwang et al. Aug 2007 A1
20070181057 Lam et al. Aug 2007 A1
20070193515 Jeon et al. Aug 2007 A1
20070197028 Byun et al. Aug 2007 A1
20070207275 Nowak et al. Sep 2007 A1
20070209931 Miller Sep 2007 A1
20070212288 Holst Sep 2007 A1
20070221620 Sakthivel et al. Sep 2007 A1
20070227554 Satoh et al. Oct 2007 A1
20070231109 Pak et al. Oct 2007 A1
20070232071 Balseanu et al. Oct 2007 A1
20070235134 Limuro Oct 2007 A1
20070235136 Enomoto et al. Oct 2007 A1
20070238199 Yamashita Oct 2007 A1
20070238321 Futase et al. Oct 2007 A1
20070243685 Jiang et al. Oct 2007 A1
20070243714 Shin et al. Oct 2007 A1
20070254169 Kamins et al. Nov 2007 A1
20070254486 Bera et al. Nov 2007 A1
20070258186 Matyushkin et al. Nov 2007 A1
20070259467 Tweet et al. Nov 2007 A1
20070264820 Liu Nov 2007 A1
20070266946 Choi Nov 2007 A1
20070272154 Amikura et al. Nov 2007 A1
20070277734 Lubomirsky et al. Dec 2007 A1
20070280816 Kurita et al. Dec 2007 A1
20070281106 Lubomirksy et al. Dec 2007 A1
20070284044 Matsumoto et al. Dec 2007 A1
20070284344 Todorov et al. Dec 2007 A1
20070287292 Li et al. Dec 2007 A1
20070293043 Singh et al. Dec 2007 A1
20070296967 Gupta et al. Dec 2007 A1
20080003836 Nishimura et al. Jan 2008 A1
20080011424 Yin et al. Jan 2008 A1
20080017104 Matyushkin et al. Jan 2008 A1
20080020570 Naik Jan 2008 A1
20080029032 Sun et al. Feb 2008 A1
20080035608 Thomas et al. Feb 2008 A1
20080044593 Seo et al. Feb 2008 A1
20080044990 Lee Feb 2008 A1
20080050538 Hirata Feb 2008 A1
20080063798 Kher et al. Mar 2008 A1
20080063810 Park et al. Mar 2008 A1
20080075668 Goldstein Mar 2008 A1
20080078744 Wang et al. Apr 2008 A1
20080081483 Wu Apr 2008 A1
20080085604 Hoshino et al. Apr 2008 A1
20080089001 Parkhe et al. Apr 2008 A1
20080099147 Myo May 2008 A1
20080099426 Kumar et al. May 2008 A1
20080099431 Kumar et al. May 2008 A1
20080099876 Seto May 2008 A1
20080100222 Lewington et al. May 2008 A1
20080102203 Wu et al. May 2008 A1
20080102570 Fisher et al. May 2008 A1
20080102640 Hassan et al. May 2008 A1
20080102646 Kawaguchi et al. May 2008 A1
20080104782 Hughes May 2008 A1
20080105555 Iwazaki et al. May 2008 A1
20080115726 Ingle et al. May 2008 A1
20080121970 Aritome May 2008 A1
20080124937 Xu et al. May 2008 A1
20080141941 Augustino et al. Jun 2008 A1
20080142831 Su Jun 2008 A1
20080149596 Dhindsa et al. Jun 2008 A1
20080153306 Cho et al. Jun 2008 A1
20080156631 Fair et al. Jul 2008 A1
20080156771 Jeon et al. Jul 2008 A1
20080157225 Datta et al. Jul 2008 A1
20080160210 Yang et al. Jul 2008 A1
20080169588 Shih et al. Jul 2008 A1
20080171407 Nakabayashi et al. Jul 2008 A1
20080173906 Zhu Jul 2008 A1
20080176412 Komeda Jul 2008 A1
20080178797 Fodor et al. Jul 2008 A1
20080178805 Paterson et al. Jul 2008 A1
20080182381 Kiyotoshi Jul 2008 A1
20080182382 Ingle et al. Jul 2008 A1
20080182383 Lee et al. Jul 2008 A1
20080193673 Paterson et al. Aug 2008 A1
20080196666 Toshima Aug 2008 A1
20080202688 Wu et al. Aug 2008 A1
20080202892 Smith et al. Aug 2008 A1
20080213496 Sun et al. Sep 2008 A1
20080216901 Chamberlain et al. Sep 2008 A1
20080216958 Goto et al. Sep 2008 A1
20080224364 Funk Sep 2008 A1
20080230519 Takahashi Sep 2008 A1
20080233709 Conti et al. Sep 2008 A1
20080236749 Koshimizu et al. Oct 2008 A1
20080236751 Aramaki et al. Oct 2008 A1
20080254635 Benzel et al. Oct 2008 A1
20080261404 Kozuka et al. Oct 2008 A1
20080264337 Sano et al. Oct 2008 A1
20080268171 Ma et al. Oct 2008 A1
20080268645 Kao et al. Oct 2008 A1
20080292798 Huh et al. Nov 2008 A1
20080293248 Park et al. Nov 2008 A1
20080317965 Son et al. Dec 2008 A1
20090000743 Iizuka Jan 2009 A1
20090001480 Cheng Jan 2009 A1
20090004849 Eun Jan 2009 A1
20090004873 Yang Jan 2009 A1
20090014127 Shah et al. Jan 2009 A1
20090014323 Yendler et al. Jan 2009 A1
20090014324 Kawaguchi et al. Jan 2009 A1
20090017227 Fu et al. Jan 2009 A1
20090022633 Tomosue et al. Jan 2009 A1
20090034148 Lubomirsky et al. Feb 2009 A1
20090036292 Sun et al. Feb 2009 A1
20090045167 Maruyama Feb 2009 A1
20090047793 Fukasawa Feb 2009 A1
20090061640 Wong et al. Mar 2009 A1
20090065480 Ohmi et al. Mar 2009 A1
20090072401 Arnold et al. Mar 2009 A1
20090075409 Ueno et al. Mar 2009 A1
20090081878 Dhindsa Mar 2009 A1
20090084317 Wu Apr 2009 A1
20090087960 Cho et al. Apr 2009 A1
20090087979 Raghuram Apr 2009 A1
20090095221 Tam et al. Apr 2009 A1
20090095222 Tam et al. Apr 2009 A1
20090095621 Kao et al. Apr 2009 A1
20090098276 Burrows Apr 2009 A1
20090098706 Kim et al. Apr 2009 A1
20090104738 Ring et al. Apr 2009 A1
20090104782 Lu et al. Apr 2009 A1
20090107403 Moshtagh et al. Apr 2009 A1
20090111280 Kao et al. Apr 2009 A1
20090117270 Yamasaki et al. May 2009 A1
20090117746 Masuda May 2009 A1
20090120364 Suarez et al. May 2009 A1
20090120464 Rasheed et al. May 2009 A1
20090120582 Koshimizu May 2009 A1
20090140738 Desvaux et al. Jun 2009 A1
20090159213 Bera Jun 2009 A1
20090159566 Brillhart et al. Jun 2009 A1
20090159588 Morioka et al. Jun 2009 A1
20090162260 Bera et al. Jun 2009 A1
20090162647 Sun et al. Jun 2009 A1
20090169744 Byun Jul 2009 A1
20090170221 Jacques et al. Jul 2009 A1
20090170331 Cheng et al. Jul 2009 A1
20090178764 Kanno et al. Jul 2009 A1
20090179300 Arai Jul 2009 A1
20090189246 Wu et al. Jul 2009 A1
20090189287 Yang et al. Jul 2009 A1
20090191711 Rui et al. Jul 2009 A1
20090194233 Tamura Aug 2009 A1
20090194508 Ui et al. Aug 2009 A1
20090194810 Kiyotoshi et al. Aug 2009 A1
20090197418 Sago Aug 2009 A1
20090202721 Nogami et al. Aug 2009 A1
20090212804 Yamada et al. Aug 2009 A1
20090214825 Sun et al. Aug 2009 A1
20090218043 Balakrishna et al. Sep 2009 A1
20090218317 Belen et al. Sep 2009 A1
20090223928 Colpo Sep 2009 A1
20090226633 Laflamme et al. Sep 2009 A1
20090230636 Goto Sep 2009 A1
20090236041 Iizuka Sep 2009 A1
20090236043 Matsudo et al. Sep 2009 A1
20090236314 Chen Sep 2009 A1
20090236547 Huang et al. Sep 2009 A1
20090253222 Morisawa et al. Oct 2009 A1
20090255902 Satoh et al. Oct 2009 A1
20090258162 Furuta et al. Oct 2009 A1
20090269934 Kao et al. Oct 2009 A1
20090274590 Willwerth et al. Nov 2009 A1
20090275146 Takano et al. Nov 2009 A1
20090275205 Kiehlbauch et al. Nov 2009 A1
20090275206 Katz et al. Nov 2009 A1
20090277587 Lubomirsky et al. Nov 2009 A1
20090277874 Rui et al. Nov 2009 A1
20090280650 Lubomirsky et al. Nov 2009 A1
20090286400 Heo et al. Nov 2009 A1
20090286405 Okesaku et al. Nov 2009 A1
20090291027 Choi Nov 2009 A1
20090293809 Cho et al. Dec 2009 A1
20090294898 Feustel et al. Dec 2009 A1
20090298256 Chen et al. Dec 2009 A1
20090302005 Kool et al. Dec 2009 A1
20090314309 Sankarakrishnan et al. Dec 2009 A1
20090314433 Hoffman et al. Dec 2009 A1
20090317978 Higashi Dec 2009 A1
20090320756 Tanaka Dec 2009 A1
20100000683 Kadkhodayan et al. Jan 2010 A1
20100003406 Lam et al. Jan 2010 A1
20100003824 Kadkhodayan Jan 2010 A1
20100006032 Hinckley et al. Jan 2010 A1
20100006543 Sawada et al. Jan 2010 A1
20100018648 Collins et al. Jan 2010 A1
20100022030 Ditizio Jan 2010 A1
20100025370 Dieguez-Campo et al. Feb 2010 A1
20100037821 Nogami Feb 2010 A1
20100039747 Sansoni Feb 2010 A1
20100043726 Kosanke Feb 2010 A1
20100047080 Bruce Feb 2010 A1
20100048022 Kubota Feb 2010 A1
20100048027 Cheng et al. Feb 2010 A1
20100055408 Lee et al. Mar 2010 A1
20100055917 Kim Mar 2010 A1
20100059889 Gosset et al. Mar 2010 A1
20100062603 Ganguly et al. Mar 2010 A1
20100072172 Ui et al. Mar 2010 A1
20100075503 Bencher Mar 2010 A1
20100081285 Chen et al. Apr 2010 A1
20100081287 Honda et al. Apr 2010 A1
20100087038 Chung et al. Apr 2010 A1
20100089533 Ueda et al. Apr 2010 A1
20100093151 Arghavani et al. Apr 2010 A1
20100093168 Naik Apr 2010 A1
20100093187 Lee et al. Apr 2010 A1
20100096367 Jeon et al. Apr 2010 A1
20100098882 Lubomirsky et al. Apr 2010 A1
20100099236 Kwon et al. Apr 2010 A1
20100099263 Kao et al. Apr 2010 A1
20100101727 Ji Apr 2010 A1
20100105209 Winniczek et al. Apr 2010 A1
20100116788 Singh et al. May 2010 A1
20100119843 Sun et al. May 2010 A1
20100129974 Futase et al. May 2010 A1
20100129982 Kao et al. May 2010 A1
20100130001 Noguchi May 2010 A1
20100139889 Kurita et al. Jun 2010 A1
20100144140 Chandrashekar et al. Jun 2010 A1
20100147219 Hsieh et al. Jun 2010 A1
20100151149 Ovshinsky Jun 2010 A1
20100154835 Dimeo et al. Jun 2010 A1
20100159703 Fischer et al. Jun 2010 A1
20100164422 Shu et al. Jul 2010 A1
20100167461 Rana et al. Jul 2010 A1
20100173499 Tao et al. Jul 2010 A1
20100178748 Subramanian Jul 2010 A1
20100178755 Lee et al. Jul 2010 A1
20100180819 Hatanaka et al. Jul 2010 A1
20100183825 Becker et al. Jul 2010 A1
20100187534 Nishi et al. Jul 2010 A1
20100187588 Kim et al. Jul 2010 A1
20100187694 Yu et al. Jul 2010 A1
20100190352 Jaiswal Jul 2010 A1
20100197143 Nishimura Aug 2010 A1
20100203739 Becker et al. Aug 2010 A1
20100206483 Sorensen et al. Aug 2010 A1
20100207195 Fukuzumi et al. Aug 2010 A1
20100207205 Grebs et al. Aug 2010 A1
20100212594 Hara et al. Aug 2010 A1
20100213172 Wilson Aug 2010 A1
20100221895 Seino et al. Sep 2010 A1
20100224322 Sui et al. Sep 2010 A1
20100224324 Kasai Sep 2010 A1
20100240205 Son Sep 2010 A1
20100243165 Um Sep 2010 A1
20100243606 Koshimizu Sep 2010 A1
20100244204 Matsuoka et al. Sep 2010 A1
20100244350 Fujisato et al. Sep 2010 A1
20100248488 Agarwal et al. Sep 2010 A1
20100252068 Kannan et al. Oct 2010 A1
20100255667 Seino et al. Oct 2010 A1
20100258913 Lue Oct 2010 A1
20100263588 Zhiyin Oct 2010 A1
20100267224 Choi et al. Oct 2010 A1
20100267248 Ma et al. Oct 2010 A1
20100272895 Tsuda Oct 2010 A1
20100273290 Kryliouk Oct 2010 A1
20100273291 Kryliouk et al. Oct 2010 A1
20100288369 Chang et al. Nov 2010 A1
20100294199 Tran et al. Nov 2010 A1
20100300359 Armour Dec 2010 A1
20100310785 Sasakawa et al. Dec 2010 A1
20100314005 Saito et al. Dec 2010 A1
20100317197 Lind et al. Dec 2010 A1
20100330814 Yokota et al. Dec 2010 A1
20110005607 Desbiolles et al. Jan 2011 A1
20110005684 Hayami et al. Jan 2011 A1
20110008950 Xu Jan 2011 A1
20110011338 Chuc Jan 2011 A1
20110011341 Nishimoto Jan 2011 A1
20110011730 Valcore, Jr. et al. Jan 2011 A1
20110034035 Liang et al. Feb 2011 A1
20110039407 Nishizuka Feb 2011 A1
20110042799 Kang et al. Feb 2011 A1
20110043228 Makhratchev et al. Feb 2011 A1
20110045676 Park Feb 2011 A1
20110048325 Choi et al. Mar 2011 A1
20110049102 Kroll et al. Mar 2011 A1
20110053380 Sapre et al. Mar 2011 A1
20110058303 Migita Mar 2011 A1
20110061810 Ganguly et al. Mar 2011 A1
20110061812 Ganguly et al. Mar 2011 A1
20110065276 Ganguly et al. Mar 2011 A1
20110076401 Chao et al. Mar 2011 A1
20110081782 Liang et al. Apr 2011 A1
20110088847 Law et al. Apr 2011 A1
20110100489 Orito May 2011 A1
20110101335 Yamazaki et al. May 2011 A1
20110104393 Hilkene et al. May 2011 A1
20110111596 Kanakasabapathy May 2011 A1
20110114601 Lubomirsky et al. May 2011 A1
20110115378 Lubomirsky et al. May 2011 A1
20110124144 Schlemm et al. May 2011 A1
20110127156 Foad et al. Jun 2011 A1
20110133650 Kim Jun 2011 A1
20110139748 Donnelly et al. Jun 2011 A1
20110140229 Rachmady et al. Jun 2011 A1
20110143542 Feurprier et al. Jun 2011 A1
20110146909 Shi et al. Jun 2011 A1
20110147363 Yap et al. Jun 2011 A1
20110151674 Tang et al. Jun 2011 A1
20110151677 Wang et al. Jun 2011 A1
20110151678 Ashtiani et al. Jun 2011 A1
20110155181 Inatomi Jun 2011 A1
20110159690 Chandrashekar et al. Jun 2011 A1
20110162800 Noorbakhsh Jul 2011 A1
20110165057 Honda et al. Jul 2011 A1
20110165347 Miller et al. Jul 2011 A1
20110165771 Ring et al. Jul 2011 A1
20110174778 Sawada et al. Jul 2011 A1
20110180847 Ikeda et al. Jul 2011 A1
20110195575 Wang Aug 2011 A1
20110198034 Sun et al. Aug 2011 A1
20110204025 Tahara Aug 2011 A1
20110207332 Liu et al. Aug 2011 A1
20110217851 Liang et al. Sep 2011 A1
20110223334 Yudovsky et al. Sep 2011 A1
20110226734 Sumiya et al. Sep 2011 A1
20110227028 Sekar et al. Sep 2011 A1
20110230008 Lakshmanan et al. Sep 2011 A1
20110230052 Tang et al. Sep 2011 A1
20110232737 Ruletzki et al. Sep 2011 A1
20110232845 Riker et al. Sep 2011 A1
20110244686 Aso et al. Oct 2011 A1
20110244693 Tamura et al. Oct 2011 A1
20110253044 Tam et al. Oct 2011 A1
20110256421 Bose et al. Oct 2011 A1
20110256729 Goodlin Oct 2011 A1
20110265884 Xu et al. Nov 2011 A1
20110265887 Lee et al. Nov 2011 A1
20110265951 Xu Nov 2011 A1
20110266252 Thadani et al. Nov 2011 A1
20110266256 Cruse et al. Nov 2011 A1
20110266682 Edelstein et al. Nov 2011 A1
20110278260 Lai et al. Nov 2011 A1
20110287633 Lee et al. Nov 2011 A1
20110290419 Horiguchi et al. Dec 2011 A1
20110294300 Zhang et al. Dec 2011 A1
20110298061 Siddiqui et al. Dec 2011 A1
20110303146 Nishijima Dec 2011 A1
20110304078 Lee et al. Dec 2011 A1
20110308453 Su et al. Dec 2011 A1
20120003782 Byun et al. Jan 2012 A1
20120009796 Cui et al. Jan 2012 A1
20120012848 Suh Jan 2012 A1
20120017989 Chang et al. Jan 2012 A1
20120025289 Liang et al. Feb 2012 A1
20120031559 Dhindsa et al. Feb 2012 A1
20120034786 Dhindsa et al. Feb 2012 A1
20120035766 Shajii et al. Feb 2012 A1
20120037596 Eto et al. Feb 2012 A1
20120040132 Eto et al. Feb 2012 A1
20120040492 Ovshinsky et al. Feb 2012 A1
20120052683 Kim et al. Mar 2012 A1
20120055402 Moriya et al. Mar 2012 A1
20120067971 Byun Mar 2012 A1
20120068242 Shin et al. Mar 2012 A1
20120070982 Yu et al. Mar 2012 A1
20120070996 Hao et al. Mar 2012 A1
20120073501 Lubomirsky et al. Mar 2012 A1
20120088356 Santhanam et al. Apr 2012 A1
20120091108 Lin Xing et al. Apr 2012 A1
20120097330 Iyengar et al. Apr 2012 A1
20120100720 Winniczek et al. Apr 2012 A1
20120103518 Kakimoto May 2012 A1
20120104564 Won et al. May 2012 A1
20120119225 Shiomi et al. May 2012 A1
20120122302 Weidman et al. May 2012 A1
20120122319 Shimizu May 2012 A1
20120129354 Luong May 2012 A1
20120135576 Lee et al. May 2012 A1
20120148369 Michalski et al. Jun 2012 A1
20120149200 Culp et al. Jun 2012 A1
20120161405 Mohn et al. Jun 2012 A1
20120164839 Nishimura Jun 2012 A1
20120171852 Yuan et al. Jul 2012 A1
20120180954 Yang et al. Jul 2012 A1
20120181599 Lung Jul 2012 A1
20120182808 Lue et al. Jul 2012 A1
20120187844 Hoffman et al. Jul 2012 A1
20120196447 Yang et al. Aug 2012 A1
20120196451 Mallick Aug 2012 A1
20120202408 Shajii et al. Aug 2012 A1
20120208361 Ha Aug 2012 A1
20120211462 Zhang et al. Aug 2012 A1
20120211722 Kellam et al. Aug 2012 A1
20120216955 Eto et al. Aug 2012 A1
20120222616 Han et al. Sep 2012 A1
20120222815 Sabri et al. Sep 2012 A1
20120223048 Paranjpe et al. Sep 2012 A1
20120223418 Stowers et al. Sep 2012 A1
20120225557 Serry et al. Sep 2012 A1
20120228642 Aube et al. Sep 2012 A1
20120234945 Olgado Sep 2012 A1
20120238102 Zhang et al. Sep 2012 A1
20120238103 Zhang et al. Sep 2012 A1
20120238108 Chen et al. Sep 2012 A1
20120241082 Chen et al. Sep 2012 A1
20120241411 Darling et al. Sep 2012 A1
20120247390 Sawada et al. Oct 2012 A1
20120247670 Dobashi et al. Oct 2012 A1
20120247671 Sugawara Oct 2012 A1
20120247677 Himori et al. Oct 2012 A1
20120255491 Hadidi Oct 2012 A1
20120258600 Godet et al. Oct 2012 A1
20120258607 Holland et al. Oct 2012 A1
20120267346 Kao et al. Oct 2012 A1
20120269968 Rayner Oct 2012 A1
20120282779 Arnold et al. Nov 2012 A1
20120285481 Lee et al. Nov 2012 A1
20120285619 Malyushkin et al. Nov 2012 A1
20120285621 Tan Nov 2012 A1
20120291696 Clarke Nov 2012 A1
20120292664 Kanike Nov 2012 A1
20120304933 Mai et al. Dec 2012 A1
20120305184 Singh et al. Dec 2012 A1
20120309204 Kang et al. Dec 2012 A1
20120309205 Wang et al. Dec 2012 A1
20120322015 Kim Dec 2012 A1
20120323008 Barry et al. Dec 2012 A1
20130001899 Hwang et al. Jan 2013 A1
20130005103 Liu et al. Jan 2013 A1
20130005140 Jeng et al. Jan 2013 A1
20130012030 Lakshmanan et al. Jan 2013 A1
20130012032 Liu et al. Jan 2013 A1
20130023062 Masuda et al. Jan 2013 A1
20130023094 Yeh et al. Jan 2013 A1
20130023124 Nemani et al. Jan 2013 A1
20130023125 Singh Jan 2013 A1
20130026135 Kim Jan 2013 A1
20130032574 Liu et al. Feb 2013 A1
20130034666 Liang et al. Feb 2013 A1
20130034968 Zhang et al. Feb 2013 A1
20130037919 Sapra et al. Feb 2013 A1
20130045605 Wang et al. Feb 2013 A1
20130049592 Yeom et al. Feb 2013 A1
20130052804 Song Feb 2013 A1
20130052827 Wang et al. Feb 2013 A1
20130052833 Ranjan et al. Feb 2013 A1
20130059440 Wang et al. Mar 2013 A1
20130059448 Marakhtanov et al. Mar 2013 A1
20130062675 Thomas Mar 2013 A1
20130065398 Ohsawa et al. Mar 2013 A1
20130065403 Paranjpe et al. Mar 2013 A1
20130082197 Yang et al. Apr 2013 A1
20130084654 Gaylord et al. Apr 2013 A1
20130087309 Volfovski Apr 2013 A1
20130089988 Wang et al. Apr 2013 A1
20130095646 Alsmeier et al. Apr 2013 A1
20130098868 Nishimura et al. Apr 2013 A1
20130105303 Lubomirsky et al. May 2013 A1
20130105948 Kewley May 2013 A1
20130107415 Banna et al. May 2013 A1
20130112383 Hanamachi May 2013 A1
20130115372 Pavol et al. May 2013 A1
20130118686 Carducci et al. May 2013 A1
20130119016 Kagoshima May 2013 A1
20130119457 Lue et al. May 2013 A1
20130119483 Alptekin et al. May 2013 A1
20130127124 Nam et al. May 2013 A1
20130130507 Wang et al. May 2013 A1
20130133578 Hwang May 2013 A1
20130133834 Dhindsa et al. May 2013 A1
20130149866 Shriner Jun 2013 A1
20130150303 Kungl et al. Jun 2013 A1
20130152859 Collins et al. Jun 2013 A1
20130155568 Todorow et al. Jun 2013 A1
20130161726 Kim et al. Jun 2013 A1
20130171810 Sun et al. Jul 2013 A1
20130171827 Cho et al. Jul 2013 A1
20130175654 Muckenhirn et al. Jul 2013 A1
20130187220 Surthi Jul 2013 A1
20130192760 Ikeda et al. Aug 2013 A1
20130193108 Zheng Aug 2013 A1
20130213935 Liao et al. Aug 2013 A1
20130217243 Underwood et al. Aug 2013 A1
20130224953 Salinas et al. Aug 2013 A1
20130224960 Payyapilly et al. Aug 2013 A1
20130260533 Sapre et al. Oct 2013 A1
20130260564 Sapre et al. Oct 2013 A1
20130276983 Park et al. Oct 2013 A1
20130279066 Lubomirsky et al. Oct 2013 A1
20130284288 Kim Oct 2013 A1
20130284369 Kobayashi et al. Oct 2013 A1
20130284370 Kobayashi et al. Oct 2013 A1
20130284373 Sun et al. Oct 2013 A1
20130284374 Lubomirsky et al. Oct 2013 A1
20130284700 Nangoy et al. Oct 2013 A1
20130286530 Lin et al. Oct 2013 A1
20130286532 Kataigi et al. Oct 2013 A1
20130295297 Chou et al. Nov 2013 A1
20130298942 Ren et al. Nov 2013 A1
20130299009 Jiang et al. Nov 2013 A1
20130302980 Chandrashekar et al. Nov 2013 A1
20130306758 Park Nov 2013 A1
20130320550 Kim Dec 2013 A1
20130337655 Lee et al. Dec 2013 A1
20130343829 Benedetti et al. Dec 2013 A1
20140004707 Thedjoisworo et al. Jan 2014 A1
20140004708 Thedjoisworo Jan 2014 A1
20140008880 Miura et al. Jan 2014 A1
20140020708 Kim et al. Jan 2014 A1
20140021673 Chen et al. Jan 2014 A1
20140026813 Wang et al. Jan 2014 A1
20140027060 Ranish Jan 2014 A1
20140034239 Yang et al. Feb 2014 A1
20140051253 Guha Feb 2014 A1
20140053866 Baluja et al. Feb 2014 A1
20140054269 Hudson et al. Feb 2014 A1
20140057447 Yang et al. Feb 2014 A1
20140061324 Mohn et al. Mar 2014 A1
20140062285 Chen Mar 2014 A1
20140065827 Kang et al. Mar 2014 A1
20140065842 Anthis et al. Mar 2014 A1
20140073143 Alokozai et al. Mar 2014 A1
20140076234 Kao et al. Mar 2014 A1
20140080308 Chen et al. Mar 2014 A1
20140080309 Park et al. Mar 2014 A1
20140080310 Chen et al. Mar 2014 A1
20140083362 Lubomirsky et al. Mar 2014 A1
20140087488 Nam et al. Mar 2014 A1
20140087561 Lee et al. Mar 2014 A1
20140097270 Liang Apr 2014 A1
20140099794 Ingle Apr 2014 A1
20140102367 Ishibashi Apr 2014 A1
20140110061 Okunishi Apr 2014 A1
20140116338 He et al. May 2014 A1
20140124364 Yoo et al. May 2014 A1
20140134842 Zhang et al. May 2014 A1
20140134847 Seya May 2014 A1
20140141621 Ren et al. May 2014 A1
20140144876 Nakagawa et al. May 2014 A1
20140147126 Yamashita et al. May 2014 A1
20140148015 Larson May 2014 A1
20140152312 Snow et al. Jun 2014 A1
20140154668 Chou et al. Jun 2014 A1
20140154889 Wang et al. Jun 2014 A1
20140165912 Kao et al. Jun 2014 A1
20140166617 Chen Jun 2014 A1
20140166618 Tadigadapa et al. Jun 2014 A1
20140175530 Chien et al. Jun 2014 A1
20140175534 Kofuji et al. Jun 2014 A1
20140186772 Pohlers et al. Jul 2014 A1
20140190410 Kim Jul 2014 A1
20140190632 Kumar et al. Jul 2014 A1
20140191388 Chen Jul 2014 A1
20140199850 Kim et al. Jul 2014 A1
20140199851 Nemani et al. Jul 2014 A1
20140209245 Yamamoto et al. Jul 2014 A1
20140216337 Swaminathan et al. Aug 2014 A1
20140225504 Kaneko et al. Aug 2014 A1
20140227881 Lubomirsky et al. Aug 2014 A1
20140231251 Hashiguchi et al. Aug 2014 A1
20140234466 Gao et al. Aug 2014 A1
20140248773 Tsai et al. Sep 2014 A1
20140248780 Ingle et al. Sep 2014 A1
20140251956 Jeon et al. Sep 2014 A1
20140252134 Chen et al. Sep 2014 A1
20140253900 Cornelissen et al. Sep 2014 A1
20140256131 Wang et al. Sep 2014 A1
20140256145 Abdallah et al. Sep 2014 A1
20140262031 Belostotskiy Sep 2014 A1
20140262038 Wang et al. Sep 2014 A1
20140263172 Xie et al. Sep 2014 A1
20140263177 Povolny et al. Sep 2014 A1
20140263272 Duan et al. Sep 2014 A1
20140264507 Lee et al. Sep 2014 A1
20140264533 Simsek-Ege Sep 2014 A1
20140271097 Wang et al. Sep 2014 A1
20140272184 Sreekala et al. Sep 2014 A1
20140273373 Makala et al. Sep 2014 A1
20140273406 Wang et al. Sep 2014 A1
20140273410 Abedijaberi et al. Sep 2014 A1
20140273451 Wang et al. Sep 2014 A1
20140273462 Simsek-Ege et al. Sep 2014 A1
20140273487 Deshmukh et al. Sep 2014 A1
20140273489 Wang et al. Sep 2014 A1
20140273491 Zhang et al. Sep 2014 A1
20140273492 Anthis et al. Sep 2014 A1
20140273496 Kao Sep 2014 A1
20140283747 Kasai Sep 2014 A1
20140288528 Py et al. Sep 2014 A1
20140302256 Chen et al. Oct 2014 A1
20140302678 Paterson et al. Oct 2014 A1
20140302680 Singh Oct 2014 A1
20140308758 Nemani et al. Oct 2014 A1
20140308816 Wang et al. Oct 2014 A1
20140311581 Belostotskiy et al. Oct 2014 A1
20140342532 Zhu Nov 2014 A1
20140342569 Zhu et al. Nov 2014 A1
20140349477 Chandrashekar et al. Nov 2014 A1
20140357083 Ling et al. Dec 2014 A1
20140361684 Ikeda et al. Dec 2014 A1
20140363977 Morimoto et al. Dec 2014 A1
20140363979 Or et al. Dec 2014 A1
20140373782 Park et al. Dec 2014 A1
20150007770 Chandrasekharan et al. Jan 2015 A1
20150011096 Chandrasekharan Jan 2015 A1
20150013793 Chuc Jan 2015 A1
20150014152 Hoinkis et al. Jan 2015 A1
20150031211 Sapre et al. Jan 2015 A1
20150037980 Rha Feb 2015 A1
20150041430 Yoshino et al. Feb 2015 A1
20150044879 Liao et al. Feb 2015 A1
20150050812 Smith Feb 2015 A1
20150056814 Ling et al. Feb 2015 A1
20150060265 Cho et al. Mar 2015 A1
20150064918 Ranjan et al. Mar 2015 A1
20150072508 Or et al. Mar 2015 A1
20150076110 Wu et al. Mar 2015 A1
20150076586 Rabkin et al. Mar 2015 A1
20150079797 Chen et al. Mar 2015 A1
20150093891 Zope Apr 2015 A1
20150118822 Zhang et al. Apr 2015 A1
20150118858 Takaba Apr 2015 A1
20150123541 Baek et al. May 2015 A1
20150126035 Diao et al. May 2015 A1
20150126039 Korolik et al. May 2015 A1
20150126040 Korolik et al. May 2015 A1
20150129541 Wang et al. May 2015 A1
20150129545 Ingle et al. May 2015 A1
20150129546 Ingle et al. May 2015 A1
20150132953 Nowling May 2015 A1
20150132968 Ren et al. May 2015 A1
20150140827 Kao et al. May 2015 A1
20150152072 Cantat et al. Jun 2015 A1
20150155177 Zhang et al. Jun 2015 A1
20150155189 Cho et al. Jun 2015 A1
20150167705 Lee et al. Jun 2015 A1
20150170811 Tanigawa et al. Jun 2015 A1
20150170879 Nguyen et al. Jun 2015 A1
20150170920 Purayath et al. Jun 2015 A1
20150170924 Nguyen et al. Jun 2015 A1
20150170926 Michalak Jun 2015 A1
20150170935 Wang et al. Jun 2015 A1
20150170943 Nguyen et al. Jun 2015 A1
20150170956 Naik Jun 2015 A1
20150171008 Luo Jun 2015 A1
20150179464 Wang et al. Jun 2015 A1
20150187625 Busche et al. Jul 2015 A1
20150191823 Banna et al. Jul 2015 A1
20150194435 Lee Jul 2015 A1
20150200042 Ling et al. Jul 2015 A1
20150206764 Wang et al. Jul 2015 A1
20150214066 Luere et al. Jul 2015 A1
20150214067 Zhang et al. Jul 2015 A1
20150214092 Purayath et al. Jul 2015 A1
20150214101 Ren et al. Jul 2015 A1
20150214337 Ko et al. Jul 2015 A1
20150214653 Sakane et al. Jul 2015 A1
20150221479 Chen et al. Aug 2015 A1
20150221541 Nemani et al. Aug 2015 A1
20150228456 Ye et al. Aug 2015 A1
20150228499 Parkinson et al. Aug 2015 A1
20150235809 Ito et al. Aug 2015 A1
20150235860 Tomura et al. Aug 2015 A1
20150235863 Chen Aug 2015 A1
20150235865 Wang et al. Aug 2015 A1
20150235867 Nishizuka Aug 2015 A1
20150240359 Jdira et al. Aug 2015 A1
20150247231 Nguyen et al. Sep 2015 A1
20150249018 Park et al. Sep 2015 A1
20150255481 Baenninger et al. Sep 2015 A1
20150270105 Kobayashi et al. Sep 2015 A1
20150270135 Tabat Sep 2015 A1
20150270140 Gupta et al. Sep 2015 A1
20150275361 Lubomirsky et al. Oct 2015 A1
20150275375 Kim et al. Oct 2015 A1
20150279687 Xue et al. Oct 2015 A1
20150294980 Lee et al. Oct 2015 A1
20150303031 Choi Oct 2015 A1
20150332930 Wang et al. Nov 2015 A1
20150332953 Futase et al. Nov 2015 A1
20150340225 Kim et al. Nov 2015 A1
20150340371 Lue Nov 2015 A1
20150345029 Wang et al. Dec 2015 A1
20150357201 Chen et al. Dec 2015 A1
20150357205 Wang et al. Dec 2015 A1
20150371861 Li et al. Dec 2015 A1
20150371864 Hsu et al. Dec 2015 A1
20150371865 Chen et al. Dec 2015 A1
20150371866 Chen et al. Dec 2015 A1
20150371869 Surla et al. Dec 2015 A1
20150371877 Lin et al. Dec 2015 A1
20150372104 Liu et al. Dec 2015 A1
20150376782 Griffin et al. Dec 2015 A1
20150376784 Wu et al. Dec 2015 A1
20150380419 Gunji-Yoneoka et al. Dec 2015 A1
20150380431 Kanamori et al. Dec 2015 A1
20160002779 Lin et al. Jan 2016 A1
20160005571 Rosa et al. Jan 2016 A1
20160005572 Liang Jan 2016 A1
20160005833 Collins et al. Jan 2016 A1
20160020071 Khaja et al. Jan 2016 A1
20160027654 Kim et al. Jan 2016 A1
20160027673 Wang et al. Jan 2016 A1
20160035586 Purayath et al. Feb 2016 A1
20160035614 Purayath et al. Feb 2016 A1
20160042920 Cho et al. Feb 2016 A1
20160042924 Kim et al. Feb 2016 A1
20160042968 Purayath et al. Feb 2016 A1
20160043099 Purayath et al. Feb 2016 A1
20160056167 Wang et al. Feb 2016 A1
20160056235 Lee et al. Feb 2016 A1
20160064212 Thedjoisworo et al. Mar 2016 A1
20160064233 Wang et al. Mar 2016 A1
20160064247 Tomura et al. Mar 2016 A1
20160079062 Zheng et al. Mar 2016 A1
20160079072 Wang et al. Mar 2016 A1
20160083844 Nishitani et al. Mar 2016 A1
20160086772 Khaja Mar 2016 A1
20160086807 Park et al. Mar 2016 A1
20160086808 Zhang et al. Mar 2016 A1
20160086815 Pandit et al. Mar 2016 A1
20160086816 Wang et al. Mar 2016 A1
20160093505 Chen et al. Mar 2016 A1
20160093506 Chen et al. Mar 2016 A1
20160093737 Li et al. Mar 2016 A1
20160097119 Cui et al. Apr 2016 A1
20160099173 Agarwal et al. Apr 2016 A1
20160104606 Park et al. Apr 2016 A1
20160104648 Park et al. Apr 2016 A1
20160109863 Valcore et al. Apr 2016 A1
20160111258 Taskar Apr 2016 A1
20160111315 Parkhe Apr 2016 A1
20160117425 Povolny et al. Apr 2016 A1
20160118227 Valcore et al. Apr 2016 A1
20160118268 Ingle et al. Apr 2016 A1
20160118396 Rabkin et al. Apr 2016 A1
20160126118 Chen et al. May 2016 A1
20160133480 Ko et al. May 2016 A1
20160136660 Song May 2016 A1
20160141179 Wu et al. May 2016 A1
20160141419 Baenninger et al. May 2016 A1
20160148805 Jongbloed et al. May 2016 A1
20160148821 Singh et al. May 2016 A1
20160163512 Lubomirsky Jun 2016 A1
20160163513 Lubomirsky Jun 2016 A1
20160163558 Hudson et al. Jun 2016 A1
20160172216 Marakhtanov et al. Jun 2016 A1
20160172226 West et al. Jun 2016 A1
20160181112 Xue et al. Jun 2016 A1
20160181116 Berry et al. Jun 2016 A1
20160189933 Kobayashi et al. Jun 2016 A1
20160190147 Kato et al. Jun 2016 A1
20160196969 Berry et al. Jul 2016 A1
20160196984 Lill et al. Jul 2016 A1
20160196985 Tan et al. Jul 2016 A1
20160203952 Tucker et al. Jul 2016 A1
20160203958 Arase et al. Jul 2016 A1
20160204009 Nguyen et al. Jul 2016 A1
20160208395 Ooshima Jul 2016 A1
20160217013 Song et al. Jul 2016 A1
20160218018 Lieu et al. Jul 2016 A1
20160222522 Wang et al. Aug 2016 A1
20160225616 Li et al. Aug 2016 A1
20160225651 Tran et al. Aug 2016 A1
20160225652 Tran et al. Aug 2016 A1
20160237570 Tan et al. Aug 2016 A1
20160240344 Kemen et al. Aug 2016 A1
20160240353 Nagami Aug 2016 A1
20160240389 Zhang et al. Aug 2016 A1
20160240402 Park et al. Aug 2016 A1
20160254165 Posseme Sep 2016 A1
20160260588 Park et al. Sep 2016 A1
20160260616 Li et al. Sep 2016 A1
20160260619 Zhang et al. Sep 2016 A1
20160284519 Kobayashi et al. Sep 2016 A1
20160284522 Eto et al. Sep 2016 A1
20160284556 Ingle et al. Sep 2016 A1
20160293388 Chen et al. Oct 2016 A1
20160293398 Danek et al. Oct 2016 A1
20160293438 Zhou et al. Oct 2016 A1
20160300694 Yang et al. Oct 2016 A1
20160307743 Brown et al. Oct 2016 A1
20160307771 Xu et al. Oct 2016 A1
20160307772 Choi et al. Oct 2016 A1
20160307773 Lee et al. Oct 2016 A1
20160314961 Liu et al. Oct 2016 A1
20160314985 Yang et al. Oct 2016 A1
20160319452 Eidschun et al. Nov 2016 A1
20160340781 Thomas et al. Nov 2016 A1
20160340782 Chandrasekharan et al. Nov 2016 A1
20160343548 Howald et al. Nov 2016 A1
20160348244 Sabri et al. Dec 2016 A1
20160351377 Okamoto et al. Dec 2016 A1
20160358793 Okumara et al. Dec 2016 A1
20160365228 Singh et al. Dec 2016 A1
20170004975 Farmer et al. Jan 2017 A1
20170011922 Tanimura et al. Jan 2017 A1
20170030626 Closs et al. Feb 2017 A1
20170040175 Xu et al. Feb 2017 A1
20170040180 Xu et al. Feb 2017 A1
20170040190 Benjaminson et al. Feb 2017 A1
20170040191 Benjaminson et al. Feb 2017 A1
20170040198 Lin et al. Feb 2017 A1
20170040207 Purayath Feb 2017 A1
20170040214 Lai et al. Feb 2017 A1
20170053808 Kamp et al. Feb 2017 A1
20170062184 Tran et al. Mar 2017 A1
20170104061 Peng et al. Apr 2017 A1
20170110290 Kobayashi et al. Apr 2017 A1
20170110335 Yang et al. Apr 2017 A1
20170110475 Liu et al. Apr 2017 A1
20170121818 Dunn et al. May 2017 A1
20170133202 Berry May 2017 A1
20170154784 Wada Jun 2017 A1
20170159180 Sawachi Jun 2017 A1
20170169995 Kim et al. Jun 2017 A1
20170178894 Stone et al. Jun 2017 A1
20170178899 Kabansky et al. Jun 2017 A1
20170178915 Ingle et al. Jun 2017 A1
20170178924 Chen et al. Jun 2017 A1
20170194128 Lai et al. Jul 2017 A1
20170207088 Kwon et al. Jul 2017 A1
20170221708 Bergendahl et al. Aug 2017 A1
20170226637 Lubomirsky et al. Aug 2017 A1
20170229287 Xu et al. Aug 2017 A1
20170229289 Lubomirsky Aug 2017 A1
20170229291 Singh et al. Aug 2017 A1
20170229293 Park et al. Aug 2017 A1
20170229326 Tran et al. Aug 2017 A1
20170229328 Benjaminson et al. Aug 2017 A1
20170229329 Benjaminson et al. Aug 2017 A1
20170236691 Liang Aug 2017 A1
20170236694 Eason et al. Aug 2017 A1
20170250193 Huo Aug 2017 A1
20170283947 Rasheed et al. Oct 2017 A1
20170294445 Son et al. Oct 2017 A1
20170306494 Lin et al. Oct 2017 A1
20170309509 Tran et al. Oct 2017 A1
20170316920 Melikyan et al. Nov 2017 A1
20170316935 Tan et al. Nov 2017 A1
20170323825 Tomura et al. Nov 2017 A1
20170330728 Bravo et al. Nov 2017 A1
20170335457 Nguyen et al. Nov 2017 A1
20170338133 Tan et al. Nov 2017 A1
20170338134 Tan et al. Nov 2017 A1
20170342556 Crook et al. Nov 2017 A1
20170350011 Marquardt Dec 2017 A1
20170362704 Yamashita Dec 2017 A1
20170373082 Sekine et al. Dec 2017 A1
20180005850 Citla et al. Jan 2018 A1
20180005857 Zhang et al. Jan 2018 A1
20180006041 Xu et al. Jan 2018 A1
20180006050 Watanabe et al. Jan 2018 A1
20180025900 Park et al. Jan 2018 A1
20180033643 Sharma et al. Feb 2018 A1
20180061618 Nichols et al. Mar 2018 A1
20180069000 Bergendahl et al. Mar 2018 A1
20180076031 Yan et al. Mar 2018 A1
20180076044 Choi et al. Mar 2018 A1
20180076048 Gohira et al. Mar 2018 A1
20180076083 Ko et al. Mar 2018 A1
20180080124 Bajaj et al. Mar 2018 A1
20180082861 Citla et al. Mar 2018 A1
20180096818 Lubomirsky Apr 2018 A1
20180096819 Lubomirsky et al. Apr 2018 A1
20180096821 Lubomirsky et al. Apr 2018 A1
20180096865 Lubomirsky et al. Apr 2018 A1
20180102255 Chen et al. Apr 2018 A1
20180102256 Chen et al. Apr 2018 A1
20180102259 Wang et al. Apr 2018 A1
20180130818 Kim et al. May 2018 A1
20180138049 Ko et al. May 2018 A1
20180138055 Xu et al. May 2018 A1
20180138075 Kang et al. May 2018 A1
20180138085 Wang et al. May 2018 A1
20180144970 Chuang et al. May 2018 A1
20180151683 Yeo et al. May 2018 A1
20180175051 Lue et al. Jun 2018 A1
20180182633 Pandit et al. Jun 2018 A1
20180182777 Cui et al. Jun 2018 A1
20180211862 Konkola et al. Jul 2018 A1
20180223437 George et al. Aug 2018 A1
20180226223 Lubomirsky Aug 2018 A1
20180226230 Kobayashi et al. Aug 2018 A1
20180226259 Choi et al. Aug 2018 A1
20180226278 Arnepalli et al. Aug 2018 A1
20180226425 Purayath Aug 2018 A1
20180226426 Purayath Aug 2018 A1
20180240654 Park et al. Aug 2018 A1
20180261516 Lin et al. Sep 2018 A1
20180261686 Lin et al. Sep 2018 A1
20180337024 Tan et al. Nov 2018 A1
20180337057 Samir et al. Nov 2018 A1
20180342375 Nguyen et al. Nov 2018 A1
20180350619 Chen et al. Dec 2018 A1
20180366351 Lubomirsky Dec 2018 A1
20190013211 Wang et al. Jan 2019 A1
20190032211 Tucker et al. Jan 2019 A1
20190037264 Lyons et al. Jan 2019 A1
20190040529 Verbaas et al. Feb 2019 A1
20190067006 Hawrylchak et al. Feb 2019 A1
20190074191 Nagatomo et al. Mar 2019 A1
20190244792 Liang Aug 2019 A1
20190252154 Samir et al. Aug 2019 A1
20190252216 Samir et al. Aug 2019 A1
20190271082 Wang et al. Sep 2019 A1
20190272998 Yang et al. Sep 2019 A1
20190311883 Samir et al. Oct 2019 A1
20190333786 Samir et al. Oct 2019 A1
20190385823 Liang Dec 2019 A1
20200060005 Radermacher et al. Feb 2020 A1
20200066556 Benjaminson et al. Feb 2020 A1
20200087784 Wu et al. Mar 2020 A1
20200149166 Chuc May 2020 A1
20200215566 Subbuswamy et al. Jul 2020 A1
20210005472 Kanarik et al. Jan 2021 A1
Foreign Referenced Citations (93)
Number Date Country
1124364 Jun 1996 CN
1847450 Oct 2006 CN
101236893 Aug 2008 CN
101378850 Mar 2009 CN
102893705 Jan 2013 CN
1675160 Jun 2006 EP
S59-126778 Jul 1984 JP
S62-45119 Feb 1987 JP
63301051 Dec 1988 JP
H01-200627 Aug 1989 JP
H02-114525 Apr 1990 JP
H07-153739 Jun 1995 JP
H08-31755 Feb 1996 JP
H08-107101 Apr 1996 JP
H08-264510 Oct 1996 JP
H09-260356 Oct 1997 JP
2001-313282 Nov 2001 JP
2001-332608 Nov 2001 JP
2002-075972 Mar 2002 JP
2002-083869 Mar 2002 JP
2003-174020 Jun 2003 JP
2003-282591 Oct 2003 JP
2004-508709 Mar 2004 JP
2004-296467 Oct 2004 JP
2005-050908 Feb 2005 JP
2006-041039 Feb 2006 JP
2006-066408 Mar 2006 JP
2008-288560 Nov 2008 JP
4191137 Dec 2008 JP
2009-141343 Jun 2009 JP
2009-530871 Aug 2009 JP
2009-239056 Oct 2009 JP
2010-180458 Aug 2010 JP
2011-508436 Mar 2011 JP
2011-518408 Jun 2011 JP
4763293 Aug 2011 JP
2011-171378 Sep 2011 JP
2012-019164 Jan 2012 JP
2012-019194 Jan 2012 JP
2012-512531 May 2012 JP
2013-243418 Dec 2013 JP
5802323 Oct 2015 JP
2016-111177 Jun 2016 JP
2000-0008278 Feb 2000 KR
2000-0064946 Nov 2000 KR
2001-0056735 Jul 2001 KR
2003-0023964 Mar 2003 KR
2003-0054726 Jul 2003 KR
2003-0083663 Oct 2003 KR
100441297 Jul 2004 KR
2005-0007143 Jan 2005 KR
2005-0042701 May 2005 KR
2005-0049903 May 2005 KR
2006-0080509 Jul 2006 KR
1006-41762 Nov 2006 KR
2006-0127173 Dec 2006 KR
100663668 Jan 2007 KR
100678696 Jan 2007 KR
100712727 Apr 2007 KR
2007-0079870 Aug 2007 KR
2008-0063988 Jul 2008 KR
100843236 Jul 2008 KR
2009-0040869 Apr 2009 KR
2009-0128913 Dec 2009 KR
10-2010-0013980 Feb 2010 KR
2010-0093358 Aug 2010 KR
2011-0086540 Jul 2011 KR
2011-0114538 Oct 2011 KR
2011-0126675 Nov 2011 KR
2012-0022251 Mar 2012 KR
2012-0082640 Jul 2012 KR
2016-0002543 Jan 2016 KR
2006-12480 Apr 2006 TW
200709256 Mar 2007 TW
2007-35196 Sep 2007 TW
2011-27983 Aug 2011 TW
2012-07919 Feb 2012 TW
2012-13594 Apr 2012 TW
2012-33842 Aug 2012 TW
2008-112673 Sep 2008 WO
2009-084194 Jul 2009 WO
2010-010706 Jan 2010 WO
2010-113946 Oct 2010 WO
2011-027515 Mar 2011 WO
2011-031556 Mar 2011 WO
2011-070945 Jun 2011 WO
2011-095846 Aug 2011 WO
2011-149638 Dec 2011 WO
2012-050321 Apr 2012 WO
2012-118987 Sep 2012 WO
2012-125656 Sep 2012 WO
2012-148568 Nov 2012 WO
2013-118260 Aug 2013 WO
Related Publications (1)
Number Date Country
20190385823 A1 Dec 2019 US
Provisional Applications (1)
Number Date Country
61704257 Sep 2012 US
Divisions (1)
Number Date Country
Parent 13799840 Mar 2013 US
Child 14853838 US
Continuations (2)
Number Date Country
Parent 15581357 Apr 2017 US
Child 16511990 US
Parent 14853838 Sep 2015 US
Child 15581357 US