Kunal R. Parekh

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,334,448
- Issue date Jun 17, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and related methods of forming a memory device
- Patent number 12,261,111
- Issue date Mar 25, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory with parallel main and test interfaces
- Patent number 12,243,610
- Issue date Mar 4, 2025
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND memory device devices and related electronic systems
- Patent number 12,199,070
- Issue date Jan 14, 2025
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive columns in a semiconductor device and associa...
- Patent number 12,183,716
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures
- Patent number 12,185,537
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated assemblies having thicker semiconductor material along o...
- Patent number 12,167,602
- Issue date Dec 10, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base structures for microelectronic devices
- Patent number 12,154,893
- Issue date Nov 26, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,107,050
- Issue date Oct 1, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND flash memory devices, and related electronic systems
- Patent number 12,096,626
- Issue date Sep 17, 2024
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices, and related methods and memory devices
- Patent number 12,089,422
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,089,403
- Issue date Sep 10, 2024
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including control logic regions
- Patent number 12,080,700
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive column in a semiconductor device and associat...
- Patent number 12,074,094
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having a memory array region, a control log...
- Patent number 12,068,272
- Issue date Aug 20, 2024
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including capacitors and related methods
- Patent number 12,058,853
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory circuitry comprising a vertical string of memory cells and a...
- Patent number 12,052,863
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hongbin Zhu
Information Patent Grant
Methods of forming microelectronic devices including source structu...
- Patent number 12,046,582
- Issue date Jul 23, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,996,377
- Issue date May 28, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,937,429
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device
- Patent number 11,929,323
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 11,862,569
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY WITH PARALLEL MAIN AND TEST INTERFACES
- Publication number 20250182839
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
- Publication number 20250167072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20250149382
- Publication date May 8, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry Comprising a Vertical String of Memory Cells and a...
- Publication number 20250151274
- Publication date May 8, 2025
- Micron Technology, Inc.
- Hongbin Zhu
Information Patent Application
NON-VOLATILE MEMORY DEVICES
- Publication number 20250149511
- Publication date May 8, 2025
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20250142827
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
- Publication number 20250140753
- Publication date May 1, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20250140756
- Publication date May 1, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
- Publication number 20250133786
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...
- Publication number 20250132209
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20250096202
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20250098169
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED METHODS AND MEMORY DEVICES
- Publication number 20250081460
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Albert Fayrushin
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND ELECTRONIC SYSTEMS
- Publication number 20250054935
- Publication date Feb 13, 2025
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Publication number 20250006704
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICES AND RELATED METHODS
- Publication number 20240422967
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MIC...
- Publication number 20240422993
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Publication number 20240421030
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...
- Publication number 20240413021
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS
- Publication number 20240413145
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS

Kunal R. Parekh

Person

Patents Grantslast 30 patents

Front end of line interconnect structures and associated systems an...

Memory devices and related methods of forming a memory device

Memory with parallel main and test interfaces

Semiconductor device assemblies including monolithic silicon struct...

Methods of forming microelectronic devices, and related electronic...

3D NAND memory device devices and related electronic systems

Monolithic conductive columns in a semiconductor device and associa...

Integrated structures

Signal routing between memory die and logic die

Integrated assemblies having thicker semiconductor material along o...

Base structures for microelectronic devices

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Front end of line interconnect structures and associated systems an...

3D NAND flash memory devices, and related electronic systems

Microelectronic devices, and related methods and memory devices

Memory arrays comprising strings of memory cells and methods used i...

Microelectronic devices including control logic regions

Monolithic conductive column in a semiconductor device and associat...

Microelectronic devices having a memory array region, a control log...

Electronic devices including capacitors and related methods

Memory circuitry comprising a vertical string of memory cells and a...

Methods of forming microelectronic devices including source structu...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices and electronic systems

Semiconductor with through-substrate interconnect

Integrated structures including material containing silicon, nitrog...

Methods of forming a microelectronic device

Wafer-on-wafer formed memory and logic for genomic annotations

Front end of line interconnect structures and associated systems an...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

MEMORY WITH PARALLEL MAIN AND TEST INTERFACES

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

Memory Circuitry Comprising a Vertical String of Memory Cells and a...

NON-VOLATILE MEMORY DEVICES

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Structures

STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

STACKED SEMICONDUCTOR DEVICE

Integrated Structures

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

MICROELECTRONIC DEVICES, AND RELATED METHODS AND MEMORY DEVICES

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC

MEMORY DEVICES AND ELECTRONIC SYSTEMS

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

MEMORY DEVICES AND RELATED METHODS

MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MIC...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...

MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS