Kunal R. Parekh

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,107,050
- Issue date Oct 1, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND flash memory devices, and related electronic systems
- Patent number 12,096,626
- Issue date Sep 17, 2024
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices, and related methods and memory devices
- Patent number 12,089,422
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,089,403
- Issue date Sep 10, 2024
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including control logic regions
- Patent number 12,080,700
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive column in a semiconductor device and associat...
- Patent number 12,074,094
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having a memory array region, a control log...
- Patent number 12,068,272
- Issue date Aug 20, 2024
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including capacitors and related methods
- Patent number 12,058,853
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory circuitry comprising a vertical string of memory cells and a...
- Patent number 12,052,863
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hongbin Zhu
Information Patent Grant
Methods of forming microelectronic devices including source structu...
- Patent number 12,046,582
- Issue date Jul 23, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,996,377
- Issue date May 28, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,937,429
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device
- Patent number 11,929,323
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 11,862,569
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,842,990
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,837,594
- Issue date Dec 5, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices and memory devices
- Patent number 11,825,658
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 11,817,305
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices
- Patent number 11,785,764
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
Information Patent Grant
Methods of forming microelectronic devices
- Patent number 11,770,932
- Issue date Sep 26, 2023
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,751,408
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,710,724
- Issue date Jul 25, 2023
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,705,367
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,699,652
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having thicker semiconductor material along o...
- Patent number 11,696,443
- Issue date Jul 4, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE PAD ON A THROUGH-SILICON VIA
- Publication number 20240379596
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND SYSTEMS INCLUDING CAPACITORS
- Publication number 20240381631
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20240379503
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...
- Publication number 20240371834
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry Comprising a Vertical String of Memory Cells and a...
- Publication number 20240373637
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Hongbin Zhu
Information Patent Application
DATA PATH SIGNAL AMPLIFICATION IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240355371
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA
- Publication number 20240339433
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240334717
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240313098
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- James Brian Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240297149
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20240282620
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240274562
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY
- Publication number 20240237363
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- James Brian Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE
- Publication number 20240213150
- Publication date Jun 27, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
- Publication number 20240194287
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240186274
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Amy Rae Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR COUPLED HOST AND MEMORY DIES
- Publication number 20240176523
- Publication date May 30, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240087987
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY WITH PARALLEL MAIN AND TEST INTERFACES
- Publication number 20240071556
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...
- Publication number 20240072004
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILI...
- Publication number 20240063094
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240063205
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...
- Publication number 20240063068
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
- Publication number 20240057340
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES
- Publication number 20240055397
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240047450
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS
- Publication number 20240040775
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege

Kunal R. Parekh

Person

Patents Grantslast 30 patents

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Front end of line interconnect structures and associated systems an...

3D NAND flash memory devices, and related electronic systems

Microelectronic devices, and related methods and memory devices

Memory arrays comprising strings of memory cells and methods used i...

Microelectronic devices including control logic regions

Monolithic conductive column in a semiconductor device and associat...

Microelectronic devices having a memory array region, a control log...

Electronic devices including capacitors and related methods

Memory circuitry comprising a vertical string of memory cells and a...

Methods of forming microelectronic devices including source structu...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices and electronic systems

Semiconductor with through-substrate interconnect

Integrated structures including material containing silicon, nitrog...

Methods of forming a microelectronic device

Wafer-on-wafer formed memory and logic for genomic annotations

Front end of line interconnect structures and associated systems an...

Microelectronic devices and electronic systems

Microelectronic devices and electronic systems

Methods of forming microelectronic devices and memory devices

Front end of line interconnect structures and associated systems an...

Methods of forming microelectronic devices

Methods of forming microelectronic devices

Methods of forming microelectronic devices, and related microelectr...

Methods of forming microelectronic devices, and related microelectr...

Methods of forming microelectronic devices, and related microelectr...

Microelectronic devices and electronic systems

Integrated assemblies having thicker semiconductor material along o...

Patents Applicationslast 30 patents

CONDUCTIVE PAD ON A THROUGH-SILICON VIA

ELECTRONIC DEVICES AND SYSTEMS INCLUDING CAPACITORS

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...

Memory Circuitry Comprising a Vertical String of Memory Cells and a...

DATA PATH SIGNAL AMPLIFICATION IN COUPLED SEMICONDUCTOR SYSTEMS

SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

Integrated Assemblies and Methods of Forming Integrated Assemblies

TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

METHODS OF FORMING MICROELECTRONIC DEVICES

TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY

MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE

REPAIR TECHNIQUES FOR COUPLED MEMORY DIES

TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS

TECHNIQUES FOR COUPLED HOST AND MEMORY DIES

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

MEMORY WITH PARALLEL MAIN AND TEST INTERFACES

SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILI...

METHODS OF FORMING MICROELECTRONIC DEVICES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES

METHODS OF FORMING MICROELECTRONIC DEVICES

MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS