Kuniko Miyakawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
C49-structured tungsten-containing titanium salicide structure and...
- Patent number 6,114,765
- Issue date Sep 5, 2000
- NEC Corporation
- Kunihiro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming C49-structure tungsten-containing titanium salici...
- Patent number 6,069,045
- Issue date May 30, 2000
- NEC Corporation
- Kunihiro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of burying a contact hole with a metal for forming multileve...
- Patent number 5,990,005
- Issue date Nov 23, 1999
- NEC Corporation
- Kazuyuki Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C49-structured tungsten-containing titanium salicide structure
- Patent number 5,880,505
- Issue date Mar 9, 1999
- NEC Corporation
- Kunihiro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,869,397
- Issue date Feb 9, 1999
- NEC Corporation
- Kuniko Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device through a reduced nu...
- Patent number 5,851,915
- Issue date Dec 22, 1998
- NEC Corporation
- Kuniko Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic Cu-alloy wiring structure in a semiconductor device
- Patent number 5,686,760
- Issue date Nov 11, 1997
- NEC Corporation
- Kuniko Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing a semiconductor device by filling a via ho...
- Patent number 5,543,357
- Issue date Aug 6, 1996
- NEC Corporation
- Yoshiaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 5,278,449
- Issue date Jan 11, 1994
- NEC Corporation
- Kuniko Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling contact holes of a semiconductor device
- Patent number 5,169,803
- Issue date Dec 8, 1992
- NEC Corporation
- Kuniko Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS

Kuniko Miyakawa

Person

Patents Grantslast 30 patents

C49-structured tungsten-containing titanium salicide structure and...

Method of forming C49-structure tungsten-containing titanium salici...

Method of burying a contact hole with a metal for forming multileve...

C49-structured tungsten-containing titanium salicide structure

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device through a reduced nu...

Eutectic Cu-alloy wiring structure in a semiconductor device

Process of manufacturing a semiconductor device by filling a via ho...

Semiconductor memory device

Method of filling contact holes of a semiconductor device