Kuo-Cheng Chen

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for refrigerating an enclosure
- Patent number 11,719,449
- Issue date Aug 8, 2023
- Kuo-mei Chen
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,133,245
- Issue date Sep 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gas transport desalination
- Patent number 10,723,634
- Issue date Jul 28, 2020
- Kuo-mei Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device package
- Patent number 10,707,157
- Issue date Jul 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including die and substrate electri...
- Patent number 9,748,196
- Issue date Aug 29, 2017
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,589,871
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and package structure using the same
- Patent number 9,578,737
- Issue date Feb 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of making the same
- Patent number 9,564,393
- Issue date Feb 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chih-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure
- Patent number 9,196,595
- Issue date Nov 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neural sensing device and method for making the same
- Patent number 9,173,583
- Issue date Nov 3, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Neural sensing device and method for making the same
- Patent number 9,089,268
- Issue date Jul 28, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device having conductive vias and semiconductor packa...
- Patent number 9,024,445
- Issue date May 5, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and package structure using the same
- Patent number 8,665,605
- Issue date Mar 4, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon substrate having through vias and package having the same
- Patent number 8,188,593
- Issue date May 29, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with embedded die and method of fabricating the same
- Patent number 8,120,148
- Issue date Feb 21, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and electronic device using the same
- Patent number 7,812,433
- Issue date Oct 12, 2010
- Advanced Semiconductor Engineering, Inc.
- Mi-Cheng Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Punch type substrate strip
- Patent number 7,663,208
- Issue date Feb 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Kuo Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact camera module and the substrate thereof
- Patent number 7,621,683
- Issue date Nov 24, 2009
- Advanced Semiconductor Engineering, Inc.
- She-Hong Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Oil retaining structure of a spindle
- Patent number 7,314,314
- Issue date Jan 1, 2008
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Hong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Level shifter ESD protection circuit with power-on-sequence conside...
- Patent number 7,233,468
- Issue date Jun 19, 2007
- Novatek Microelectronics Corp.
- Chyh-Yih Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Atomized liquid jet refrigeration system
- Patent number 7,159,407
- Issue date Jan 9, 2007
- Kuo-mei Chen
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Controller for motor
- Patent number 6,972,535
- Issue date Dec 6, 2005
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charger capable of switching polarity
- Patent number 6,759,833
- Issue date Jul 6, 2004
- Kuo-Hua Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CREATING A MODIFIED FLIGHT SIMULATION PROGRAM FOR A FLIG...
- Publication number 20230360553
- Publication date Nov 9, 2023
- BROGENT TECHNOLOGIES INC.
- Kuo-Chen Chen
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210125911
- Publication date Apr 29, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR REFRIGERATING AN ENCLOSURE
- Publication number 20210080134
- Publication date Mar 18, 2021
- Kuo-mei CHEN
- F24 - HEATING RANGES VENTILATING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200243427
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170365543
- Publication date Dec 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160300782
- Publication date Oct 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20160079157
- Publication date Mar 17, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEURAL SENSING DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20140275929
- Publication date Sep 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
NEURAL SENSING DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20140275911
- Publication date Sep 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20140239494
- Publication date Aug 28, 2014
- Kuo-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE USING THE SAME
- Publication number 20140144683
- Publication date May 29, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKA...
- Publication number 20120126420
- Publication date May 24, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE USING THE SAME
- Publication number 20100206622
- Publication date Aug 19, 2010
- Kuo-Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Substrate Having Through Vias and Package Having the Same
- Publication number 20100187681
- Publication date Jul 29, 2010
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH EMBEDDED DIE AND METHOD OF FABRICATING THE SAME
- Publication number 20090224378
- Publication date Sep 10, 2009
- Advanced Semiconductor Engineering, Inc.
- KUO-HUA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and electronic device using the same
- Publication number 20080290489
- Publication date Nov 27, 2008
- Advanced Semiconductor Engineering, Inc.
- Mi-Cheng Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Circuit board and circuit structure
- Publication number 20080041614
- Publication date Feb 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT STRUCTURE
- Publication number 20080037234
- Publication date Feb 14, 2008
- Kuo-Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shock prevention structure for motor
- Publication number 20080010529
- Publication date Jan 10, 2008
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Hong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUBSTRATE STRIP AND COMPACT CAMERA MODULE UTILIZING THE SAME
- Publication number 20070228492
- Publication date Oct 4, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- She-Hong CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tray assembly for spindle motor with aerodynamic bearing
- Publication number 20070216239
- Publication date Sep 20, 2007
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Horng
- G11 - INFORMATION STORAGE
Information Patent Application
COMPACT CAMERA MODULE AND THE SUBSTRATE THEREOF
- Publication number 20070196103
- Publication date Aug 23, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- She-Hong CHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Punch type substrate strip
- Publication number 20070195508
- Publication date Aug 23, 2007
- Advanced Semiconductor Engineering, Inc.
- Kuo Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Atomized Liquid Jet Refrigeration System
- Publication number 20070062205
- Publication date Mar 22, 2007
- Kuo-mei Chen
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
LEVEL SHIFTER ESD PROTECTION CIRCUIT WITH POWER-ON-SEQUENCE CONSIDE...
- Publication number 20070014061
- Publication date Jan 18, 2007
- Chyh-Yih Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Adhesive label dispenser
- Publication number 20060096999
- Publication date May 11, 2006
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Horng
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Oil retaining structure of a spindle
- Publication number 20060083452
- Publication date Apr 20, 2006
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Hong
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Substrate strip for a transparent package
- Publication number 20050285245
- Publication date Dec 29, 2005
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Atomized liquid jet refrigeration system
- Publication number 20050274130
- Publication date Dec 15, 2005
- Kuo-mei Chen
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...

Kuo-Cheng Chen

Person

Patents Grantslast 30 patents

Semiconductor device package

Systems for refrigerating an enclosure

Semiconductor package structure and method for manufacturing the same

Systems and methods for gas transport desalination

Semiconductor device package

Semiconductor package structure including die and substrate electri...

Semiconductor package structure and method for manufacturing the same

Substrate structure and package structure using the same

Semiconductor device package and method of making the same

Semiconductor bonding structure

Neural sensing device and method for making the same

Neural sensing device and method for making the same

Semiconductor device having conductive vias and semiconductor packa...

Substrate structure and package structure using the same

Silicon substrate having through vias and package having the same

Package structure with embedded die and method of fabricating the same

Package structure and electronic device using the same

Punch type substrate strip

Compact camera module and the substrate thereof

Oil retaining structure of a spindle

Level shifter ESD protection circuit with power-on-sequence conside...

Atomized liquid jet refrigeration system

Controller for motor

Charger capable of switching polarity

Patents Applicationslast 30 patents

METHOD FOR CREATING A MODIFIED FLIGHT SIMULATION PROGRAM FOR A FLIG...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS FOR REFRIGERATING AN ENCLOSURE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

NEURAL SENSING DEVICE AND METHOD FOR MAKING THE SAME

NEURAL SENSING DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE USING THE SAME

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKA...

SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE USING THE SAME

Silicon Substrate Having Through Vias and Package Having the Same

PACKAGE STRUCTURE WITH EMBEDDED DIE AND METHOD OF FABRICATING THE SAME

Package structure and electronic device using the same

Circuit board and circuit structure

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Shock prevention structure for motor

SUBSTRATE STRIP AND COMPACT CAMERA MODULE UTILIZING THE SAME

Tray assembly for spindle motor with aerodynamic bearing

COMPACT CAMERA MODULE AND THE SUBSTRATE THEREOF

Punch type substrate strip

Atomized Liquid Jet Refrigeration System

LEVEL SHIFTER ESD PROTECTION CIRCUIT WITH POWER-ON-SEQUENCE CONSIDE...

Adhesive label dispenser

Oil retaining structure of a spindle

Substrate strip for a transparent package

Atomized liquid jet refrigeration system