Kuo-Chung Yee

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 8,288,853
- Issue date Oct 16, 2012
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a stackable package
- Patent number 8,252,629
- Issue date Aug 28, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure of optical device
- Patent number 8,003,426
- Issue date Aug 23, 2011
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,741,152
- Issue date Jun 22, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,642,132
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,528,053
- Issue date May 5, 2009
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric device grinding process and device grinding process
- Patent number 7,456,051
- Issue date Nov 25, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,446,404
- Issue date Nov 4, 2008
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 7,371,602
- Issue date May 13, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating anti-warp package
- Patent number 7,352,071
- Issue date Apr 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,285,434
- Issue date Oct 23, 2007
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and method of molding semiconductor devices
- Patent number 7,247,267
- Issue date Jul 24, 2007
- Advanced Semiconductor Engineering, Inc.
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Micro-mirror package
- Patent number 7,053,488
- Issue date May 30, 2006
- Advanced Semiconductor Engineering Inc.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a package structure by dicing a wafer from the bac...
- Patent number 7,033,914
- Issue date Apr 25, 2006
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical component package and packaging including an optical compon...
- Patent number 7,002,257
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-level package with bump ring
- Patent number 6,838,762
- Issue date Jan 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with a cavity and fabricating method thereof
- Patent number 6,822,324
- Issue date Nov 23, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microsystem package structure
- Patent number 6,809,852
- Issue date Oct 26, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer-level package and method for manufacturing the same
- Patent number 6,768,207
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit element package and process for making t...
- Patent number 6,693,364
- Issue date Feb 17, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Making a Stackable Package
- Publication number 20130020703
- Publication date Jan 24, 2013
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making a Stackable Package
- Publication number 20110159639
- Publication date Jun 30, 2011
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Package and Method of Making the Same
- Publication number 20100052136
- Publication date Mar 4, 2010
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE OF OPTICAL DEVICE
- Publication number 20090239329
- Publication date Sep 24, 2009
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung YEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080185707
- Publication date Aug 7, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung YEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20080048312
- Publication date Feb 28, 2008
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172986
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172983
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172982
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172984
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional package and method of making the same
- Publication number 20070172985
- Publication date Jul 26, 2007
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING PROCESS
- Publication number 20070004087
- Publication date Jan 4, 2007
- Jen-Chieh Kao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20060202314
- Publication date Sep 14, 2006
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method for manufacturing the same
- Publication number 20060197216
- Publication date Sep 7, 2006
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method for manufacturing the same
- Publication number 20060197217
- Publication date Sep 7, 2006
- Advanced Semiconductor Engineering, Inc.
- Kuo Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[PHOTOELECTRIC DEVICE GRINDING PROCESS AND DEVICE GRINDING PROCESS]
- Publication number 20050266601
- Publication date Dec 1, 2005
- Kuo-Chung Yee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20050176168
- Publication date Aug 11, 2005
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-MIRROR PACKAGE
- Publication number 20050164426
- Publication date Jul 28, 2005
- Kuo-Chung Yee
- G02 - OPTICS
Information Patent Application
Image sensor package and method for manufacturing the same
- Publication number 20050139848
- Publication date Jun 30, 2005
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-WARP PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20050116359
- Publication date Jun 2, 2005
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a package structure by dicing a wafer from the bac...
- Publication number 20050042844
- Publication date Feb 24, 2005
- Advanced Semiconductor Engineering, Inc.
- Kuo-Chung Yee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
[MOLD AND METHOD OF MOLDING SEMICONDUCTOR DEVICES]
- Publication number 20050037104
- Publication date Feb 17, 2005
- Jen-Chieh Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICROSYSTEM PACKAGE STRUCTURE
- Publication number 20040184133
- Publication date Sep 23, 2004
- Tao Su
- G02 - OPTICS
Information Patent Application
Optical component package and packaging method thereof
- Publication number 20040104488
- Publication date Jun 3, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT ELEMENT PACKAGE AND PROCESS FOR MAKING T...
- Publication number 20030234452
- Publication date Dec 25, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level package with bump and method for manufacturing the same
- Publication number 20030214007
- Publication date Nov 20, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multichip wafer-level package and method for manufacturing the same
- Publication number 20030214029
- Publication date Nov 20, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid crystal display device with bump and method for manufacturin...
- Publication number 20030214618
- Publication date Nov 20, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- G02 - OPTICS
Information Patent Application
Optical integrated circuit element package and method for making th...
- Publication number 20030193018
- Publication date Oct 16, 2003
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level package with a cavity and fabricating method thereof
- Publication number 20030193096
- Publication date Oct 16, 2003
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Chung Yee

Person

Patents Grantslast 30 patents

Three-dimensional package and method of making the same

Method for making a stackable package

Method for manufacturing package structure of optical device

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Photoelectric device grinding process and device grinding process

Three-dimensional package and method of making the same

Semiconductor package structure and method for manufacturing the same

Method of fabricating anti-warp package

Semiconductor package and method for manufacturing the same

Mold and method of molding semiconductor devices

Micro-mirror package

Method of making a package structure by dicing a wafer from the bac...

Optical component package and packaging including an optical compon...

Water-level package with bump ring

Wafer-level package with a cavity and fabricating method thereof

Microsystem package structure

Multichip wafer-level package and method for manufacturing the same

Optical integrated circuit element package and process for making t...

Patents Applicationslast 30 patents

Method for Making a Stackable Package

Method for Making a Stackable Package

Three-Dimensional Package and Method of Making the Same

METHOD FOR MANUFACTURING PACKAGE STRUCTURE OF OPTICAL DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package and method for manufacturing the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

CHIP PACKAGING PROCESS

Semiconductor package and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

[PHOTOELECTRIC DEVICE GRINDING PROCESS AND DEVICE GRINDING PROCESS]

PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING TH...

MICRO-MIRROR PACKAGE

Image sensor package and method for manufacturing the same

ANTI-WARP PACKAGE AND METHOD OF FABRICATING THE SAME

Method of making a package structure by dicing a wafer from the bac...

[MOLD AND METHOD OF MOLDING SEMICONDUCTOR DEVICES]

MICROSYSTEM PACKAGE STRUCTURE

Optical component package and packaging method thereof

OPTICAL INTEGRATED CIRCUIT ELEMENT PACKAGE AND PROCESS FOR MAKING T...

Wafer-level package with bump and method for manufacturing the same

Multichip wafer-level package and method for manufacturing the same

Liquid crystal display device with bump and method for manufacturin...

Optical integrated circuit element package and method for making th...

Wafer-level package with a cavity and fabricating method thereof