Kuo-Pin WU

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
GAA LDMOS structure for HV operation
- Patent number 12,363,941
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Shyang Wu
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,349,493
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Shiang Lin
Information Patent Grant
Hybrid integrated circuit dies and methods of forming the same
- Patent number 12,328,931
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color display with color filter layer comprising two-dimensional ph...
- Patent number 12,317,722
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Shyang Wu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Output control interface circuit for static random access memory an...
- Patent number 12,315,591
- Issue date May 27, 2025
- Realtek Semiconductor Corp.
- Kuo-Chi Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Techniques for wafer stack processing
- Patent number 12,293,946
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated fabricating method
- Patent number 12,289,905
- Issue date Apr 29, 2025
- Parabellum Strategic Opportunities Fund LLC
- Jia-Rui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer seal ring having protrusion extending into tren...
- Patent number 12,278,151
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,253,756
- Issue date Mar 18, 2025
- Innolux Corporation
- Kuei-Sheng Chang
- G02 - OPTICS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 12,211,741
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trim wall protection method for multi-wafer stacking
- Patent number 12,125,763
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 12,062,539
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a capacitor
- Patent number 12,062,687
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Yang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of evaluating the valid analysis region of a spec...
- Patent number 12,056,910
- Issue date Aug 6, 2024
- GORILLA TECHNOLOGY UK LIMITED
- Sze-Yao Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Catalyst for selectively chemically reducing CO2 to form CO
- Patent number 11,981,573
- Issue date May 14, 2024
- Industrial Technology Research Institute
- Kuo-Ching Wu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
3DIC structure and methods of forming
- Patent number 11,984,431
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage prevention during wafer edge trimming
- Patent number 11,951,569
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,942,541
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with high voltage device
- Patent number 11,942,543
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage transistor structure
- Patent number 11,935,950
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,921,372
- Issue date Mar 5, 2024
- Innolux Corporation
- Kuei-Sheng Chang
- G02 - OPTICS
Information Patent Grant
Electronic device
- Patent number 11,900,716
- Issue date Feb 13, 2024
- Innolux Corporation
- Kuei-Sheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating an image sensing device having a primary gri...
- Patent number 11,894,404
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage metal-oxide-semiconductor (HVMOS) device integrated wi...
- Patent number 11,862,675
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Karthick Murukesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 11,862,515
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having a gate structure and overlyin...
- Patent number 11,855,158
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including isolation structure and method fo...
- Patent number 11,848,339
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzung-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIOMIMETIC FISH DEVICE
- Publication number 20250236373
- Publication date Jul 24, 2025
- PIONEER MATERIAL PRECISION TECH CO., LTD.
- Hsin-Chih CHEN
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Application
TECHNIQUES FOR WAFER STACK PROCESSING
- Publication number 20250241053
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD
- Publication number 20250227953
- Publication date Jul 10, 2025
- Parabellum Strategic Opportunities Fund LLC
- Jia-Rui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20250210427
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS REMEDIATION DEVICE
- Publication number 20250196065
- Publication date Jun 19, 2025
- Industrial Technology Research Institute
- Kuo-Ching WU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CATALYST AND METHOD OF DECOMPOSING GASEOUS AMMONIA
- Publication number 20250187912
- Publication date Jun 12, 2025
- Industrial Technology Research Institute
- Cheng-Po KUO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250118710
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20250105056
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-CONTROLLED OSCILLATOR AND PHASE-LOCKED LOOP
- Publication number 20250096808
- Publication date Mar 20, 2025
- REALTEK SEMICONDUCTOR CORPORATION
- KUO-WEI WU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POLYESTER ELASTIC CONJUGATED YARN, PREPARATION METHOD THEREOF, AND...
- Publication number 20240426030
- Publication date Dec 26, 2024
- SHINKONG SYNTHETIC FIBERS CORPORATION
- KUO-CHUNG WU
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
- Publication number 20240379468
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STILTED PAD STRUCTURE
- Publication number 20240379716
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240379038
- Publication date Nov 14, 2024
- InnoLux Corporation
- Jen-I YANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING
- Publication number 20240363469
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR
- Publication number 20240363680
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Yang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20240355618
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL
- Publication number 20240316724
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- B24 - GRINDING POLISHING
Information Patent Application
LIGHT-EMITTING DIODE CURRENT STEERING DEVICE
- Publication number 20240213410
- Publication date Jun 27, 2024
- Taiwan-Asia Semiconductor Corporation
- Kuo-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IRON-BASED CATALYST AND METHOD OF HYDROGENATING CARBON DIOXIDE
- Publication number 20240198318
- Publication date Jun 20, 2024
- Industrial Technology Research Institute
- Kuo-Ching WU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
- Publication number 20240198455
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE
- Publication number 20240194825
- Publication date Jun 13, 2024
- Taiwan-Asia Semiconductor Corporation
- Kun-Te LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Transistor Structure
- Publication number 20240186412
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240168329
- Publication date May 23, 2024
- InnoLux Corporation
- Kuei-Sheng Chang
- G02 - OPTICS
Information Patent Application
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...
- Publication number 20240162051
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

GAA LDMOS structure for HV operation

Semiconductor structure and manufacturing method of the same

Hybrid integrated circuit dies and methods of forming the same

Hybrid bonding technology for stacking integrated circuits

Color display with color filter layer comprising two-dimensional ph...

Output control interface circuit for static random access memory an...

Techniques for wafer stack processing

Semiconductor structure and associated fabricating method

Semiconductor wafer seal ring having protrusion extending into tren...

Electronic device

Multi-wafer capping layer for metal arcing protection

Process tool for analyzing bonded workpiece interface

Trim wall protection method for multi-wafer stacking

Protective wafer grooving structure for wafer thinning and methods...

Semiconductor-on-insulator (SOI) substrate and method for forming

Semiconductor device including a capacitor

Method and system of evaluating the valid analysis region of a spec...

Catalyst for selectively chemically reducing CO2 to form CO

3DIC structure and methods of forming

Damage prevention during wafer edge trimming

Semiconductor device and method for forming the same

Semiconductor device structure with high voltage device

High voltage transistor structure

Display device

Electronic device

Method for fabricating an image sensing device having a primary gri...

High voltage metal-oxide-semiconductor (HVMOS) device integrated wi...

Multi-wafer capping layer for metal arcing protection

Semiconductor device structure having a gate structure and overlyin...

Semiconductor structure including isolation structure and method fo...

Patents Applicationslast 30 patents

BIOMIMETIC FISH DEVICE

TECHNIQUES FOR WAFER STACK PROCESSING

SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD

SEMICONDUCTOR WAFER SEAL RING

GAS REMEDIATION DEVICE

CATALYST AND METHOD OF DECOMPOSING GASEOUS AMMONIA

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

VOLTAGE-CONTROLLED OSCILLATOR AND PHASE-LOCKED LOOP

POLYESTER ELASTIC CONJUGATED YARN, PREPARATION METHOD THEREOF, AND...

HYBRID INTEGRATED CIRCUIT DIES

PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE

STILTED PAD STRUCTURE

ELECTRONIC DEVICE

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING

SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL

LIGHT-EMITTING DIODE CURRENT STEERING DEVICE

IRON-BASED CATALYST AND METHOD OF HYDROGENATING CARBON DIOXIDE

DAMAGE PREVENTION DURING WAFER EDGE TRIMMING

LIGHT-EMITTING DIODE STRUCTURE

High Voltage Transistor Structure

ELECTRONIC DEVICE

COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...