Lakshminarasimha Krishnapura

Person

Boca Raton, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,857,173
- Issue date Feb 22, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,709,891
- Issue date Mar 23, 2004
- Silicon Bandwidth Inc.
- Sanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having electrically conductive shielding
- Patent number 6,679,733
- Issue date Jan 20, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,475,832
- Issue date Nov 5, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Female contact pin including flexible contact portion
- Patent number 6,461,197
- Issue date Oct 8, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,421,254
- Issue date Jul 16, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having staggered hold-down tabs
- Patent number 6,334,794
- Issue date Jan 1, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,307,258
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated connector and semiconductor die package
- Patent number 6,305,987
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,266,246
- Issue date Jul 24, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly with a female electrical connector ha...
- Patent number 6,247,972
- Issue date Jun 19, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,141,869
- Issue date Nov 7, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package for mounting in horizontal and upright co...
- Patent number 6,078,102
- Issue date Jun 20, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having staggered hold-down tabs
- Patent number 6,050,850
- Issue date Apr 18, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for semiconductor die carrier
- Patent number 6,031,720
- Issue date Feb 29, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,016,256
- Issue date Jan 18, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface optimized computer system architecture
- Patent number 5,951,665
- Issue date Sep 14, 1999
- The Panda Project
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Electrical connector having staggered hold-down tabs
- Publication number 20040203281
- Publication date Oct 14, 2004
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-cavity semiconductor die package
- Publication number 20030003626
- Publication date Jan 2, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module having interconnect dies
- Publication number 20020176238
- Publication date Nov 28, 2002
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connector having staggered hold-down tabs
- Publication number 20020042225
- Publication date Apr 11, 2002
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated connector and semiconductor die package
- Publication number 20020019174
- Publication date Feb 14, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-cavity semiconductor die package
- Publication number 20020008308
- Publication date Jan 24, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module having interconnect dies
- Publication number 20010040792
- Publication date Nov 15, 2001
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connector assembly
- Publication number 20010034164
- Publication date Oct 25, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Lakshminarasimha Krishnapura

Person

Patents Grantslast 30 patents

Apparatus for and method of manufacturing a semiconductor die carrier

Open-cavity semiconductor die package

Electrical connector having electrically conductive shielding

Open-cavity semiconductor die package

Female contact pin including flexible contact portion

Multi-chip module having interconnect dies

Electrical connector having staggered hold-down tabs

Open-cavity semiconductor die package

Integrated connector and semiconductor die package

Multi-chip module having interconnect dies

Electrical connector assembly with a female electrical connector ha...

Apparatus for and method of manufacturing a semiconductor die carrier

Semiconductor die package for mounting in horizontal and upright co...

Electrical connector having staggered hold-down tabs

Cooling system for semiconductor die carrier

Multi-chip module having interconnect dies

Interface optimized computer system architecture

Patents Applicationslast 30 patents

Electrical connector having staggered hold-down tabs

Open-cavity semiconductor die package

Multi-chip module having interconnect dies

Electrical connector having staggered hold-down tabs

Integrated connector and semiconductor die package

Open-cavity semiconductor die package

Multi-chip module having interconnect dies

Electrical connector assembly