Leo A. Merilo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Chip scale module package in BGA semiconductor package
- Patent number 9,281,300
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with heatspreader
- Patent number 8,395,254
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system having interconnect stack and ext...
- Patent number 8,138,080
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming quad flat package
- Patent number 8,097,496
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 8,097,935
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits package system with passive components
- Patent number 8,026,129
- Issue date Sep 27, 2011
- Stats Chippac Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,786,575
- Issue date Aug 31, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat package
- Patent number 7,687,892
- Issue date Mar 30, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,659,608
- Issue date Feb 9, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system
- Patent number 7,439,620
- Issue date Oct 21, 2008
- Stats Chippac Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader anchoring and grounding method and thermally enhanced...
- Patent number 6,875,634
- Issue date Apr 5, 2005
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader anchoring & grounding method & therma...
- Patent number 6,737,298
- Issue date May 18, 2004
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Scale Module Package in BGA Semiconductor Package
- Publication number 20110001240
- Publication date Jan 6, 2011
- STATS ChipPAC, Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Flat Package
- Publication number 20100140761
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Quad Flat Package
- Publication number 20100144100
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE
- Publication number 20100078794
- Publication date Apr 1, 2010
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20080067658
- Publication date Mar 20, 2008
- STATS ChipPAC, Inc.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE
- Publication number 20080042265
- Publication date Feb 21, 2008
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT PACKAGE
- Publication number 20080036051
- Publication date Feb 14, 2008
- Emmanuel A. Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080029905
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Leo A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER
- Publication number 20070235859
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
- Publication number 20070210432
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Philip Lyndon Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210436
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader anchoring and grounding method and thermally enhanced...
- Publication number 20040180525
- Publication date Sep 16, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader anchoring & grounding method & thermally enhanced PBG...
- Publication number 20030138994
- Publication date Jul 24, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Leo A. Merilo

Person

Patents Grantslast 30 patents

Chip scale module package in BGA semiconductor package

Integrated circuit package system with heatspreader

Integrated circuit package system having interconnect stack and ext...

Method of forming quad flat package

Quad flat package

Stacked integrated circuits package system with passive components

Stacked die semiconductor device having circuit tape

Quad flat package

Stacked die semiconductor device having circuit tape

Integrated circuit package-in-package system

Heat spreader anchoring and grounding method and thermally enhanced...

Heat spreader anchoring &#x00026; grounding method &#x00026; therma...

Patents Applicationslast 30 patents

Chip Scale Module Package in BGA Semiconductor Package

Quad Flat Package

Method of Forming Quad Flat Package

STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE

STACKED DIE SEMICONDUCTOR PACKAGE

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

QUAD FLAT PACKAGE

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS

INTEGRATED CIRCUIT PACKAGE SYSTEM

Heat spreader anchoring and grounding method and thermally enhanced...

Heat spreader anchoring & grounding method & thermally enhanced PBG...

Heat spreader anchoring & grounding method & therma...