Lim Thiam Chye

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming integrated circuit packages
- Patent number 8,709,866
- Issue date Apr 29, 2014
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 8,531,031
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit packages, and methods of asse...
- Patent number 7,977,157
- Issue date Jul 12, 2011
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of assembling integrated circuit packages
- Patent number 7,700,406
- Issue date Apr 20, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 7,573,136
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling semiconductor devices and interposers
- Patent number 7,528,007
- Issue date May 5, 2009
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Invertible microfeature device packages
- Patent number 7,368,810
- Issue date May 6, 2008
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) grid array package, method of making and me...
- Patent number 7,279,780
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
- Patent number 7,274,095
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling multiple semiconductor devices
- Patent number 7,198,980
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and other carriers including a slot with laterally rece...
- Patent number 7,112,876
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad flat no lead (QFN) grid array package
- Patent number 7,109,572
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) grid array package, method of making and me...
- Patent number 7,075,816
- Issue date Jul 11, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead (QFN) grid array package, method of making and me...
- Patent number 6,967,125
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic component assemblies
- Patent number 6,951,982
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Lim Thiam Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,951,777
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods of forming same
- Patent number 6,943,450
- Issue date Sep 13, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 6,906,415
- Issue date Jun 14, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods of forming same
- Patent number 6,876,066
- Issue date Apr 5, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with a lateral recess in a slot to facilitate connection...
- Patent number 6,870,247
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wire bonded microelectronic device assemblies
- Patent number 6,864,166
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Leng Nam Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package
- Patent number 6,825,572
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,773,960
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wire bonded microelectronic device assemblies
- Patent number 6,650,013
- Issue date Nov 18, 2003
- Micron Technology, Inc.
- Leng Nam Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,617,201
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,486,536
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packages, Methods of Forming Integrated Circuit...
- Publication number 20130330882
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages
- Publication number 20110233745
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuit Packages, and Methods of Asse...
- Publication number 20100151630
- Publication date Jun 17, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages, Methods of Forming Integrated Circuit...
- Publication number 20080284000
- Publication date Nov 20, 2008
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Invertible microfeature device packages and associated methods
- Publication number 20060035503
- Publication date Feb 16, 2006
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposers and other carriers including a slot with laterally rece...
- Publication number 20060006513
- Publication date Jan 12, 2006
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20050285241
- Publication date Dec 29, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20050218518
- Publication date Oct 6, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Invertible microfeature device packages and associated methods
- Publication number 20050046000
- Publication date Mar 3, 2005
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of forming same
- Publication number 20050023655
- Publication date Feb 3, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20040217459
- Publication date Nov 4, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20040203191
- Publication date Oct 14, 2004
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20040114426
- Publication date Jun 17, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling multiple semiconductor devices
- Publication number 20040106229
- Publication date Jun 3, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic component assemblies
- Publication number 20040100772
- Publication date May 27, 2004
- Lim Thiam Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20040080030
- Publication date Apr 29, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20030230801
- Publication date Dec 18, 2003
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20030176045
- Publication date Sep 18, 2003
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no lead (QFN) grid array package, method of making and me...
- Publication number 20030164554
- Publication date Sep 4, 2003
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package
- Publication number 20030107138
- Publication date Jun 12, 2003
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonded microelectronic device assemblies and methods of manufa...
- Publication number 20030049882
- Publication date Mar 13, 2003
- Leng Nam Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS OF FORMING SAME
- Publication number 20030042581
- Publication date Mar 6, 2003
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-shape tape for BOC FBGA package to improve moldability
- Publication number 20030025185
- Publication date Feb 6, 2003
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer, packages including the interposer, and methods
- Publication number 20020167092
- Publication date Nov 14, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Lim Thiam Chye

Person

Patents Grantslast 30 patents

Methods of forming integrated circuit packages

Integrated circuit packages

Methods of forming integrated circuit packages, and methods of asse...

Methods of assembling integrated circuit packages

Semiconductor device assemblies and packages including multiple sem...

Methods for assembling semiconductor devices and interposers

Invertible microfeature device packages

Quad flat no-lead (QFN) grid array package, method of making and me...

Interposers with receptacles for receiving semiconductor devices an...

Methods for assembling multiple semiconductor devices

Interposers and other carriers including a slot with laterally rece...

Quad flat no lead (QFN) grid array package

Quad flat no-lead (QFN) grid array package, method of making and me...

Quad flat no lead (QFN) grid array package, method of making and me...

Packaged microelectronic component assemblies

Methods for forming a slot with a laterally recessed area at an end...

Packaged microelectronic devices and methods of forming same

Semiconductor device assemblies and packages including multiple sem...

Packaged microelectronic devices and methods of forming same

Interposer with a lateral recess in a slot to facilitate connection...

Method of manufacturing wire bonded microelectronic device assemblies

Die package

Methods for forming a slot with a laterally recessed area at an end...

Ball grid array interposer, packages and methods

Method of manufacturing wire bonded microelectronic device assemblies

U-shape tape for BOC FBGA package to improve moldability

U-shape tape for BOC FBGA package to improve moldability

Patents Applicationslast 30 patents

Integrated Circuit Packages, Methods of Forming Integrated Circuit...

Integrated Circuit Packages

Methods of Forming Integrated Circuit Packages, and Methods of Asse...

Integrated Circuit Packages, Methods of Forming Integrated Circuit...

Methods for assembling semiconductor devices and interposers

Invertible microfeature device packages and associated methods

Interposers and other carriers including a slot with laterally rece...

Quad flat no-lead (QFN) grid array package, method of making and me...

Semiconductor device assemblies and packages including multiple sem...

Invertible microfeature device packages and associated methods

Packaged microelectronic devices and methods of forming same

Ball grid array interposer, packages and methods

Methods for forming a slot with a laterally recessed area at an end...

Quad flat no-lead (QFN) grid array package, method of making and me...

Methods for assembling multiple semiconductor devices

Packaged microelectronic component assemblies

Quad flat no-lead (QFN) grid array package, method of making and me...

Semiconductor device assemblies and packages including multiple sem...

Methods for forming a slot with a laterally recessed area at an end...

Quad flat no lead (QFN) grid array package, method of making and me...

Die package

Wire bonded microelectronic device assemblies and methods of manufa...

PACKAGED MICROELECTRONIC DEVICES AND METHODS OF FORMING SAME

U-shape tape for BOC FBGA package to improve moldability

Interposer, packages including the interposer, and methods

Ball grid array interposer, packages and methods