Lin-Yun Wu

Person

chutung, Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Non-contact method to monitor and quantify effective work function...
- Patent number 10,763,179
- Issue date Sep 1, 2020
- SEMILAB Semiconductor Physics Laboratory Co., Ltd.
- Dmitriy Marinskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD metal seed layer
- Patent number 10,276,397
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Ling Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition method for manufacturing semiconductor stru...
- Patent number 10,269,560
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Tzu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up PEALD proces
- Patent number 10,121,653
- Issue date Nov 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solid precursor delivery method using liquid solvent for thin film...
- Patent number 9,869,018
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chieh Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ charging neutralization
- Patent number 9,530,617
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacuturing method of the same
- Patent number 9,331,168
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Su-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up PEALD process
- Patent number 9,184,045
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lin-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor big via bonding pad application for AICu process
- Patent number 8,680,635
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating metal hard masks
- Patent number 8,623,468
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Horng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMOS image sensor big via bonding pad application for AlCu Process
- Patent number 8,502,335
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor big via bonding pad application for AICu process
- Patent number 8,344,471
- Issue date Jan 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer having batch and non-batch layers
- Patent number 7,767,590
- Issue date Aug 3, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer for semiconductor device and fabrication method the...
- Patent number 7,220,650
- Issue date May 22, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rong-Hui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer having batch and non-batch layers
- Patent number 7,091,098
- Issue date Aug 15, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic fabrication having edge passivated bond pad integra...
- Patent number 7,067,896
- Issue date Jun 27, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Juei-Kuo Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate insulator pre-clean procedure
- Patent number 6,818,565
- Issue date Nov 16, 2004
- Taiwan Semiconductor Manufacturing Company
- Yeuh-Mao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable threshold voltage of a thick field oxide ESD protection dev...
- Patent number 6,717,220
- Issue date Apr 6, 2004
- Taiwan Semiconductor Manufacturing Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor by using tunneling diode
- Patent number 6,693,317
- Issue date Feb 17, 2004
- Taiwan Semiconductor Manufacturing Company
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation and planarization process for flip chip packages
- Patent number 6,667,230
- Issue date Dec 23, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Dian-Hau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating borderless contact using graded-stair etch st...
- Patent number 6,635,576
- Issue date Oct 21, 2003
- Taiwan Semiconductor Manufacturing Company
- Meng-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic substrate-coupled electrostatic discharging protection circuit
- Patent number 6,611,028
- Issue date Aug 26, 2003
- Taiwan Semiconductor Manufacturing Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a tunneling diode in optical sensing devices
- Patent number 6,582,981
- Issue date Jun 24, 2003
- Taiwan Semiconductor Manufacturing Company
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a capping layer to reduce particle evolution during sputter...
- Patent number 6,531,382
- Issue date Mar 11, 2003
- Taiwan Semiconductor Manufacturing Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic substrate-coupled electrostatic discharging protection circuit
- Patent number 6,479,872
- Issue date Nov 12, 2002
- Taiwan Semiconductor Manufacturing Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RPO process for selective CoSix formation
- Patent number 6,468,904
- Issue date Oct 22, 2002
- Taiwan Semiconductor Manufacturing Company
- Dian-Hau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable threshold voltage of a thick field oxide ESD protection dev...
- Patent number 6,465,308
- Issue date Oct 15, 2002
- Taiwan Semiconductor Manufacturing Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of overlay measurement in both X and Y directions for photo...
- Patent number 6,362,491
- Issue date Mar 26, 2002
- Taiwan Semiconductor Manufacturing Company
- Jen-Pan Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuit having selectivity deposited silicon oxide space...
- Patent number 6,329,717
- Issue date Dec 11, 2001
- Taiwan Semiconductor Manufacturing Company
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a surface implant region on a ROM cell using a PL...
- Patent number 6,297,102
- Issue date Oct 2, 2001
- Taiwan Semiconductor Manufacturing Company
- Jyh-Cheng You
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER DEPOSITION METHOD FOR MANUFACTURING SEMICONDUCTOR STRU...
- Publication number 20170365483
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YUN-TZU CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid Precursor Delivery Method Using Liquid Solvent for Thin Film...
- Publication number 20170306485
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Chieh Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CVD METAL SEED LAYER
- Publication number 20170005038
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Ya-Ling Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTACT METHOD TO MONITOR AND QUANTIFY EFFECTIVE WORK FUNCTION...
- Publication number 20160252565
- Publication date Sep 1, 2016
- Semilab SDI LLC
- Dmitriy Marinskiy
- G01 - MEASURING TESTING
Information Patent Application
BOTTOM-UP PEALD PROCESS
- Publication number 20160013043
- Publication date Jan 14, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Lin-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACUTURING METHOD OF THE SAME
- Publication number 20150206951
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- SU-HORNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-Up PEALD Process
- Publication number 20140227861
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Lin-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Charging Neutralization
- Publication number 20140210506
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Lin-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FABRICATION
- Publication number 20130174982
- Publication date Jul 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Horng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CMOS Image Sensor Big Via Bonding Pad Application for AICu Process
- Publication number 20130134543
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AICu PROCESS
- Publication number 20110024866
- Publication date Feb 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AlCu PROCESS
- Publication number 20110024867
- Publication date Feb 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Spacer Having Batch and Non-Batch Layers
- Publication number 20060252274
- Publication date Nov 9, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing isolation structures in a semiconductor de...
- Publication number 20050277262
- Publication date Dec 15, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Sheng Tsao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor device with spacer having batch and non-batch layers
- Publication number 20050227468
- Publication date Oct 13, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall spacer for semiconductor device and fabrication method the...
- Publication number 20050227446
- Publication date Oct 13, 2005
- Rong-Hui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for implementing poly pre-doping in deep sub-micron process
- Publication number 20050118802
- Publication date Jun 2, 2005
- Chang-Sheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic fabrication having edge passivated bond pad integra...
- Publication number 20040089916
- Publication date May 13, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Juei-Kuo Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel optical sensor by using tunneling diode
- Publication number 20030203525
- Publication date Oct 30, 2003
- TAIWAN SEIMICONDUCTOR MANUFACTURING COMPANY
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic substrate-coupled electrostatic discharging protection circuit
- Publication number 20030047787
- Publication date Mar 13, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable threshold voltage of a thick field oxide ESD protection dev...
- Publication number 20030017673
- Publication date Jan 23, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation and planarization process for flip chip packages
- Publication number 20030013291
- Publication date Jan 16, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dian-Hau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel optical sensor by using tunneling diode
- Publication number 20010039067
- Publication date Nov 8, 2001
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Non-contact method to monitor and quantify effective work function...

CVD metal seed layer

Atomic layer deposition method for manufacturing semiconductor stru...

Bottom-up PEALD proces

Solid precursor delivery method using liquid solvent for thin film...

In-situ charging neutralization

Semiconductor structure and manufacuturing method of the same

Bottom-up PEALD process

CMOS image sensor big via bonding pad application for AICu process

Methods of fabricating metal hard masks

CMOS image sensor big via bonding pad application for AlCu Process

CMOS image sensor big via bonding pad application for AICu process

Semiconductor device with spacer having batch and non-batch layers

Sidewall spacer for semiconductor device and fabrication method the...

Semiconductor device with spacer having batch and non-batch layers

Microelectronic fabrication having edge passivated bond pad integra...

Gate insulator pre-clean procedure

Tunable threshold voltage of a thick field oxide ESD protection dev...

Optical sensor by using tunneling diode

Passivation and planarization process for flip chip packages

Method of fabricating borderless contact using graded-stair etch st...

Dynamic substrate-coupled electrostatic discharging protection circuit

Method of using a tunneling diode in optical sensing devices

Use of a capping layer to reduce particle evolution during sputter...

Dynamic substrate-coupled electrostatic discharging protection circuit

RPO process for selective CoSix formation

Tunable threshold voltage of a thick field oxide ESD protection dev...

Method of overlay measurement in both X and Y directions for photo...

Integrated circuit having selectivity deposited silicon oxide space...

Method of forming a surface implant region on a ROM cell using a PL...

Patents Applicationslast 30 patents

ATOMIC LAYER DEPOSITION METHOD FOR MANUFACTURING SEMICONDUCTOR STRU...

Solid Precursor Delivery Method Using Liquid Solvent for Thin Film...

CVD METAL SEED LAYER

NON-CONTACT METHOD TO MONITOR AND QUANTIFY EFFECTIVE WORK FUNCTION...

BOTTOM-UP PEALD PROCESS

SEMICONDUCTOR STRUCTURE AND MANUFACUTURING METHOD OF THE SAME

Bottom-Up PEALD Process

In-Situ Charging Neutralization

METAL HARD MASK FABRICATION

CMOS Image Sensor Big Via Bonding Pad Application for AICu Process

CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AICu PROCESS

CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AlCu PROCESS

Semiconductor Device with Spacer Having Batch and Non-Batch Layers

Method for manufacturing isolation structures in a semiconductor de...

Semiconductor device with spacer having batch and non-batch layers

Sidewall spacer for semiconductor device and fabrication method the...

Method for implementing poly pre-doping in deep sub-micron process

Microelectronic fabrication having edge passivated bond pad integra...

Novel optical sensor by using tunneling diode

Dynamic substrate-coupled electrostatic discharging protection circuit

Tunable threshold voltage of a thick field oxide ESD protection dev...

Passivation and planarization process for flip chip packages

Novel optical sensor by using tunneling diode