Lisa J. Jimarez

Person

Newark Valley, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Z interconnect structure and method
- Patent number 7,718,902
- Issue date May 18, 2010
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing Z-axis interconnection assembly of printed wir...
- Patent number 7,303,639
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 7,278,207
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 6,969,436
- Issue date Nov 29, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 6,961,995
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 6,836,015
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Monty M. Denneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of chip carrier flexing during thermal cycling
- Patent number 6,818,972
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z interconnect structure and method
- Patent number 6,805,280
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly
- Patent number 6,757,967
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal backed printed circuit board assemblies
- Patent number 6,734,368
- Issue date May 11, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance packaging platform and method of making same
- Patent number 6,639,155
- Issue date Oct 28, 2003
- International Business Machines Corporation
- James R. Bupp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 6,638,607
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduction of chip carrier flexing during thermal cycling
- Patent number 6,528,179
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a conformal chip carrier to a flip chip
- Patent number 6,524,888
- Issue date Feb 25, 2003
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid surface mount and pin thru hole circuit board
- Patent number 6,521,842
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Mark R. Brinthaupt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit chip carrier assembly
- Patent number 6,503,821
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface metal balancing to reduce chip carrier flexing
- Patent number 6,497,943
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant layer for encapsulated columns
- Patent number 6,486,415
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/C chip assembly
- Patent number 6,407,334
- Issue date Jun 18, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of heat treating and annealing CIC and CIC created thereby
- Patent number 6,355,364
- Issue date Mar 12, 2002
- International Business Machines Corporation
- Robert M. Japp
- C21 - METALLURGY OF IRON
Information Patent Grant
Fixture for attaching a conformal chip carrier to a flip chip
- Patent number 6,337,509
- Issue date Jan 8, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip carrier assembly comprising a stiffener att...
- Patent number 6,329,713
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bonding design and method for aluminum backed circuits
- Patent number 6,178,630
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Lisa Jeanine Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for insulating moisture sensitive PBGA's
- Patent number 6,059,170
- Issue date May 9, 2000
- International Business Machines Corporation
- Lisa J. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance electrical cable and method of manufacture
- Patent number 5,993,579
- Issue date Nov 30, 1999
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching of nickle/iron alloys
- Patent number 5,989,443
- Issue date Nov 23, 1999
- International Business Machines Corporation
- Kathleen Lorraine Covert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive bonding design for metal backed circuits
- Patent number 5,920,037
- Issue date Jul 6, 1999
- International Business Machines Corporation
- Lisa Jeanine Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of solder removal
- Patent number 5,909,838
- Issue date Jun 8, 1999
- Lisa Jeanine Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance electrical cable
- Patent number 5,847,324
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching of nickle/iron alloys
- Patent number 5,723,062
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Kathleen Lorraine Covert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of making an electronic package
- Publication number 20070278654
- Publication date Dec 6, 2007
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing Z-axis interconnection assembly of printed wir...
- Publication number 20050280136
- Publication date Dec 22, 2005
- International Business Machines Corporation
- Brian E. Curcio
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of making an electronic package
- Publication number 20050250249
- Publication date Nov 10, 2005
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Z interconnect structure and method
- Publication number 20050051608
- Publication date Mar 10, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS
- Publication number 20040217464
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Monty M. Denneau
- G02 - OPTICS
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20040084137
- Publication date May 6, 2004
- International Business Machines Corporation
- Brian E. Curcio
- B32 - LAYERED PRODUCTS
Information Patent Application
Z interconnect structure and method
- Publication number 20030127247
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction of chip carrier flexing during thermal cycling
- Publication number 20030034566
- Publication date Feb 20, 2003
- Lisa J. Jimarez
- B32 - LAYERED PRODUCTS
Information Patent Application
Compliant layer for encapsulated columns
- Publication number 20030020150
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SURFACE MOUNT AND PIN THRU HOLE CIRCUIT BOARD
- Publication number 20030006061
- Publication date Jan 9, 2003
- International Business Machines Corporation
- Mark R. Brinthaupt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
I/C chip assembly and method of forming same
- Publication number 20020108768
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for assembling a conformal chip carrier to a f...
- Publication number 20020096746
- Publication date Jul 25, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated cloumns
- Publication number 20020092676
- Publication date Jul 18, 2002
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/C CHIP ASSEMBLY
- Publication number 20020062970
- Publication date May 30, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit chip carrier assembly
- Publication number 20020038913
- Publication date Apr 4, 2002
- Donald S. Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...
- Publication number 20010019174
- Publication date Sep 6, 2001
- DAVID N. COKELY
- H01 - BASIC ELECTRIC ELEMENTS

Lisa J. Jimarez

Person

Patents Grantslast 30 patents

Z interconnect structure and method

Method for producing Z-axis interconnection assembly of printed wir...

Method of making an electronic package

Method and structure for producing Z-axis interconnection assembly...

Method of making an electronic package

Optical assemblies for transmitting and manipulating optical beams

Reduction of chip carrier flexing during thermal cycling

Z interconnect structure and method

Method of forming a chip assembly

Metal backed printed circuit board assemblies

High performance packaging platform and method of making same

Method and structure for producing Z-axis interconnection assembly...

Reduction of chip carrier flexing during thermal cycling

Method of attaching a conformal chip carrier to a flip chip

Hybrid surface mount and pin thru hole circuit board

Integrated circuit chip carrier assembly

Surface metal balancing to reduce chip carrier flexing

Compliant layer for encapsulated columns

I/C chip assembly

Process of heat treating and annealing CIC and CIC created thereby

Fixture for attaching a conformal chip carrier to a flip chip

Integrated circuit chip carrier assembly comprising a stiffener att...

Conductive bonding design and method for aluminum backed circuits

Method and apparatus for insulating moisture sensitive PBGA's

High performance electrical cable and method of manufacture

Selective etching of nickle/iron alloys

Conductive bonding design for metal backed circuits

Method of solder removal

High performance electrical cable

Selective etching of nickle/iron alloys

Patents Applicationslast 30 patents

Method of making an electronic package

Method for producing Z-axis interconnection assembly of printed wir...

Method of making an electronic package

Z interconnect structure and method

OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS

Method and structure for producing Z-axis interconnection assembly...

Z interconnect structure and method

Reduction of chip carrier flexing during thermal cycling

Compliant layer for encapsulated columns

HYBRID SURFACE MOUNT AND PIN THRU HOLE CIRCUIT BOARD

I/C chip assembly and method of forming same

Method and apparatus for assembling a conformal chip carrier to a f...

Compliant layer for encapsulated cloumns

I/C CHIP ASSEMBLY

Integrated circuit chip carrier assembly

METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...