This application is a divisional of application Ser. No. 08/855,812 filed on May 12, 1997.
Number | Name | Date | Kind |
---|---|---|---|
3911169 | Lesaicherre et al. | Oct 1975 | |
4554033 | Dery et al. | Nov 1985 | |
4616413 | Iliou et al. | Oct 1986 | |
4695515 | Shirai et al. | Sep 1987 | |
4727168 | Yoshino et al. | Feb 1988 | |
4729809 | Dery et al. | Mar 1988 | |
4770953 | Horiguchi et al. | Sep 1988 | |
4851615 | Butt | Jul 1989 | |
4963425 | Buchanan et al. | Oct 1990 | |
4976990 | Bach et al. | Dec 1990 | |
5021296 | Suzuki et al. | Jun 1991 | |
5068714 | Seipler | Nov 1991 | |
5112395 | Ngo | May 1992 | |
5172301 | Schneider | Dec 1992 | |
5180625 | Wang et al. | Jan 1993 | |
5210941 | Turek et al. | May 1993 | |
5221399 | Sanborn et al. | Jun 1993 | |
5302492 | Ott et al. | Apr 1994 | |
5312520 | Chung | May 1994 | |
5328087 | Nelson et al. | Jul 1994 | |
5355280 | Rothlingshofer et al. | Oct 1994 | |
5362421 | Kropp et al. | Nov 1994 | |
5366027 | Turek et al. | Nov 1994 | |
5432303 | Turek et al. | Jul 1995 | |
5448020 | Pendse | Sep 1995 | |
5455738 | Montesano et al. | Oct 1995 | |
5490895 | Wang et al. | Feb 1996 | |
5538789 | Capote et al. | Jul 1996 | |
5565267 | Capote et al. | Oct 1996 | |
5741430 | Dahringer et al. | Apr 1998 |
Number | Date | Country |
---|---|---|
54-081353 | Jun 1979 | JP |
Entry |
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Handbook of Surface Preparation, by Richard C. Snogren, pp. 288-290, 1974. |
Modelling and Measurements of Adhesive Strength of Thermal Coatings, by S. Amanda, H. Yamada, S. Yematsu, and Y. Saotome, presented at the International Thermal Spray Conference and Exposition, Orlando, Florida, pp. 915-920, May 28, 1992. |
Process and Performance Advancements in Conductive Bonding of Circuit Cards to Aluminum Thick Metal Backers. Donald Farqunar, Michael Klodowski, Andy Seman and David Light, Sep. 29, 1996. |
Methods To Electrically Connect A1 Heat Sinks To Semiconductor Chip Packages—IBM Technical Disclosure Bulletin vol. 35 No. 1A Jun. 1992. |
Process for Improved Photoresist to Polyimide Adhesion-Reproduced from Research Disclosure, Dec. 1989, No. 308—Kenneth Mason Publications, Ltd. England. |
Process for Enchanced Polyimide Adhesion—Reproduced from Research Disclosure, Feb. 1986, No. 262—Kenneth Mason Publications Ltd. England. |