Lyndon W. Graham

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature annealing of metallization micro-structu...
- Patent number 7,462,269
- Issue date Dec 9, 2008
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platinum alloy using electrochemical deposition
- Patent number 7,300,562
- Issue date Nov 27, 2007
- Semitool, Inc.
- Zhongmin Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for filling recessed micro-structures with metallization in...
- Patent number 7,244,677
- Issue date Jul 17, 2007
- Semitool Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling and/or measuring additive concentration i...
- Patent number 7,229,543
- Issue date Jun 12, 2007
- Semitool, Inc.
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Grant
Method of submicron metallization using electrochemical deposition...
- Patent number 7,144,805
- Issue date Dec 5, 2006
- Semitool, Inc.
- LinLin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying metal features onto barrier layers using electr...
- Patent number 7,135,404
- Issue date Nov 14, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for low-temperature annealing of metallization...
- Patent number 7,001,471
- Issue date Feb 21, 2006
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for low temperature annealing of metallization...
- Patent number 6,994,776
- Issue date Feb 7, 2006
- Semitool Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling and/or measuring additive concentration in...
- Patent number RE38931
- Issue date Jan 10, 2006
- Semitool, Inc.
- Lyndon W. Graham
- 205 - Electrolysis: processes, compositions used therein, and methods of prep...
Information Patent Grant
Electroplating system having auxiliary electrode exterior to main r...
- Patent number 6,921,468
- Issue date Jul 26, 2005
- Semitool, Inc.
- Lyndon W. Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated chemical management system executing improved electrolyte...
- Patent number 6,899,805
- Issue date May 31, 2005
- Semitool, Inc.
- LinLin Chen
- G01 - MEASURING TESTING
Information Patent Grant
Automated chemical management system having improved analysis unit
- Patent number 6,814,855
- Issue date Nov 9, 2004
- Semitool, Inc.
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Grant
Submicron metallization using electrochemical deposition
- Patent number 6,806,186
- Issue date Oct 19, 2004
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed micro-structures with metallization in...
- Patent number 6,753,251
- Issue date Jun 22, 2004
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating system workpiece support having workpiece engaging electrode
- Patent number 6,663,762
- Issue date Dec 16, 2003
- Semitool, Inc.
- Martin C. Bleck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ cleaning processes for semiconductor electroplating electrodes
- Patent number 6,599,412
- Issue date Jul 29, 2003
- Semitool, Inc.
- Lyndon W. Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling and/or measuring additive concentration i...
- Patent number 6,551,479
- Issue date Apr 22, 2003
- Semitool, Inc.
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for low-temperature annealing of metallization microstruc...
- Patent number 6,508,920
- Issue date Jan 21, 2003
- Semitool, Inc.
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling and/or measuring additive concentration in...
- Patent number 6,365,033
- Issue date Apr 2, 2002
- Semitoof, Inc.
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Grant
Plating system workpiece support having workpiece-engaging electrod...
- Patent number 6,358,388
- Issue date Mar 19, 2002
- Semitool, Inc.
- Martin C. Bleck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating system having auxiliary electrode exterior to main r...
- Patent number 6,270,647
- Issue date Aug 7, 2001
- Semitool, Inc.
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor plating bowl and method using anode shield
- Patent number 6,099,712
- Issue date Aug 8, 2000
- Semitool, Inc.
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor plating system workpiece support having workpiece eng...
- Patent number 5,985,126
- Issue date Nov 16, 1999
- Semitool, Inc.
- Martin C. Bleck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU CLEANING PROCESSES FOR SEMICONDUCTOR ELECTROPLATING ELECTRODES
- Publication number 20070215481
- Publication date Sep 20, 2007
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for filling recessed micro-structures with metallization in...
- Publication number 20070114133
- Publication date May 24, 2007
- Semitool, Inc.
- Thomas Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for filling recessed micro-structures with metallization in...
- Publication number 20060208272
- Publication date Sep 21, 2006
- Semitool, Inc.
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060084264
- Publication date Apr 20, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079083
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079085
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto metallized layers using ele...
- Publication number 20060079084
- Publication date Apr 13, 2006
- Semitool, Inc.
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor plating system workpiece support having workpiece-eng...
- Publication number 20050061675
- Publication date Mar 24, 2005
- Martin C. Bleck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of submicron metallization using electrochemical deposition...
- Publication number 20050051436
- Publication date Mar 10, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method, chemistry, and apparatus for noble metal electroplating on...
- Publication number 20050000818
- Publication date Jan 6, 2005
- Semitool, Inc.
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and methods for transferring heat during chemical process...
- Publication number 20040108212
- Publication date Jun 10, 2004
- Lyndon Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for applying metal features onto barrier layers using electr...
- Publication number 20040072419
- Publication date Apr 15, 2004
- Rajesh Baskaran
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Platinum alloy using electrochemical deposition
- Publication number 20040055895
- Publication date Mar 25, 2004
- Semitool, Inc.
- Zhongmin Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
In-situ cleaning processes for semiconductor electroplating electrodes
- Publication number 20030201190
- Publication date Oct 30, 2003
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for controlling and/or measuring additive concentration i...
- Publication number 20030173224
- Publication date Sep 18, 2003
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Application
Method for filling recessed micro-structures with metallization in...
- Publication number 20030045095
- Publication date Mar 6, 2003
- Semitool, Inc.
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating system workpiece support having workpiece engaging electrode
- Publication number 20020148734
- Publication date Oct 17, 2002
- Martin C. Bleck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automated chemical management system having improved analysis unit
- Publication number 20020112970
- Publication date Aug 22, 2002
- Lyndon W. Graham
- G01 - MEASURING TESTING
Information Patent Application
Method for filling recessed micro-structures with metallization in...
- Publication number 20020102837
- Publication date Aug 1, 2002
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Automated chemical management system executing improved electrolyte...
- Publication number 20020084195
- Publication date Jul 4, 2002
- Linlin Chen
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for low temperature annealing of metallization...
- Publication number 20020074233
- Publication date Jun 20, 2002
- Semitool, Inc.
- Thomas L. Ritzdorf
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating system having auxiliary electrode exterior to main r...
- Publication number 20020046952
- Publication date Apr 25, 2002
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for low temperature annealing of metallization...
- Publication number 20020037641
- Publication date Mar 28, 2002
- Thomas L. Ritzdorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED MICRO-STRUCTURES WITH METALLIZATION IN...
- Publication number 20020022363
- Publication date Feb 21, 2002
- THOMAS L. RITZDORF
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating system having auxiliary electrode exterior to main r...
- Publication number 20020017456
- Publication date Feb 14, 2002
- Lyndon W. Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Submicron metallization using electrochemical deposition
- Publication number 20020004301
- Publication date Jan 10, 2002
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD, CHEMISTRY, AND APPARATUS FOR NOBLE METAL ELECTROPLATING ON...
- Publication number 20020000380
- Publication date Jan 3, 2002
- LYNDON W. GRAHAM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR LOW-TEMPERATURE ANNEALING OF METALLIZATION...
- Publication number 20020000271
- Publication date Jan 3, 2002
- Semitool, Inc.
- THOMAS RITZDORF
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods and apparatus for controlling and/or measuring additive con...
- Publication number 20010045356
- Publication date Nov 29, 2001
- Lyndon W. Graham
- G01 - MEASURING TESTING

Lyndon W. Graham

Person

Patents Grantslast 30 patents

Method for low temperature annealing of metallization micro-structu...

Platinum alloy using electrochemical deposition

Method for filling recessed micro-structures with metallization in...

Apparatus for controlling and/or measuring additive concentration i...

Method of submicron metallization using electrochemical deposition...

Method for applying metal features onto barrier layers using electr...

Method and apparatus for low-temperature annealing of metallization...

Method and apparatus for low temperature annealing of metallization...

Methods for controlling and/or measuring additive concentration in...

Electroplating system having auxiliary electrode exterior to main r...

Automated chemical management system executing improved electrolyte...

Automated chemical management system having improved analysis unit

Submicron metallization using electrochemical deposition

Method for filling recessed micro-structures with metallization in...

Plating system workpiece support having workpiece engaging electrode

In-situ cleaning processes for semiconductor electroplating electrodes

Apparatus for controlling and/or measuring additive concentration i...

Apparatus for low-temperature annealing of metallization microstruc...

Methods for controlling and/or measuring additive concentration in...

Plating system workpiece support having workpiece-engaging electrod...

Electroplating system having auxiliary electrode exterior to main r...

Semiconductor plating bowl and method using anode shield

Semiconductor plating system workpiece support having workpiece eng...

Patents Applicationslast 30 patents

IN-SITU CLEANING PROCESSES FOR SEMICONDUCTOR ELECTROPLATING ELECTRODES

Method for filling recessed micro-structures with metallization in...

Method for filling recessed micro-structures with metallization in...

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Method for applying metal features onto metallized layers using ele...

Semiconductor plating system workpiece support having workpiece-eng...

Method of submicron metallization using electrochemical deposition...

Method, chemistry, and apparatus for noble metal electroplating on...

Apparatus and methods for transferring heat during chemical process...

Method for applying metal features onto barrier layers using electr...

Platinum alloy using electrochemical deposition

In-situ cleaning processes for semiconductor electroplating electrodes

Apparatus for controlling and/or measuring additive concentration i...

Method for filling recessed micro-structures with metallization in...

Plating system workpiece support having workpiece engaging electrode

Automated chemical management system having improved analysis unit

Method for filling recessed micro-structures with metallization in...

Automated chemical management system executing improved electrolyte...

Method and apparatus for low temperature annealing of metallization...

Electroplating system having auxiliary electrode exterior to main r...

Method and apparatus for low temperature annealing of metallization...

METHOD FOR FILLING RECESSED MICRO-STRUCTURES WITH METALLIZATION IN...

Electroplating system having auxiliary electrode exterior to main r...

Submicron metallization using electrochemical deposition

METHOD, CHEMISTRY, AND APPARATUS FOR NOBLE METAL ELECTROPLATING ON...

METHOD AND APPARATUS FOR LOW-TEMPERATURE ANNEALING OF METALLIZATION...

Methods and apparatus for controlling and/or measuring additive con...