Ma Yiyi

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 9,824,924
- Issue date Nov 21, 2017
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit device with shaped leads and method of forming t...
- Patent number 9,679,870
- Issue date Jun 13, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package (WLCSP) having edge protection
- Patent number 9,576,912
- Issue date Feb 21, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic device including two-step encapsulat...
- Patent number 9,379,034
- Issue date Jun 28, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for packaging integrated circuits
- Patent number 8,907,465
- Issue date Dec 9, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermally enhanced expanded wafer level package ball grid array str...
- Patent number 8,497,587
- Issue date Jul 30, 2013
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20180040514
- Publication date Feb 8, 2018
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
- Publication number 20160293512
- Publication date Oct 6, 2016
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...
- Publication number 20160190029
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...
- Publication number 20160172262
- Publication date Jun 16, 2016
- STMicroelectronics Pte Ltd
- Yiyi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150084171
- Publication date Mar 26, 2015
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20140291782
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
- Publication number 20130093072
- Publication date Apr 18, 2013
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR THERMALLY ENHANCED FLIP-CHIP BALL GRID ARRAY PACKAGE
- Publication number 20130001740
- Publication date Jan 3, 2013
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EXPANDED WAFER LEVEL PACKAGE BALL GRID ARRAY STR...
- Publication number 20110156236
- Publication date Jun 30, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level through-hole plugging using mechanical forming technique
- Publication number 20060009029
- Publication date Jan 12, 2006
- Agency For Science, Technology and Research
- Wong EE Hua
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor packages having an electric device with a recess

Semiconductor packages having an electric device with a recess

Integrated circuit device with shaped leads and method of forming t...

Wafer level chip scale package (WLCSP) having edge protection

Method of making an electronic device including two-step encapsulat...

Methods and devices for packaging integrated circuits

Thermally enhanced expanded wafer level package ball grid array str...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS

METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...

INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...

NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE

HEAT SPREADER FOR THERMALLY ENHANCED FLIP-CHIP BALL GRID ARRAY PACKAGE

THERMALLY ENHANCED EXPANDED WAFER LEVEL PACKAGE BALL GRID ARRAY STR...

Wafer level through-hole plugging using mechanical forming technique