Mahadevan Suryakumar

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coaxial plated through holes (PTH) for robust electrical performance
- Patent number 8,227,706
- Issue date Jul 24, 2012
- Intel Corporation
- Mihir Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Routing configuration for high frequency signals in an integrated c...
- Patent number 7,586,192
- Issue date Sep 8, 2009
- Intel Corporation
- Mahadevan Suryakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate for integrated circuit and method of making the s...
- Patent number 7,152,313
- Issue date Dec 26, 2006
- Intel Corporation
- Dustin P. Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COAXIAL PLATED THROUGH HOLES (PTH) FOR ROBUST ELECTRICAL PERFORMANCE
- Publication number 20130189812
- Publication date Jul 25, 2013
- Mihir Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR M...
- Publication number 20120005887
- Publication date Jan 12, 2012
- Russell Mortensen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20110318850
- Publication date Dec 29, 2011
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL PLATED THROUGH HOLES (PTH) FOR ROBUST ELECTRICAL PERFORMANCE
- Publication number 20100163295
- Publication date Jul 1, 2010
- Mihir Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coreless substrate, method of manufacturing same, and package for m...
- Publication number 20100073894
- Publication date Mar 25, 2010
- Russell Mortensen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Array capacitor for decoupling multiple voltages
- Publication number 20080157313
- Publication date Jul 3, 2008
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing layer count in semiconductor packages
- Publication number 20070231951
- Publication date Oct 4, 2007
- Mahadevan Suryakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing configuration for high frequency signals in an integrated c...
- Publication number 20060208355
- Publication date Sep 21, 2006
- Mahadevan Suryakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate for integrated circuit and method of making the s...
- Publication number 20050111207
- Publication date May 26, 2005
- Dustin P. Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure with increased capacitance and method
- Publication number 20040217469
- Publication date Nov 4, 2004
- Intel Corporation
- Mahadevan Suryakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mahadevan Suryakumar

Person

Patents Grantslast 30 patents

Coaxial plated through holes (PTH) for robust electrical performance

Routing configuration for high frequency signals in an integrated c...

Package substrate for integrated circuit and method of making the s...

Patents Applicationslast 30 patents

COAXIAL PLATED THROUGH HOLES (PTH) FOR ROBUST ELECTRICAL PERFORMANCE

CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR M...

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

COAXIAL PLATED THROUGH HOLES (PTH) FOR ROBUST ELECTRICAL PERFORMANCE

Coreless substrate, method of manufacturing same, and package for m...

Array capacitor for decoupling multiple voltages

Reducing layer count in semiconductor packages

Routing configuration for high frequency signals in an integrated c...

Package substrate for integrated circuit and method of making the s...

Package structure with increased capacitance and method