Mahmoud Dreiza

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,548,221
- Issue date Jan 28, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable variable height via package and method
- Patent number 10,257,942
- Issue date Apr 9, 2019
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 10,206,285
- Issue date Feb 12, 2019
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,034,372
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 9,730,327
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 9,012,789
- Issue date Apr 21, 2015
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 8,704,368
- Issue date Apr 22, 2014
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable protruding via package and method
- Patent number 8,623,753
- Issue date Jan 7, 2014
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable variable height via package and method
- Patent number 8,471,154
- Issue date Jun 25, 2013
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 8,222,538
- Issue date Jul 17, 2012
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package failure prognostic structure and method
- Patent number 8,022,521
- Issue date Sep 20, 2011
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal via heat spreader package and method
- Patent number 7,960,827
- Issue date Jun 14, 2011
- Amkor Technology, Inc.
- August J. Miller, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,691,745
- Issue date Apr 6, 2010
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,652,361
- Issue date Jan 26, 2010
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,429,799
- Issue date Sep 30, 2008
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20200337152
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Mahmoud Dreiza

Person

Patents Grantslast 30 patents

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable variable height via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable protruding via package and method

Stackable variable height via package and method

Stackable via package and method

Package failure prognostic structure and method

Thermal via heat spreader package and method

Land patterns for a semiconductor stacking structure and method the...

Land patterns for a semiconductor stacking structure and method the...

Land patterns for a semiconductor stacking structure and method the...

Patents Applicationslast 30 patents

STACKABLE VIA PACKAGE AND METHOD

STACKABLE VIA PACKAGE AND METHOD

STACKABLE VIA PACKAGE AND METHOD